公开(公告)号：JPH10404A

公开(公告)日：1998-01-06

申请号：JP15130496

申请日：1996-06-12

Applicant: TORAY INDUSTRIES

Inventor： MATSUMAE HIDEYO ,  SEKIDO SHUNEI ,  HANANO TORU

IPC: B05D1/28 ,  B05C1/08 ,  D02J1/18

Abstract: PROBLEM TO BE SOLVED: To sufficiently open a fiber bundle to keep the width thereof by pressing the fiber bundle to the peripheral surface of the non-vibration roller positioned just behind a vibration roller and subsequently bringing the same into contact with the peripheral surface of the non-vibration roller over the contact length specific multiple or more of the fiber length coming into contact with the peripheral surface of the vibration roller. SOLUTION: A reinforcing fiber bundle 2 is unwound so that the tension thereof at a time of unwinding is within a range of 0.1-5N to be passed through vibration rolls 5a, 5b vibrated by vibration sources 4a, 4b and non-vibration rolls 6a, 6b. The vibration rollers 5a, 5b are set to vibration frequency of 1-100Hz and vibration amplitude of 1-50mm (pref. 5-20mm) and vibrates the reinforcing fiber bundle 2 in the direction crossing a fiber rinning direction to open the same. The non-vibration roller 6a, 6b keep and fix the opened width of the fiber bundle 2 opened by the vibration rollers 5a, 5b. The contact lengths of the vibration rollers 5a, 5b and the fiber bundle are compared and the contact length of the non-vibration rollers 6a, 6b and the fiber bundle 2 is set to 2-10 times and, as concrete length, the contact length is pref. 100mm or more.

公开(公告)号：JP2001262443A

公开(公告)日：2001-09-26

申请号：JP2001004599

申请日：2001-01-12

Applicant: TORAY INDUSTRIES

Inventor： MATSUMAE HIDEYO ,  AKASE DAISAKU ,  TSUJI SEIJI ,  OTANI HIROSHI ,  TANAKA SEIJI

IPC: B29B15/08 ,  D02J1/18

Abstract: PROBLEM TO BE SOLVED: To provide a device for opening fiber bundle, which can stably and efficiently open a fiber bundle, even when the fiber bundle to be opened is the so-called high elastic modulus fiber bundle or even when the speed for carrying the fiber bundle is increased, to provide a method of opening the fiber bundle by the use of the fiber-opening device, and to provide a method of producing a prepreg, wherein the prepreg obtained by impregnating the opened fiber bundle with a resin has a higher grade than those of conventional prepregs. SOLUTION: This device for opening fiber bundle comprises a roller group and a substrate which is reciprocated, while the contact with the carried fiber bundle and the separation from the fiber bundle are repeated.

公开(公告)号：JP2000226751A

公开(公告)日：2000-08-15

申请号：JP2723999

申请日：1999-02-04

Applicant: TORAY INDUSTRIES

Inventor： TSUJI SEIJI ,  MATSUMAE HIDEYO ,  OTANI HIROSHI

IPC: B29B15/12 ,  D02J1/18

Abstract: PROBLEM TO BE SOLVED: To enable a uniform and stable opening of fiber bundles in a state scarcely generating fuzz, by giving an opening action to the fiber bundles by the use of a roller vibrated in the direction crossing the longitudinal direction of the fiber bundles and then passing the treated fiber bundle on a non-vibrated rotor. SOLUTION: This method for opening fiber bundles comprises unwinding the reinforcing fiber bundles such as carbon fiber bundles or glass fiber bundles from winding packages 1, guiding the fiber bundles to a heating means 4 through a free rotation roller 3 to thermally soften a sizing agent or the like adhered to the fiber bundles 2, giving an opening action to the treated fiber bundles by the use of a roller 6 vibrated in the direction crossing the longitudinal direction of the fiber bundles 2 through the free roller 5, passing the treated fiber bundles on a non-vibrated rotator 7 to open the fiber bundles 2, and then impregnating the opened fiber bundles 2 with a resin to obtain a prepreg. The non-vibrated rotator 7 has on its outer periphery plural fiber bundle supports 8 extended in the direction crossing the longitudinal direction of the fiber bundles, and is rotated on the axis in a state that the difference between the travel rate of the fiber bundles and the rotation rate of the supports 8 is substantially zero.

公开(公告)号：JPH10292238A

公开(公告)日：1998-11-04

申请号：JP9210197

申请日：1997-04-10

Applicant: TORAY INDUSTRIES

Inventor： AKASE DAISAKU ,  HANANO TORU ,  MATSUMAE HIDEYO

IPC: B29B11/16 ,  D01F9/12 ,  D02J1/18

Abstract: PROBLEM TO BE SOLVED: To provide a device for opening carbon fiber bundles, capable of simply opening the carbon fiber bundles at a high speed without generating fuzzes, to provide a method for opening the carbon fiber bundles, and to provide a method for continuously and stably producing a prepreg from the opened carbon fiber bundles. SOLUTION: In this device, ten or more mutually paralleled carbon fiber bundles are bent at prescribed angles on plural roller groups and simultaneously passed through the roller groups to open the bundles. Therein, two to ten pairs each comprising a vibrated free rotation roll 4 vibrated in the axial direction of the roll and a non-vibrated free rotation roll 5 are arranged, and the diameters of the vibrated free rotation roller 4 and the non-vibrated free rotation roller 5 are set to 20-50 mm and 50-120 mm, respectively. Distances not contacting with the rolls between the rolls are further set to 10-100 mm, respectively.

公开(公告)号：JPH08196980A

公开(公告)日：1996-08-06

申请号：JP1170495

申请日：1995-01-27

Applicant: TORAY INDUSTRIES

Inventor： SEKIDO SHUNEI ,  MATSUMAE HIDEYO

IPC: B05D1/28 ,  B05C1/12

Abstract: PURPOSE: To provide a method and apparatus in which the supply of a synthetic resin liquid to a bundle of fibers is stabilized even for the change of the velocity and tension of threads of the bundle, the high permeability of the resin liquid into the bundle is kept, and the solid in the resin liquid does not precipitate to the bottom of a resin impregnation tank. CONSTITUTION: A bundle 4 of fibers received from a take-up package 1 is impregnated with a synthetic resin liquid 3 applied on the surface of a resin impregnation roll 8, and the bundle 4 impregnated with the resin liquid is received by a receiving means 6 to form a prepreg. During receiving, the relationship between the receiving velocity of the means 6 and the circumferential velocity of the roll 8 is kept to be 0.9

公开(公告)号：JP2002363855A

公开(公告)日：2002-12-18

申请号：JP2001172366

申请日：2001-06-07

Applicant: TORAY INDUSTRIES

Inventor： TSUJI SEIJI ,  AKASE DAISAKU ,  MATSUMAE HIDEYO

IPC: D06C29/00 ,  B65H51/005 ,  C08J5/24

Abstract: PROBLEM TO BE SOLVED: To provide an opening device for fiber bundle which can be stably opened in high efficiency even when fiber bundle to be opened is so called fiber having high elastic modulus or carrying speed in increased and an opening method of fiber bundle utilizing the opening device and a method for producing prepreg by which prepreg obtained by impregnating a resin into opened fiber bundle is nonconventionally upgraded. SOLUTION: This opening device of fiber bundle is constituted of a plurality of rollers for transferring fiber bundle and at least two systems of mechanisms for applying vibration to the fiber bundle by changing axial center position of a vibration applying body for applying vibration to the fiber bundle to be transferred. In the opening device, a frequency f1 applying a first vibration- applying mechanism positioned on upstream side to transferring direction of the fiber bundle to the fiber bundle and a frequency f2 applying a second vibration applying mechanism positioned on downstream side to the fiber bundle each satisfy the formulas 0.5

公开(公告)号：JPH10256285A

公开(公告)日：1998-09-25

申请号：JP5200997

申请日：1997-03-06

Applicant: TORAY INDUSTRIES

Inventor： SEKIDO SHUNEI ,  TANAKA SEIJI ,  MATSUMAE HIDEYO

IPC: H01L23/28 ,  H01L21/56

Abstract: PROBLEM TO BE SOLVED: To prevent an adhesive from protruding from the edge of a sealing frame body by applying the adhesive to a semiconductor package sealing frame body or a semiconductor package substrate by a screen method and making the sealing frame body adhere to the substrate. SOLUTION: A screen printer is used as an adhesive application means 5 applying adhesive 6 to a prescribed region on the substrate 3. The screen printer is provided with a screen 14, and the screen 14 has a mesh part 15 whose form is the same as the adhesive applied region. Multiple small holes are given to the mesh part 15. When a squeegee 16 is moved, adhesive 6 on the screen 14 falls down through a small holes and is applied on the substrate 3. Thus, the adhesive 6 is prevented from protruding from the edge of the sealing frame body, and the adhesive 6 is prevented from covering a connection part between a conductor pattern and a semiconductor chip. Consequently, the conductor pattern and the semiconductor chip can be connected as they are.