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    THERMOSETTING RESIN COMPOSITION
    1.
    发明专利
    THERMOSETTING RESIN COMPOSITION 失效

    公开(公告)号：JPS61266419A

    公开(公告)日：1986-11-26

    申请号：JP10835685

    申请日：1985-05-22

    Applicant: TORAY INDUSTRIES

    Inventor： ITO HIDEO ,  TANIGUCHI MASAHARU ,  MINAMI SOKO

    IPC: C08G73/00 ,  C08F20/00 ,  C08F20/52 ,  C08F22/36 ,  C08F222/40 ,  C08G73/12

    Abstract: PURPOSE:The titled composition of excellent moldability which can be obtained by a simplified production process, comprising a specified polymerizable thermosetting polyamide-imide and a specified unsaturated N,N'-bisimide. CONSTITUTION:A tricarboxylic acid (e.g., trimellitic acid) or its functional derivative of the same reactivity is reacted, by heating, with a diamine (e.g., m-phenylenediamine) and further reacted with a polymerizable unsaturated dicarboxylic acid anhydride (e.g., Nadic anhydride) or its functional derivative of the same reactivity, a dicarboxylic acid or the like to obtain a polymerizable thermosetting polyamide-imide (A) of formula I (wherein R is a 2C or higher bivalent organic residue having at least one polymerizable double bond, T is a trivalent aromatic group, D is a bivalent aromatic group and n and m are each >=1). Before or after the reaction for obtaining component A is complet ed, an unsaturated N,N'-bisimide of formula II (wherein X is a bivalent group containing a C=C double bond and Y is a 1C or higher bivalent organic group) is melt-mixed with the component.

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