公开(公告)号：JP2000277543A

公开(公告)日：2000-10-06

申请号：JP7755899

申请日：1999-03-23

Applicant: TORAY INDUSTRIES

Inventor： MIZUTANI YOKO ,  SAWAMURA TAIJI ,  SHINOHARA HIDEKI

IPC: H01L23/12 ,  C09J7/02 ,  C09J11/04 ,  H01L21/52

Abstract: PROBLEM TO BE SOLVED: To improve resistance to reflow, thermal cycling performance and machinability, by using a thermoplastic resin, a thermosetting resin, and a thermosetting adhesive containing zinc oxide for the adhesive layer of a laminate. SOLUTION: The inner lead 5 of a substrate for connecting a semiconductor integrated circuit is thermocompression-bonded on the gold bump 2 of an IC 1 to mount the IC 1 on the substrate. An adhesive layer 6 using a thermoplastic resin such as acrylonitrile-butadiene copolymer and polybutadiene, a thermosetting resin such as epoxy resin, phenol resin, and melamine resin, and a thermosetting adhesive containing zinc oxide is laminated on the IC 1 and a flexible insulating film 3 formed on an adhesive layer 4 constituting a wiring substrate layer. This can improve resistance to reflow, thermal cycling performance and machinability.

公开(公告)号：JP2001250848A

公开(公告)日：2001-09-14

申请号：JP2000060258

申请日：2000-03-06

Applicant: TORAY INDUSTRIES

Inventor： SAWAMURA TAIJI ,  TAKAHASHI HIDEO ,  MIZUTANI YOKO

IPC: C09J7/02 ,  C09J109/02 ,  C09J161/06 ,  C09J163/00 ,  C09J177/00 ,  H01L21/60

Abstract: PROBLEM TO BE SOLVED: To provide a tape with an adhesive for a semiconductor device having excellent laminate and bonding characteristics, a copper-clad laminate using the tape, a substrate for semiconductor connection, and a semiconductor device. SOLUTION: In this tape with the adhesive for the semiconductor device, the copper-clad laminate using the tape, the substrate for the semiconductor connection, and the semiconductor device, this tape with an adhesive is composed by a lamination body having at least an adhesive layer on an organic insulating film, and the thermal conductivity of the organic insulating film at 150 deg.C should be equal to or more than 0.14 W/mK.

公开(公告)号：JPH11354592A

公开(公告)日：1999-12-24

申请号：JP7950899

申请日：1999-03-24

Applicant: TORAY INDUSTRIES

Inventor： MIZUTANI YOKO ,  KIGOSHI SHOJI ,  KONISHI YUKITSUNA

IPC: H01L21/60 ,  C09J7/02 ,  C09J161/06 ,  C09J163/00 ,  C09J177/00

Abstract: PROBLEM TO BE SOLVED: To improve the adhesiveness, insulation property, and workability of an adhesive-backed tape, by mixing at least a thermoplastic resin and a phenol resin as essential ingredients in the adhesive layer of the tape, and specifying the softening point of the phenol resin. SOLUTION: The adhesive layer formed on an adhesive-backed tape contains at least a thermoplastic resin (A) and a phenol resin (B) as essential ingredients. While any thermoplastic resin can be used as the thermoplastic resin (A) as far as the resin gives flexibility to the adhesive layer, an embodiment of the resin includes polyethylene, polyamide, etc. It is preferable to specify the softening point of the phenol resin (B) to =85 deg.C, the well-known novolak and resol resins can be used without restriction. It is also preferable to adjust the mixing ratio of the phenol resin (B) in the adhesive to 35-60%.

公开(公告)号：JPH11260839A

公开(公告)日：1999-09-24

申请号：JP6523298

申请日：1998-03-16

Applicant: TORAY INDUSTRIES

Inventor： KIGOSHI SHOJI ,  MIZUTANI YOKO ,  SHINOHARA HIDEKI

IPC: H01L23/40 ,  C09J5/06 ,  C09J163/00 ,  C09J201/00 ,  H01L21/52 ,  H01L21/60 ,  H01L23/12

Abstract: PROBLEM TO BE SOLVED: To increase the reliability and processibility of a substrate for connecting semiconductor integrated circuits in high density mounting and of a semiconductor device, and thereby increase the profitability by industrially providing an adhesive composition for a semiconductor device which has superior processibility, adhesive force, high in insulating reliability and durability and an adhesive sheet for a semiconductor device manufactured using the adhesive composition. SOLUTION: In a substrate for connecting semiconductor integrated circuits, having a wiring board layer constituted of an insulator layer and a conductor pattern, a layer formed with no conductor pattern and an adhesive layer, each of at least one or more layers, an adhesive composition which forms the adhesive layer includes at least one kind of each thermoplastic resin and thermosetting resin and has such as property that 2N cm , 2N cm , 0.2