CROSSLINKED POLYOLEFIN RESIN FOAM

    公开(公告)号:JPS6281429A

    公开(公告)日:1987-04-14

    申请号:JP22041385

    申请日:1985-10-04

    Abstract: PURPOSE:To reutilize a crosslinked polyolefin resin, whose reutilization has heretofore been thought to be impossible, as a raw material for foams, by blending a crosslinked polyolefin resin with an uncrosslinked polyolefin resin at a specified ratio. CONSTITUTION:This foam is one formed from a polyolefin resin mixture containing a crosslinked polyolefin resin (B) and an uncrosslinked polyolefin resin (A) at a blend ratio (A/B) in the range of 2-19. A preferable foam is one containing 10-70pts.wt. inorganic filler per 100pts.wt. said polyolefin resin mixture and a flexibility number (N) of foam

    CROSSLINKED POLYPROPYLENE RESIN FOAM HAVING EXCELLENT HEAT-RESISTANCE AND FORMABILITY

    公开(公告)号:JPS6234930A

    公开(公告)日:1987-02-14

    申请号:JP17294985

    申请日:1985-08-06

    Abstract: PURPOSE:To provide a foam containing a specific polyethylene copolymer and a polypropylene, having excellent vacuum-formability and heat-resistance and formable by vacuum-forming without causing the bubble breakage and surface- roughening. CONSTITUTION:The objective foamed material is composed of a blended polymer containing (A) a polyethylene copolymer containing one or more compounds selected from monobasic or dibasic aliphatic unsaturated carboxylic acid and its derivative as a copolymerized component and (B) a polypropylene as essential components. The blending ratio of B/A is 2-19 (by weight), the gal fraction is 15-45% and the draw ratio (K) is >=0.6. The resin composition may be blended further with

    IMPROVED CROSSLINKED POLYPROPYLENE RESIN FOAM

    公开(公告)号:JPS6218437A

    公开(公告)日:1987-01-27

    申请号:JP15638685

    申请日:1985-07-16

    Abstract: PURPOSE:To provide the titled resin foam having excellent flexibility, heat resistance, processability, etc. and suitable for use as packing, heat insulating material, etc., by blending polypropylene with an ethylene/propylene random copolymer having specified properties and expanding and crosslinking the blend. CONSTITUTION:An ethylene/propylene random copolymer (A) contg. 15-30wt% propylene as a comonomer and having a m.p. of 100-118 deg.C and a crystallizing temp. of 85-100 deg.C is blended with polypropylene (B) in a polymn. ratio of B/A of 0.1-5.7. A heat decomposable blowing agent (e.g. azodicarbonamide) and optionally, a crosslinking agent and a crosslinking aid (e.g. divinylbenzene) are added thereto and the mixture is molded into a desired shape, which is then expanded and crosslinked, to obtain the desired crosslinked polypropylene resin foam having a compression hardness S satisfying the formula (wherein E is apparent expansion ratio).

    POLYOLEFIN FOAM
    8.
    发明专利

    公开(公告)号:JPS60179427A

    公开(公告)日:1985-09-13

    申请号:JP3257784

    申请日:1984-02-24

    Abstract: PURPOSE:A polyolefin foam having uniform quality and excellent flame retardancy and heat moldability, comprising a specified polyolefin thermoplastic resin, a bisphenol A-derived (crosslinked) brominated epoxy resin, and an inorganic filler. CONSTITUTION:A polyolefin foam of a density of 0.1-0.01g/cm and a bromine content of 2-10wt% is obtained by melt-kneading and expanding a mixture of (A) a polyolefin thermoplastic resin containing at least 85wt% 2-10C alpha-olefin (co)polymer of a density of 0.910-0.970g/cm , (B) bisphenol A-derived brominated epoxy resin of a bromine content of 16-60wt%, an epoxy equivalent weight of 200-2,000, and an MW of 400-4,000 [e.g., a compound of the formula (wherein n and m are integers, and n>=m)], (C) 6-20wt% heat-decomposable blowing agent (e.g., azodicarbonamide), (D) 0-25wt% inorganic filler (e.g, Sb2O3) of a particle diameter of 0.05-60mu, and (E) optionally a flame retardant, chemical crosslinking agent, etc.

    POLYESTER AMIDE FILM
    9.
    发明专利

    公开(公告)号:JPS5893757A

    公开(公告)日:1983-06-03

    申请号:JP19049181

    申请日:1981-11-30

    Abstract: PURPOSE:To provide the titled film which is suitable for use as an insulating material for electrical apparatuses and has high heat resistance and dielectric constant, by subjecting an arom. dicarboxylic acid, an alkylene glycol and a specified monomer contg. an amide group to polycondensation, and molding the product into a film. CONSTITUTION:An arom. dicarboxylic acid (derivative) such as terephthalic acid, an alkylene glycol such as ethylene glycol and a monomer contg. an amide group of formulaI(wherein R is a group of formula II, III or IV; R1, R2 are each H, lower alkyl, phenyl) such as 4,4'-dicarboxybenzanilide are subjected to polycondensation. The resulting amide group-contg. copolyester contg. at least 1mol% of a repeating unit of formula V (wherein n is 2-6) is molded into a film to obtain the desired polyester amide film having a density of 1.35-1.42 at 25 deg.C and a dieletric constant of 3.4 or above.

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