公开(公告)号：SG11201605819SA

公开(公告)日：2016-08-30

申请号：SG11201605819S

申请日：2015-01-09

Applicant: TORAY INDUSTRIES

Inventor： ODA TAKURO ,  KANAMORI DAISUKE ,  NONAKA TOSHIHISA

IPC: C09J179/08 ,  C09J7/02 ,  C09J11/04 ,  C09J11/06 ,  C09J163/00 ,  H01L21/60

Abstract: The present invention provides an adhesive composition having excellent strength in a cracked state, and is an adhesive composition characterized by containing a polyimide (A),a polyfunctional epoxy compound (B), an epoxy curing agent (C), and inorganic particles (D), the ratio of the polyimide (A) in a nonvolatile organic component being 3.0 wt % or more and 30 wt % or less, the ratio of the epoxy curing agent (C) in the nonvolatile organic component being 0.5 wt % or more and 10 wt % or less, and T/M being 400 or more and 8000 or less, where T is the total number of grams of the nonvolatile organic component, and M is the number of moles of epoxy groups in the nonvolatile organic component.

公开(公告)号：MY160024A

公开(公告)日：2017-02-15

申请号：MYPI2012000067

申请日：2010-06-23

Applicant: TORAY INDUSTRIES

Inventor： FUJIMARU KOICHI ,  NONAKA TOSHIHISA ,  TATSUYA YOSHIKO

IPC: C08G59/40 ,  C08G73/10 ,  C08L63/00

Abstract: PROVIDED IS AN ADHESIVE COMPOSITION HAVING BOTH EXCELLENT STORABILITY AND EXCELLENT CONNECTION RELIABILITY. THE ADHESIVE COMPOSITION COMPRISES (A) A POLYIMIDE SOLUBLE IN ORGANIC SOLVENTS, (B) AN EPOXY COMPOUND, (C) PARTICLES OF A CURING ACCELERATOR, AND (D) INORGANIC PARTICLES, THE AMOUNTS OF THE ORGANIC-SOLVENT-SOLUBLE POLYIMIDE (A) AND THE CURING-ACCELERATOR PARTICLES (C) BEING I 5-90 PARTS BY WEIGHT AND 0.1-50 PARTS BY WEIGHT, RESPECTIVELY, PER 100 PARTS BY WEIGHT OF THE EPOXY COMPOUND (B), AND THE CONTENT OF THE INORGANIC PARTICLES (D) BEING 30-80 WT.% OF THE TOTAL AMOUNT OF(A) TO (D).

公开(公告)号：SG11201405431TA

公开(公告)日：2014-10-30

申请号：SG11201405431T

申请日：2013-02-20

Applicant: TORAY INDUSTRIES

Inventor： ASAHI NOBORU ,  NONAKA TOSHIHISA ,  NIIZEKI SHOICHI

IPC: H01L21/60 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18

Abstract: Disclosed is a method for producing a semiconductor device in which solder joints are made between a semiconductor chip with bumps and a substrate with electrodes corresponding to the bumps through a thermosetting adhesive layer, the method including the successive steps of: (A) forming a thermosetting adhesive layer in advance on a surface including bumps of the semiconductor chip; (B) laying a surface on the thermosetting adhesive layer side of the semiconductor chip, on which the thermosetting adhesive layer is formed, and a substrate one upon another, followed by pre-bonding using a heat tool to obtain a pre-bonded laminate; and (C) interposing a protective film having a thermal conductivity of 100 W/mK or more between the heat tool and a surface on the semiconductor chip side of the pre-bonded laminate, melting a solder between the semiconductor chips and the substrate and simultaneously curing the thermosetting adhesive layer using the heat tool. There is provided a method and an apparatus for producing a semiconductor device, which is capable of making a satisfactory joint without causing catching of a resin of an adhesive film between bumps and electrode pads.

公开(公告)号：AU607219B2

公开(公告)日：1991-02-28

申请号：AU1656888

申请日：1988-05-24

Applicant: TORAY INDUSTRIES

Inventor： NONAKA TOSHIHISA ,  KOBAYASHI KEISUKE ,  IGAKI HIROYUKI ,  MATSUKI MICHIYASU

IPC: C03C17/25 ,  C04B35/45 ,  C04B41/50 ,  C04B41/87 ,  H01L39/24 ,  H01L39/08 ,  H01L39/12 ,  C01G3/02 ,  C04B35/02

Abstract: A solution for forming a superconductive thin film prepared by dissolving a mol of a compound selected from group A consisting of alkoxides and alkoxyalkoxides of a rare earth metal element; b mol of a compound selected from group B consisting of alkoxides and alkoxyalkoxides of Ba, Sr and Ca; and c mol of a compound selected from group C consisting of alkoxides and alkoxyalkoxides of Cu in e liter of a compound selected from group E, a solvent selected from alcohols together with d mol of a compound selected from group D having hydrolysis inhibitory action such as an amine, a ketone and a glycol, such that the following relationships: 0.1 x (a + b + c)

公开(公告)号：PH12016501392A1

公开(公告)日：2017-02-06

申请号：PH12016501392

申请日：2016-07-14

Applicant: TORAY INDUSTRIES

Inventor： ODA TAKURO ,  KANAMORI DAISUKE ,  NONAKA TOSHIHISA

IPC: C09J11/06 ,  C09J7/02 ,  C09J11/04 ,  C09J163/00 ,  C09J179/08 ,  H01L21/60

Abstract: The present invention provides an adhesive composition having excellent strength in a cracked state, and is an adhesive composition characterized by containing a polyimide (A), a polyfunctional epoxy compound (B), an epoxy curing agent (C), and inorganic particles (D), the ratio of the polyimide (A) in a nonvolatile organic component being 3.0 wt pcnt to 30 wt pcnt , the ratio of the epoxy curing agent (C) in the nonvolatile organic component being 0.5 wt pcnt to 10 wt pcnt , and T/M being 400 to 8000, where T is the total number of grams of the nonvolatile organic component, and M is the number of moles of epoxy groups in the nonvolatile organic component.

公开(公告)号：SG190423A1

公开(公告)日：2013-06-28

申请号：SG2013040910

申请日：2011-11-28

Applicant: TORAY INDUSTRIES

Inventor： SHIMADA AKIRA ,  SHINBA YOICHI ,  NONAKA TOSHIHISA

Abstract: The purpose of the present invention is to provide an adhesive composition, which has high thermal conductivity and excellent adhesion, and wherein dispersibility of a thermally conductive filler is controlled. The adhesive composition is configured to contain (A) a soluble polyimide, (B) an epoxy resin and (C) a thermally conductive filler. The adhesive composition is characterized in that the soluble polyimide (A) contains a structure represented by general formula (1) as a component derived from a diamine and the amount of the thermally conductive filler (C) contained in the adhesive composition is not less than 60% by volume. (In general formula (1), X represents an integer of 1-10 (inclusive) and n represents an integer of 1-20 (inclusive).)

公开(公告)号：SG11201406125PA

公开(公告)日：2014-11-27

申请号：SG11201406125P

申请日：2013-05-21

Applicant: TORAY INDUSTRIES

Inventor： MATSUMURA KAZUYUKI ,  FUJIMARU KOICHI ,  NONAKA TOSHIHISA

IPC: C09J7/02 ,  C09J11/04 ,  C09J11/06 ,  C09J163/00 ,  C09J179/08 ,  H01L21/60 ,  H01L23/29 ,  H01L23/31

Abstract: An adhesive sheet for production of a semiconductor device with bump electrode, including a soft film and an alkali-soluble adhesive film formed on the soft film is capable of exposing the bump electrode without imparting damage to the bump electrode, and then wet etching of an adhesive on bump tops using an aqueous alkali solution makes it possible to put into a state where no adhesive exists on the bump tops, thus enabling the production of a semiconductor device which is excellent in connection reliability after flip chip packaging.

公开(公告)号：SG11201401908RA

公开(公告)日：2014-09-26

申请号：SG11201401908R

申请日：2012-10-24

Applicant: TORAY INDUSTRIES

Inventor： SHIMBA YOICHI ,  FUJIMARU KOICHI ,  NONAKA TOSHIHISA

IPC: C08L63/00 ,  C08K9/06 ,  C09J7/00 ,  C09J9/02 ,  C09J11/04 ,  C09J163/00 ,  H01L21/60

Abstract: A resin composition excellent in both characteristics of preservation stability and connection reliability is provided by a resin composition that contains (a) an epoxy compound, (b) a microcapsule type hardening acceleration agent, and (c) an inorganic particle whose surface is modified with a compound that has an unsaturated double bond.

公开(公告)号：SG179972A1

公开(公告)日：2012-06-28

申请号：SG2012027322

申请日：2010-10-08

Applicant: TORAY INDUSTRIES

Inventor： SHINBA YOICHI ,  NIIZEKI SHOICHI ,  NONAKA TOSHIHISA

Abstract: Disclosed is a process with comprises bringing an acidic organic substance or phosphoric acid into contact with a metal to form, on the surface of the metal, a layer that contains either an organic acid salt formed from both the acidic organic substance and the metal or a phosphoric acid salt formed from both the phosphoric acid and the metal. In the process, the layer can be selectively formed only on the surface of the metal. When the process is applied to the production of core-shell particles, neither agglomeration of the particles nor viscosity increase of the fluid occurs, while when the process is applied to the production of a covered metal-wiring circuit board, the layer can be selectively formed only in the metal area to be covered.

公开(公告)号：AT509961T

公开(公告)日：2011-06-15

申请号：AT07831242

申请日：2007-11-06

Applicant: TORAY INDUSTRIES

Inventor： SHINBA YOICHI ,  NIWA HIROYUKI ,  TATSUTA YOSHIKO ,  FUJIMARU KOICHI ,  NONAKA TOSHIHISA

IPC: C08F2/44 ,  C08F290/00 ,  C08F290/06 ,  C08K3/30 ,  C08L43/02 ,  C08L63/00 ,  G02B6/12

Abstract: Problems: an object of the present invention is to provide an optical waveguide-forming paste composition that allows short-time curing and provides excellent developability. Means for solving: The present invention is directed to an optical waveguide-forming paste composition including (A) barium sulfate particles with a mean particle diameter of 1 nm or more to 50 nm or less, (B) a compound having a polymerizable group and a carboxyl group, or a phosphoric ester compound having a polymerizable group, and (C) an organic solvent.