公开(公告)号：SG11201707365YA

公开(公告)日：2017-10-30

申请号：SG11201707365Y

申请日：2016-03-09

Applicant: TORAY INDUSTRIES

Inventor： SHINBA YOICHI

IPC: C09J7/00 ,  C09J5/00 ,  C09J11/04 ,  C09J201/00 ,  H01L21/52 ,  H01L23/36

Abstract: Provided is an adhesive composition sheet containing an organic compound and inorganic particles, the adhesive composition sheet including a structure obtained by stacking a layer A that contains at least an organic compound and a layer B that contains an organic compound and inorganic particles, the layer A having a content rate of the organic compound larger than the content rate of the organic compound in the layer B, and the layer A and/or the layer B containing anisotropically shaped inorganic particles. The present invention provides an adhesive composition sheet excellent in thermal conductivity and insulating properties after cured.

公开(公告)号：SG190423A1

公开(公告)日：2013-06-28

申请号：SG2013040910

申请日：2011-11-28

Applicant: TORAY INDUSTRIES

Inventor： SHIMADA AKIRA ,  SHINBA YOICHI ,  NONAKA TOSHIHISA

Abstract: The purpose of the present invention is to provide an adhesive composition, which has high thermal conductivity and excellent adhesion, and wherein dispersibility of a thermally conductive filler is controlled. The adhesive composition is configured to contain (A) a soluble polyimide, (B) an epoxy resin and (C) a thermally conductive filler. The adhesive composition is characterized in that the soluble polyimide (A) contains a structure represented by general formula (1) as a component derived from a diamine and the amount of the thermally conductive filler (C) contained in the adhesive composition is not less than 60% by volume. (In general formula (1), X represents an integer of 1-10 (inclusive) and n represents an integer of 1-20 (inclusive).)

公开(公告)号：SG179972A1

公开(公告)日：2012-06-28

申请号：SG2012027322

申请日：2010-10-08

Applicant: TORAY INDUSTRIES

Inventor： SHINBA YOICHI ,  NIIZEKI SHOICHI ,  NONAKA TOSHIHISA

Abstract: Disclosed is a process with comprises bringing an acidic organic substance or phosphoric acid into contact with a metal to form, on the surface of the metal, a layer that contains either an organic acid salt formed from both the acidic organic substance and the metal or a phosphoric acid salt formed from both the phosphoric acid and the metal. In the process, the layer can be selectively formed only on the surface of the metal. When the process is applied to the production of core-shell particles, neither agglomeration of the particles nor viscosity increase of the fluid occurs, while when the process is applied to the production of a covered metal-wiring circuit board, the layer can be selectively formed only in the metal area to be covered.

公开(公告)号：AT509961T

公开(公告)日：2011-06-15

申请号：AT07831242

申请日：2007-11-06

Applicant: TORAY INDUSTRIES

Inventor： SHINBA YOICHI ,  NIWA HIROYUKI ,  TATSUTA YOSHIKO ,  FUJIMARU KOICHI ,  NONAKA TOSHIHISA

IPC: C08F2/44 ,  C08F290/00 ,  C08F290/06 ,  C08K3/30 ,  C08L43/02 ,  C08L63/00 ,  G02B6/12

Abstract: Problems: an object of the present invention is to provide an optical waveguide-forming paste composition that allows short-time curing and provides excellent developability. Means for solving: The present invention is directed to an optical waveguide-forming paste composition including (A) barium sulfate particles with a mean particle diameter of 1 nm or more to 50 nm or less, (B) a compound having a polymerizable group and a carboxyl group, or a phosphoric ester compound having a polymerizable group, and (C) an organic solvent.

公开(公告)号：EP1589796A4

公开(公告)日：2009-08-05

申请号：EP04703889

申请日：2004-01-21

Applicant: TORAY INDUSTRIES

Inventor： OKUYAMA FUTOSHI ,  SHINBA YOICHI ,  HAYASHI TETSUYA ,  AKAMATSU TAKAYOSHI

IPC: H05K3/00 ,  B65H29/64 ,  B65H41/00 ,  H05K1/00

CPC classification number: H05K3/007 ,  B65H2301/51122 ,  H05K1/0393 ,  H05K2203/016 ,  H05K2203/0264 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: A method for manufacturing a circuit board using a flexible film having a high-accuracy circuit pattern, a method for manufacturing a circuit board composed of a flexible film having a high-accuracy circuit pattern, and an apparatus therefore are disclosed. Specifically disclosed are a member for circuit boards in which a reinforcing sheet, a peelable organic layer, a flexible film on one or both sides of which circuit patterns are formed, a peeling assisting layer are sequentially formed in order of mention, a method for manufacturing a circuit board in which a flexible film is bonded to one side of a reinforcing sheet with a peelable organic layer interposed therebetween, a circuit pattern is formed on the other side, and the flexible film is peeled, characterized in that the flexible film is peeled from the reinforcing sheet at a peeling angle of 0 to 8 degrees, and an apparatus for manufacturing a circuit board by using the manufacturing method. The circuit board can be preferably applied to a wiring board of an electronic device, an interposer for an IC package, and a wiring board for wafer-level burn-in socket.

公开(公告)号：JP2001329096A

公开(公告)日：2001-11-27

申请号：JP2001018243

申请日：2001-01-26

Applicant: TORAY INDUSTRIES

Inventor： FUJIWARA TAKENORI ,  MORI YOICHI ,  SHINBA YOICHI

IPC: C08J9/06 ,  H01L21/312 ,  H01L21/768 ,  H01L23/522

Abstract: PROBLEM TO BE SOLVED: To provide a porous dielectric polymer having a small pore diameter to be used in electronic parts, and a method of very simply producing the same. SOLUTION: The porous polymer is obtained by (a) using a matrix polymer and a thermally decomposable compound which thermally decomposes at a temperature of lower than the decomposition temperature of the matrix polymer and allowing both to undergo at least one of bondings and/or interactions of ion bonding, hydrogen bonding, and intermolecular interaction to form a precursor composition and (b) heating the precursor composition at a temperature of either not lower than the decomposition temperature of the thermally decomposable compound included therein or not higher than the decomposition temperature of the matrix polymer to form a porous polymer.

公开(公告)号：EP2489683A4

公开(公告)日：2015-03-18

申请号：EP10823349

申请日：2010-10-08

Applicant: TORAY INDUSTRIES

Inventor： SHINBA YOICHI ,  NIIZEKI SHOICHI ,  NONAKA TOSHIHISA

IPC: C08F2/00 ,  B32B15/08 ,  C09C1/62 ,  C09C1/64 ,  C09C3/10 ,  C23C22/08 ,  H05K3/28 ,  H05K9/00

CPC classification number: C09C3/10 ,  C01P2004/03 ,  C01P2004/62 ,  C01P2004/84 ,  C01P2006/40 ,  C09C1/62 ,  C09C1/64 ,  C09C1/644 ,  H05K3/28 ,  H05K2201/0224 ,  H05K2201/10977 ,  H05K2203/122 ,  Y10T428/2991

公开(公告)号：EP2080773A4

公开(公告)日：2010-06-02

申请号：EP07831242

申请日：2007-11-06

Applicant: TORAY INDUSTRIES

Inventor： SHINBA YOICHI ,  NIWA HIROYUKI ,  TATSUTA YOSHIKO ,  FUJIMARU KOICHI ,  NONAKA TOSHIHISA

IPC: C08F2/44 ,  C08F290/00 ,  C08F290/06 ,  C08K3/30 ,  C08L43/02 ,  C08L63/00 ,  G02B6/12

CPC classification number: G02B6/138 ,  C08F290/00 ,  C08F290/06 ,  C08F292/00 ,  C08K3/30

公开(公告)号：EP2647685A4

公开(公告)日：2014-09-17

申请号：EP11845999

申请日：2011-11-28

Applicant: TORAY INDUSTRIES

Inventor： SHIMADA AKIRA ,  SHINBA YOICHI ,  NONAKA TOSHIHISA

IPC: C09J179/08 ,  C08G73/10 ,  C08G77/14 ,  C08K3/28 ,  C08L79/08 ,  C09J7/00 ,  C09J11/04 ,  C09J163/00 ,  C09J183/10 ,  H01L23/00 ,  H01L23/36

CPC classification number: C09J163/00 ,  C08G77/14 ,  C08K3/28 ,  C08K2003/2227 ,  C08L63/00 ,  C08L101/10 ,  C09J7/20 ,  C09J9/02 ,  C09J179/08 ,  C09J183/10 ,  H01L23/3737 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32225 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  C08L79/08 ,  H01L2924/00

Abstract: The purpose of the present invention is to provide an adhesive composition, which has high thermal conductivity and excellent adhesion, and wherein dispersibility of a thermally conductive filler is controlled. The adhesive composition is configured to contain (A) a soluble polyimide, (B) an epoxy resin and (C) a thermally conductive filler. The adhesive composition is characterized in that the soluble polyimide (A) contains a structure represented by general formula (1) as a component derived from a diamine and the amount of the thermally conductive filler (C) contained in the adhesive composition is not less than 60% by volume. (In general formula (1), X represents an integer of 1-10 (inclusive) and n represents an integer of 1-20 (inclusive).)

公开(公告)号：EP1333708A4

公开(公告)日：2008-08-13

申请号：EP02749299

申请日：2002-07-17

Applicant: TORAY INDUSTRIES

Inventor： AKAMATSU TAKAYOSHI ,  OKUYAMA FUTOSHI ,  KUROKI NOBUYUKI ,  ENOMOTO HIROSHI ,  HAYASHI TETSUYA ,  MATSUDA YOSHIO ,  SHINBA YOICHI ,  OGUNI MASAHIRO

IPC: H05K1/00 ,  H05K3/00

CPC classification number: B32B38/18 ,  B32B37/025 ,  B32B2037/109 ,  B32B2038/1891 ,  B32B2379/08 ,  B32B2457/08 ,  H05K1/0393 ,  H05K3/007 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/016 ,  H05K2203/066 ,  H05K2203/068 ,  H05K2203/1572 ,  Y10S428/901 ,  Y10T428/24917

Abstract: A circuit board using a flexible film having high-precision patterns, a circuit board-use member, and a production method for a circuit board-use member excellent in productivity. A circuit board comprising metal circuit patterns provided on a flexible film, the positional precision of the circuit patterns being up to ± 0.01%. A circuit board-use member comprising, laminated in the order mentioned, a circuit board reinforcing sheet (6), a releasable organic matter layer (7), a flexible film (4), and metal circuit patterns.