Abstract:
An optical recording medium for recording information by changing the phase of material from amorphus one to crystalline one and vice versa, including the following types. A type which comprises a transparent substrate, a first dielectric layer, a recording layer, a second dielectric layer, a light absorbing layer, and a light reflecting layer, the thickness of the second dielectric layer being in a range from 1 to 50 nm. A type which comprises a transparent substrate, a first dielectric layer, a recording layer, a second dielectric layer, and a light absorbing layer, the thickness of the second dielectric layer being in a range from 1 to 30 nm. A type which comprises a recording layer, a dielectric layer, a light reflecting layer, the thicknesses of the recording layer and the dielectric layer being in a range from 30 to 60 nm and in a range from 1 to 25 nm, respectively. A type in which the amplitudes of the signals reproduced from recording marks made at intervals longer than lambda /NA in the recording direction are less than five times those at intervals shorter than lambda /NA, where lambda is the wavelength of the recording light, and NA is the numerical aperture of the objective of the optical head. A type in which the C/N ratio of the signals reproduced from the former recording marks is lower than that of the latter. A type in which the areas of the former are smaller than those of the latter. A type in which the amplitudes of the signals reproduced from the latter which are overwritten on the former are more than five times those of the residual former after overwrite. Such a recording medium has good erasure characteristic, jitter characteristic, and durability against repeated overwrite.
Abstract:
When a long film circuit board (1d) is formed by joining a plurality of flexible film substrates (1) each formed on at least one surface thereof with a circuit pattern (2), conveying spaces (4) are provided at the pair of facing ends of the flexible film substrate , at least part of the conveying space is allowed to project (15) in a direction parallel to the conveying direction of the flexible film substrate, and the projected part of the conveying space is allowed to overlap the conveying space of an adjacent flexible film substrate to be fixed.
Abstract:
An optical recording medium for recording information by changing the phase of material from amorphus one to crystalline one and vice versa, including the following types. A type which comprises a transparent substrate, a first dielectric layer, a recording layer, a second dielectric layer, a light absorbing layer, and a light reflecting layer, the thickness of the second dielectric layer being in a range from 1 to 50 nm. A type which comprises a transparent substrate, a first dielectric layer, a recording layer, a second dielectric layer, and a light absorbing layer, the thickness of the second dielectric layer being in a range from 1 to 30 nm. A type which comprises a recording layer, a dielectric layer, a light reflecting layer, the thicknesses of the recording layer and the dielectric layer being in a range from 30 to 60 nm and in a range from 1 to 25 nm, respectively. A type in which the amplitudes of the signals reproduced from recording marks made at intervals longer than lambda /NA in the recording direction are less than five times those at intervals shorter than lambda /NA, where lambda is the wavelength of the recording light, and NA is the numerical aperture of the objective of the optical head. A type in which the C/N ratio of the signals reproduced from the former recording marks is lower than that of the latter. A type in which the areas of the former are smaller than those of the latter. A type in which the amplitudes of the signals reproduced from the latter which are overwritten on the former are more than five times those of the residual former after overwrite. Such a recording medium has good erasure characteristic, jitter characteristic, and durability against repeated overwrite.
Abstract:
A circuit board using a flexible film having high-precision patterns, a circuit board-use member, and a production method for a circuit board-use member excellent in productivity. A circuit board comprising metal circuit patterns provided on a flexible film, the positional precision of the circuit patterns being up to ± 0.01%. A circuit board-use member comprising, laminated in the order mentioned, a circuit board reinforcing sheet (6), a releasable organic matter layer (7), a flexible film (4), and metal circuit patterns.
Abstract:
An optical recording device which enables high-density recording onto an optical recording medium, has a large degree of margin in depth of focus, has less risk of damage to the optical recording medium or an optical system, realizes stable recording and reproducing characteristics, and may be easily manufactured. The optical recording device includes an optical recording medium having a lubricant layer on the outermost surface on the incident light side, an optical system including an optical waveguide having a near-field lens or a minute aperture provided in contact with or close to the optical recording medium, and a light source. More preferably, an apodizer is provided on the side of the light source or the side of the near-field lens of a collimating lens located between the near-field lens and the light source. The optical recording medium is constituted by a multilayer body formed by stacking at least a lubricant layer, a recording layer, a dielectric layer, a reflective layer and a substrate in this order.
Abstract:
A method for manufacturing a circuit board using a flexible film having a high-accuracy circuit pattern, a method for manufacturing a circuit board composed of a flexible film having a high-accuracy circuit pattern, and an apparatus therefore are disclosed. Specifically disclosed are a member for circuit boards in which a reinforcing sheet, a peelable organic layer, a flexible film on one or both sides of which circuit patterns are formed, a peeling assisting layer are sequentially formed in order of mention, a method for manufacturing a circuit board in which a flexible film is bonded to one side of a reinforcing sheet with a peelable organic layer interposed therebetween, a circuit pattern is formed on the other side, and the flexible film is peeled, characterized in that the flexible film is peeled from the reinforcing sheet at a peeling angle of 0 to 8 degrees, and an apparatus for manufacturing a circuit board by using the manufacturing method. The circuit board can be preferably applied to a wiring board of an electronic device, an interposer for an IC package, and a wiring board for wafer-level burn-in socket.
Abstract:
PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit board in which a high-accuracy circuit pattern is formed at least on one face by suppressing the deformation of a flexible film whose dimension is easy to change due to the influence of heat, humidity and an external force. SOLUTION: In the method of manufacturing the circuit board, a reinforcing sheet and the flexible film are pasted via an organic substance layer capable of being stripped, the circuit pattern is formed on a face on which the flexible film is not pasted on the reinforcing sheet, and the flexible film is stripped. In the method of manufacturing the circuit board, the product A×B×C of a release force A (g/cm) used to strip the flexible film multiplied by an inverse number B (μm -1 ) of the thickness of the flexible film, and an inverse number C (mm 2 /kg) of Young's modulus of the flexible film is within a range of 4.3×10 -6 to 4.3×10 -3 . COPYRIGHT: (C)2003,JPO
Abstract:
PROBLEM TO BE SOLVED: To enable a high-density recording and to reduce the possibility of abrasion or damage by forming a lubricant layer on the outermost surface of an optical system and providing the optical system with a near-field lens in contact with or adjacent to an optical recording medium. SOLUTION: Laser beams emitted from a semiconductor laser 6 pass through a beam splitter 4 and a collimating lens 2 to be converged on an optical recording medium 8 by a solid immersion lens 3 being the near-field lens. Here, the optical recording medium 8 and the immersion lens 3 are brought into contact with liquid lubricant 1. Then, a reflected light from the medium 8 passes through the immersion lens 3 and the collimating lens 2 to be made incident on a photodiode 5 and it is detected as an electric signal. The medium-side surface of the light source side of this immersion lens 3 is made spherical and the sphericality is designed based on the thickness of a solid lubricant layer 10 on the recording layer of the optical recording medium 8 and the beam diameter of the incident light on the surface of this protective film.