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    5.
    发明专利
    未知

    公开(公告)号：DE1645514A1

    公开(公告)日：1972-03-23

    申请号：DE1645514

    申请日：1967-05-17

    Applicant: TORAY INDUSTRIES

    Inventor： OKAZAKI KAORU ,  NAKAGAWA ASAHARU ,  NAKAYAMA YUZABURO MINAMI ,  SUGII KENJI

    IPC: C08G69/44 ,  C08L67/02 ,  C08G20/20

    Abstract: 1,141,118. Block copolymers. TOYO RAYON K.K. 16 May, 1967 [18 May, 1966; 24 May, 1966], No. 22734/67. Heading C3R. Block copolymers of polyamide and polyester are prepared by heating a solid mixture of polyamide and polyester at a temperature above the second order transition point of the polymer component having the highest second order transition but below the m.p. of the polymer having the lowest m.p. The solid phase reaction may take place at reduced pressure or at atmospheric pressure in an inert gas stream. An intimate mixture of polyamide and polyester is desirable and may be obtained by melt blending the polymers prior to reaction or by dissolving in a solvent and then either distilling off the latter or pouring the resultant solution into a non-solvent liquid. The solid mixture used in the reaction may be a powder or be in the form of chips, pellets or flakes. The polyamide may have M.W. 1000-30,000 and the polyester M.W. 2000-30,000. Although the resultant block copolymers are fibre forming the constituent polyamide and polyester need not be fibre forming. At least 50% of the polyamide terminal groups may be amino or carboxyl and at least 50% of the polyester terminal groups may be hydroxyl. Suitable polyamides are polycapramide, polyhexamethylene adipamide. A suitable polyester is polyethylene terephthalate. Mixing may be achieved by melt blending at 260-320‹ C. for up to 20 minutes; reaction may take place between 150‹ C. and the m.p. of the component having the lowest m.p. Fibres may be obtained by melt spinning. Composite fibres may be obtained by melt-spinning a block copolymer prepared by the process according to the invention with another fibre-forming polymer.

    NONNELECTROLYTIC COPPER PLATING
    9.
    发明专利
    NONNELECTROLYTIC COPPER PLATING 失效

    公开(公告)号：JPS54103748A

    公开(公告)日：1979-08-15

    申请号：JP1080678

    申请日：1978-02-02

    Applicant: TORAY INDUSTRIES

    Inventor： SUGII KENJI ,  IMAMURA SHINZOU ,  FURUYA MASAAKI

    IPC: C23C18/40

    Abstract: PURPOSE:To produce a Cu film excellent in the adhesivity, luster, and color tone with addition of specified imidazole compound to the acid solution in non-electrolytic Cu plating on the iron surface using the acid solution containing Cu ion. CONSTITUTION:With an iron immersed into an acid solution containing CuSO4 or the like in an amount of 0.05 to 8 g/1, preferably 0.1 to 5 g/l, a non-electrolytic Cu plating is applied to the Fe surface under the following condition: Imidazole compound (i.g. 2-mercapto-4, 5, 6, 7-tetrahydrobenzoimidazole and 2-mercaptobenzoimidazole) as shown by the formula I (R represents alkyl group excluding H and C4) and the formula II is allowed to be present at a rate of 0.03 to 0.1 mol per mol of Cu and a plating is performed at a bath temperature of 40 to 80 deg.C for 0.5 to 30 minutes.

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