公开(公告)号：JPH0299513A

公开(公告)日：1990-04-11

申请号：JP25358288

申请日：1988-10-06

Applicant: TORAY INDUSTRIES

Inventor： KAYABA KEIJI ,  TAKUWA SHIRO ,  TANAKA MASAYUKI

IPC: H01L23/29 ,  C08G59/00 ,  C08G59/18 ,  C08L63/00 ,  H01L23/31

Abstract: PURPOSE:To obtain the title composition consisting of epoxy resin, curing agent, silicon oil, PS based block copolymer and inorganic filler, having excellent heat resistance to solder, reliability, mold release characteristics and solveut resistance and useful for a sealing resin. CONSTITUTION:The aimed composition consisting of (A) an epoxy resin (e.g., cresol novolak type epoxy resin), preferably of 5-25wt.%, (B) curing agent (preferably phenol novolak or cresol novolak), preferably of 2-15wt.%, (C) silicon oil [e.g., a compound expressed by the formula (R1-R5 are H, 1-20C alkyl, phenyl or vinyl; X and Y are 1-20C alkyl, phenyl, vinyl, OH, amino, epoxy, etc.; m is >=1; n is >=0)], (D) a PS based block copolymer, preferably of 1-4wt.% and (E) an inorganic filler (preferably fused silica), preferably of 65-85wt.%.

公开(公告)号：JPH0299514A

公开(公告)日：1990-04-11

申请号：JP25358388

申请日：1988-10-06

Applicant: TORAY INDUSTRIES

Inventor： KAYABA KEIJI ,  TAKUWA SHIRO ,  TANAKA MASAYUKI

IPC: C08K3/36 ,  C08G59/00 ,  C08G59/20 ,  C08G59/62 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31

Abstract: PURPOSE:To obtain the title composition containing an epoxy resin having a specific structure, curing agent and fused silica having a specific composition and having excellent heat resistance to solder, reliability and fluidity and useful as a coating, etc. CONSTITUTION:The aimed composition containing (A) an epoxy resin having skeleton expressed by the formula (R -R are H, 1-4C alkyl or halogen), (B) curing agent and (C) fused silica having =40wt.% crushed fused silica having

公开(公告)号：JPH01245014A

公开(公告)日：1989-09-29

申请号：JP7298488

申请日：1988-03-25

Applicant: TORAY INDUSTRIES

Inventor： TANAKA MASAYUKI ,  UENO TOSHIAKI ,  TAKUWA SHIRO

IPC: C09K3/10 ,  C08G59/00 ,  C08G59/42 ,  C08G59/62 ,  C08G63/00 ,  C08K3/00 ,  C08K5/04 ,  C08K7/00 ,  C08K7/16 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31

Abstract: PURPOSE:To obtain the title composition suitable for sealing semiconductor devices for surface mounting, not causing cracks of resin during soldering by blending a main component consisting of an epoxy resin, a curing agent and a specific powdery filler with a specific compound. CONSTITUTION:A main component consisting of (A) an epoxy resin, (B) a curing agent, (C) a powdery filler (preferably fused silica) containing >=50wt.% fine powder particles having