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    POLYBUTYLENE TEREPHTHALATE COMPOSITION
    1.
    发明专利
    POLYBUTYLENE TEREPHTHALATE COMPOSITION 失效

    公开(公告)号：JPS5620048A

    公开(公告)日：1981-02-25

    申请号：JP9553679

    申请日：1979-07-26

    Applicant: TORAY INDUSTRIES

    Inventor： NAKAMURA SEIICHI ,  YAMAMOTO YOSHIYUKI ,  UCHIDA AKIO

    IPC: C08L67/00 ,  C08K5/09 ,  C08K7/18 ,  C08K13/02 ,  C08L67/02

    Abstract: PURPOSE:Titled composition which is designed for producing precision parts having excellent dimentional accuracy by adding a combination of a polyorganosiloxane, a powdery inorganic substance and an aliphatic carboxylic acid metal salt to polybutylene terephthalate. CONSTITUTION:To polybutylene terephthalate are added 0.001-5wt% of apolyorganosiloxane such as methylpolysiloxane, 0.01-5wt% of a powdery inorganic substance such as talc or wollastonite and 0.002-5pts.wt. of an aliphatic carboxylic acid metal salt such as lead stearate or aluminum stearate. EFFECT:The composition thus produced shows uniform plasticization, good mold- release and uniform and rapid crystallization, provides molded products differing extremely little in dimentional accuracy among injection-molded shots, and shortens the molding cycle.

    RESIN COMPOSITION
    5.
    发明专利
    RESIN COMPOSITION 失效

    公开(公告)号：JPS5521461A

    公开(公告)日：1980-02-15

    申请号：JP9466078

    申请日：1978-08-04

    Applicant: TORAY INDUSTRIES

    Inventor： AYA TOSHIHIKO ,  KUBO YASUSHI ,  UCHIDA AKIO

    IPC: C08L77/10 ,  C08L79/08 ,  H01B3/30

    Abstract: PURPOSE:To prepare a resin composition of good balance of melt processing characteristics with mechanical strength, by melt blending of a polyphenylenesulfide resin with a polyamide-imide resin consisting mainly of a specific recurring structural unit in a specific proportion. CONSTITUTION:The objective resin composition can be prepared by melt blending of (A) 50-99.9 parts by wt. of a polyamide-imide resin consisting of (a) pref. 70- 100 mole% of a recurring unit of formula I (Ar is a trivalent aromatic group containing one or more six-membered rings, R is a divalent aromatic or aliphatic residue; R' is H, methyl, or phenyl), and (b) pref. less than 30 mole% of a polyamide and/or polyimide unit of formula II or III, with (B) 0.1-50 parts by wt. of a polyphenylenesulfide resin. EFFECT:Capable of providing molded products having good electrical properties and sliding characteristics, high heat and solvent resistance, etc. USE:Various parts for automobiles, electrical and electronics application, etc.

    POLYAMIDEEIMIDE RESIN COMPOSITION
    10.
    发明专利
    POLYAMIDEEIMIDE RESIN COMPOSITION 失效

    公开(公告)号：JPS5521462A

    公开(公告)日：1980-02-15

    申请号：JP9466178

    申请日：1978-08-04

    Applicant: TORAY INDUSTRIES

    Inventor： AYA TOSHIHIKO ,  KUBO YASUSHI ,  UCHIDA AKIO

    IPC: C08L79/08 ,  C08L1/00 ,  C08L27/00

    Abstract: PURPOSE:To prepare a new resin composition of good balance of flow properties with mechanical properties, by melt blending of a polyphenylenesulfide resin, a filler, and a polyamide-imide resin consisting mainly of a specific recurring structural unit in a specific proportion. CONSTITUTION:The objective resin composition can be prepared by melt blending of (A) 5-90 parts by wt. of a polyamide-imide resin consisting of (a) pref. 70-100 mole% of a recurring unit of formula I (Ar is a trivalent aromatic group containing one or more six-membered rings; R is a divalent aromatic or aliphatic residue; R' is H, methyl, or phenyl), and (b) pref. less than 30 mole% of a polyamide and/or polyimide unit(s) of formula II or III, (B) 10-70 parts by wt. of a filler such as wear resistance enhancing agent, reinforcer, flame-retardancy improver, electrical properties improver, or thermal conductivity enhancing agent, and (C) 0.1-50 parts by wt. of a polyphenylenesulfide resin.

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