公开(公告)号：JPH09237950A

公开(公告)日：1997-09-09

申请号：JP4291496

申请日：1996-02-29

Applicant: TOSHIBA CORP

Inventor： YAMAMOTO YOSHIE

IPC: H05K1/11 ,  H05K1/03 ,  H05K3/42

Abstract: PROBLEM TO BE SOLVED: To provide a highly reliable printed board and a method for manufacturing it wherein short-circuiting between through holes is prevented even if a large number of the through holes are formed on the printed board with a small pitch. SOLUTION: A printed board has through holes 14 formed on the main board 11 made of epoxy resin 13 containing glass fibers 12 therein. Penetrating holes 15 are formed the printed board 11, and a conductive layer 17 is formed on the inside wall of the penetrating holes 15 with an insulating layer 16 therebetween. This prevents moisture from entering from the inside wall of the penetrating holes 15 into the printed board 11, and thus controls the ion migration phenomenon.

公开(公告)号：JPH0536760A

公开(公告)日：1993-02-12

申请号：JP18789891

申请日：1991-07-26

Applicant: TOSHIBA CORP

Inventor： YAMAMOTO YOSHIE ,  MOTOMIYA AKINORI ,  SAITO MASAYUKI

IPC: H01L21/60 ,  H01L21/603 ,  H05K1/09 ,  H05K1/18 ,  H05K3/32 ,  H05K3/40

Abstract: PURPOSE:To provide an electronic circuit device wherein a firm and high- reliability connection is executed by utilizing a face-down mounting operation. CONSTITUTION:A circuit board which is provided with a wiring layer 2 formed of a conductive material containing a thermoplastic resin is used as a thermoplastic resin board 1; a structure wherein a bump electrode 4 for an electronic element chip 3 is pressure-bonded and connected to the wiring layer 2 in a state that the electrode has been buried in the wiring layer is formed.

公开(公告)号：JPH03154344A

公开(公告)日：1991-07-02

申请号：JP29437189

申请日：1989-11-13

Applicant: TOSHIBA CORP

Inventor： YAMADA HIROSHI ,  SAITO MASAYUKI ,  YAMAMOTO YOSHIE ,  SUDO TOSHIO

IPC: H01L21/60 ,  H01L21/321 ,  H01L23/12 ,  H01L23/29 ,  H01L23/31

Abstract: PURPOSE:To obtain a reliable resin-sealed semiconductor element which is able to contrive high density packaging and its easy handling by forming bump electrodes to provide them at least on one main surface of a resin layer which seals the mainframe of the semiconductor element. CONSTITUTION:A resin-sealed semiconductor element 1 which constructs the mainframe 2 of its element by sealing it with resin is formed in such a way as to allow bump electrodes to protrude toward the surface of a covering and sealing layer 3b with resin and both covering and sealing layers with resin 3b and 3a cover and seal respectively surroundings of the mainframe 2 of the element at the prescribed thickness. In this way, the surroundings of the mainframe 2 of its element are thinly covered and sealed with resin. Since the bump electrodes 6 are exposed out of the covering and sealing layers 3a and 3b with resin and these electrodes act as external connecting terminals, its configuration makes this element compact. As the resin layers 3a and 3b, therefore, cover and seal the mainframe 2 of the element, moisture resistance is improved. This approach enables the element to contrive high density packaging and its easy handling.

公开(公告)号：JPH09232377A

公开(公告)日：1997-09-05

申请号：JP3987196

申请日：1996-02-27

Applicant: TOSHIBA CORP

Inventor： YAMAMOTO YOSHIE

IPC: G02F1/1345 ,  G09F9/00 ,  H01L21/60 ,  H01L23/50 ,  H05K1/14 ,  H05K3/36

Abstract: PROBLEM TO BE SOLVED: To provide mounting structure by which an LSI for liquid crystal drive can be mounted in a liquid crystal display panel, even if narrowing of the pitches of wiring electrodes of a liquid crystal display panel makes progress, and a manufacturing method the mounting structure. SOLUTION: This structure is equipped with a first flexible board 17a which has a wiring pattern 19 corresponding to the alternate arrangement of the electrodes 13 and 16 out of a plurality of electrodes 13 of a liquid crystal display panel 11 and a plurality of electrodes 16 of an LSI 114 for drive of a liquid crystal and connects the said electrodes with each other, and a second flexible board 17b which is stacked on the first flexible board 17a and has a wiring pattern 22 corresponding to the wiring pattern of the residual electrodes 13 and 16 and connects the remaining electrodes, and this connects these wiring patterns to the plural electrodes 16 of the LSI 14 for drive of a liquid crystal.

公开(公告)号：JPH0757967A

公开(公告)日：1995-03-03

申请号：JP20380993

申请日：1993-08-18

Applicant: TOSHIBA CORP

Inventor： ITO HISASHI ,  YAMAMOTO YOSHIE ,  ABE KAZUHIDE ,  KOMATSU SHUICHI

IPC: C23F1/00 ,  H01G4/10 ,  H01G4/33

Abstract: PURPOSE:To conduct patterning conveniently while ensuring an appropriate level difference by forming a conductive layer and an oxide layer of perovskite- type structure sequentially on a base substrate and then etching the oxide layer selectively using an ethylene diamine tetraacetate-NH4OH-H2O solution. CONSTITUTION:A first conductive layer 2 and a dielectric layer 3 of SrTiO3 are formed sequentially on a base substrate 1. A resist 4 is formed thereon and the dielectric layer 3 of SrTiO3 is etched into a desired pattern using an ethylene diamine tetraacetate-NH4OH-H2O2-H2O solution. An opening 5 is then made in the SrTiO3 film as a part for leading out the first conductive layer 2. Furthermore, a second conductive layer 6 is formed on the dielectric layer 3 and a part 7 for leading out the first conductive layer 2 is patterned at the opening 5 thus completing a thin film capacitor 8.

公开(公告)号：JPH0555301A

公开(公告)日：1993-03-05

申请号：JP21362091

申请日：1991-08-26

Applicant: TOSHIBA CORP

Inventor： YAMAMOTO YOSHIE ,  MOTOMIYA AKINORI ,  SAITO MASAYUKI

IPC: H01L21/60

Abstract: PURPOSE:To provide an electronic circuit device on which electronic parts can be face-down mounted on a wiring substrate without forming a bump electrode on the electronic parts such as an IC chip and the like, and to cut down the manufacturing cost. CONSTITUTION:In an electronic circuit device on which an IC chip 20 is face- down mounted on a wiring substrate 10, after a conductive layer 12, consisting of a thermoplastic resin composition, has been formed in a prescribed pattern on an insulating layer 11 consisting of a thermoplastic composition, an insulating layer 13, consisting of a thermoplastic resin composition and having an opening on a part of the conductive layer 12, is formed on the insulating layer 11 and the conductive layer 12. Then, a wiring substrate 10, on which the conductive layer 12 is exposed on the main surface on the side of an insulating layer 13 by pressing the layers 11 to 13 to the direction of lamination, is formed. Subsequently, an IC chip 20 is mounted on the wiring substrate 10 is such a manner that the electrode surface 21 is mated to the conductive layer 12 exposed to the above-mentioned main surface, and then the IC chip 20 is pressure-welded by heat to the wiring substrate 10.

公开(公告)号：JPH06227188A

公开(公告)日：1994-08-16

申请号：JP2007593

申请日：1993-02-08

Applicant: TOSHIBA CORP

Inventor： MOTOMIYA AKINORI ,  YAMAMOTO YOSHIE ,  SAITO MASAYUKI

IPC: B42D15/10 ,  G06F15/02 ,  G06K19/077 ,  G11C5/00

Abstract: PURPOSE:To provide an electronic circuit device which is a thin type without damaging portability and allows the increase in the number of built-in and packaged semiconductor memories so that the memory capacity is enlarged, the stress concentration at connections can be eliminated or avoided, and the high reliability of its memory function is maintained. CONSTITUTION:A device is equipped with: a main distributing board 4, more than one flexible distributing board 5 arranged slantly while one end of it being electrically connected with the main surface of the main distributing board 4, semiconductor memories 6 packaged on each flexible distributing board 5, a connector 7 attached on the main distributing board 4, and an housing 8 in which the main distributing board 4 attached with the flexible distributing boards 5 with the connector 7 exposed.

公开(公告)号：JPH02122408A

公开(公告)日：1990-05-10

申请号：JP27469488

申请日：1988-10-31

Applicant: TOSHIBA CORP

Inventor： OSAWA YUICHI ,  YAMAMOTO YOSHIE

IPC: G11B5/23

Abstract: PURPOSE:To obviate the oxygen transfer from a core and to prevent the generation of the nonmagnetization of the core by forming an oxygen excess layer on the surface of the core with which a magnetic metallic material is brought into contact. CONSTITUTION:The surface of the core with which the magnetic metallic material is brought into contact is subjected to the treatment to form the oxygen excess layer 22 and thereafter, the magnetic metallic material layer 23 and a magnetic gap 24 are formed. The oxygen is supplied from the oxygen excess layer 22 at the time of heating to execute glass welding of the core by subjecting the surface of the core with which the magnetic metallic material is brought into contact to the treatment to form the oxygen excess layer 22 in such a manner. The oxygen transfer from the core is obviated in this way and the generation of the nonmagnetization of the core is prevented. The magnetic head having the good reproducing characteristics is thus obtd.

公开(公告)号：JPH02289907A

公开(公告)日：1990-11-29

申请号：JP11059689

申请日：1989-04-28

Applicant: TOSHIBA CORP

Inventor： YAMAMOTO YOSHIE

IPC: G11B5/127

Abstract: PURPOSE:To prevent the expansion of fine cracks and the degradation in mechanical strength and to obtain the magnetic head having high reliability by dissolving away the fine cracks on the surface of a joint part by a chemical treatment. CONSTITUTION:A pair of blocks 11a, 11b consisting of magnetic materials are integrally joined by heating and melting of glass and thereafter, the surface of the glass is dissolved away by the chemical treatment. For example, the ferrite blocks 11 are immersed for one hour in a satd. soln. 17 of heated sodium hydroxide to dissolve the surface of the joint part 16 and to remove the fine cracks generated on the surface of the joint part 16. The mechanical strength of the joint part is maintained in this way and the destruction of the magnetic head by the expansion of the cracks is prevented. The reliability is thus improved.

公开(公告)号：JPH02165403A

公开(公告)日：1990-06-26

申请号：JP32028988

申请日：1988-12-19

Applicant: TOSHIBA CORP ,  TOSHIBA AUDIO VIDEO ENG

Inventor： YAMAMOTO YOSHIE ,  MATSUZAKI MIKI

IPC: G11B5/187 ,  G11B5/23

Abstract: PURPOSE:To effectively prevent the ferromagnetic oxide parts, which constitute cores, from being exposed to tape contact surfaces and to obtain good head characteristics by making the front surfaces of the nonmagnetic parts of sub- cores to form the tape contact surfaces and removing the ferromagnetic oxide parts exposed on the tape contact parts. CONSTITUTION:Nonmagnetic substrates 32 are adhered by high melting glass atop a pair of magnetic material blocks 31 consisting of the ferromagnetic oxide, such as, for example, ferrite, to constitute a pair of the sub-cores 33. The front surfaces of the nonmagnetic substrates 32 of the sub-cores 33 are made to form the tape contact surfaces 36 and the magnetic material blocks 31 which are the ferromagnetic oxide exposed on the tape contact surfaces 36 are removed. The magnetic material blocks 31 which are the ferromagnetic oxide constituting the sub-cores 33 are effectively prevented from being exposed on the tape contact surfaces in this way and the good head characteristics are obtd.