METHOD FOR BONDING
    3.
    发明专利

    公开(公告)号:JPS613417A

    公开(公告)日:1986-01-09

    申请号:JP12368884

    申请日:1984-06-18

    Applicant: TOSHIBA KK

    Abstract: PURPOSE:To effect bonding to the plural bonding positions having differences in height automatically with accuracy at a high speed by focusing a TV camera so as to make a quantity of discrepancy of focus zero which is calculated by collation of an image pick-up output signal with a reference signal. CONSTITUTION:A pattern recognition circuit 23 collates a binary signal pattern of an image of a substance to be bonded 16 picked up by a TV camera 11 with a reference pattern which is stored previously and calculates a quantity of discrepancy in position. From this quantity, a real position is detected and bonding is effected automatically. In this case, the control process is included which includes the program that a quantity of position discrepancy is calculated by collating an image pick-up output signal of the predetermined position of substrance 16 with the previously stored reference signal at a time of when an image of substance to be bonded 16 is picked up and positioning of the TV camera in Z-axis direction and focusing of an optical lens of the TV camera 11 are carried out so that the above quantity becomes zero.

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