公开(公告)号：JPS60262433A

公开(公告)日：1985-12-25

申请号：JP11820184

申请日：1984-06-11

Applicant: TOSHIBA KK

Inventor： YAMAGUCHI MASAYOSHI ,  KASHIMA NORIYASU ,  YOKOI KIYOTAKE ,  CHIBA KOUICHI ,  KANEDA KATSUHIKO

IPC: H01L21/52 ,  H01L21/58 ,  H01L21/60

Abstract: PURPOSE:To perform die bonding or wire bonding by providing a bonding material supply head, by providing a component fitting head and a wire bonding head on an X-Y table, by collating a pick-up output of a TV camera with a standard to correct deviations, and by conduct switching automatically according to the correction. CONSTITUTION:A position to which a component is fitted is detected automatically, a supply head is guided to a normal position, and a bonding material is supplied therefrom. Thereafter a circuit board is conveyed to a position at which it is fitted with components. A TV camera 9, a turret-type fitting head and a wire bonding head 23 are fitted on a block 21 which is fixed on an X-Y table. A pick-up output of the TV camera 9 is collated with a standard, deviations, if any, are corrected automatically, a desired head is selected to be fitted with a component. Next, when said board is forwarded under the bonding head 23, a wire is guided from a spool 20, via a guide 24, to a capillary 27 fixed to an arm 28 forming a supersonic horn, through the intermediary of clampers 25 and 26, and the head 23 is moved vertically to execute wire bonding. By this constitution, bonding dropping, component fitting and wire bonding can be executed sequentially and consecutively in a full-automatic and efficient manner.

公开(公告)号：JPS60262432A

公开(公告)日：1985-12-25

申请号：JP11820084

申请日：1984-06-11

Applicant: TOSHIBA KK

Inventor： NEMOTO TOSHIYA ,  YAMAGUCHI MASAYOSHI ,  KASHIMA NORIYASU ,  YOKOI KIYOTAKE ,  CHIBA KOUICHI ,  KANEDA KATSUHIKO

IPC: H01L21/52 ,  H01L21/58

Abstract: PURPOSE:To obtain a mounting system applying a bonding material smoothly in a full-automatic manner by a constitution wherein informations obtained by picking up by a camera set on a supply head are collated with standards to calculate positional deviations and the head is driven to a proper position so as to supply the bonding material. CONSTITUTION:When circuit boards 21 and 22 get from a magazine 2 to positions under a supply head 5 installed on an X-Y table 26, marks 23 and 24 are picked up by a TV camera 6, subjected to image processing 30 and then inputted to CPU28, wherein they are collated with standards to calculate deviations. Based on this calculation, the head 5 is moved to a proper position, and Ag paste is injected to drip from a needle 26 positioned at the end of a cylinder 25, by controlling a solenoid-operated valve 29. According to this construction, the Ag paste can be supplied onto the boards in a successive and full-automatic manner, and the productivity is further improved to a great extent by incorporating a chip fitting process also into the same process.

公开(公告)号：JPS60182730A

公开(公告)日：1985-09-18

申请号：JP3806484

申请日：1984-02-29

Applicant: TOSHIBA KK

Inventor： CHIBA KOUICHI ,  TERASAKA YOSHIO

IPC: H01L21/603 ,  H01L21/60 ,  H01L21/607

Abstract: PURPOSE:To solidify connection by turning back and doubling a wire projecting from a capillary and contact-bonding the wire onto a lead frame when a semiconductor pellet is die-bonded onto a substrate and a pad fitted to the semiconductor pellet is wire-bonded with the lead frame similarly mounted onto the substrate. CONSTITUTION:A semiconductor pellet 2 is die-bonded on a substrate 1, and a ball 7 at the tip of a bonding wire 5 penetrated through and projected from a capillary 6 is fixed to a bonding pad 3 fitted to the semiconductor pellet. The wire 5 is positioned on a lead frame 4 similarly mounted onto the substrate 1 while being pulled out of the capillary 6, and the capillary 6 is pushed up and the wire 5 is contact-bonded onto the frame 4. The capillary 6 is returned slightly in the original direction and the wire 6 is superposed doubly at that time, and the capillary 6 is returned to a fixed position and the doubling wire 5 is contact- bonded with the frame 4.

公开(公告)号：JPS5988841A

公开(公告)日：1984-05-22

申请号：JP19859582

申请日：1982-11-12

Applicant: TOSHIBA KK

Inventor： YAMAGUCHI MASAYOSHI ,  CHIBA KOUICHI ,  ATSUMI KOUICHIROU ,  YOKOI KIYOTAKE ,  KASHIMA NORIYASU

IPC: H01L21/60

Abstract: PURPOSE:To perform stable loop control constantly by arranging a linear motor and a fine adjustment mechanism for adjusting clamping force by controlling current, on an upper wire clamp. CONSTITUTION:A wire 5 is held between clamp flaps 4a and 4b and a movable coil 22 of a linear motor having a magnetic circuit 21 is made conductive electrically and flaps 4a and 4b attached to the coil clamp the wire 5 and then a clamping force is measured by a proper means. If it is impossible to set the force at desired value by fine adjustment of current, a spindle 27a is moved back while watching a scale of a micrometer head 27 to set it at a desired value and a leaf spring 26 is fixed by a screw 30. Ths constitution enables fine adjustment of clamping force by unit of 1gr and constantly stable loop control.

公开(公告)号：JPS60182147A

公开(公告)日：1985-09-17

申请号：JP3712984

申请日：1984-02-28

Applicant: TOSHIBA KK

Inventor： CHIBA KOUICHI ,  TERASAKA YOSHIO

IPC: H01L21/60

Abstract: PURPOSE:To prevent the adjoining bonding wires to come in contact with each other by a method wherein, in an area which is electrically independent, a wire bonding operation is performed in the direction where a new bonding will be conducted. CONSTITUTION:An electrically independent area 6 consisting of a metal foil of the same material as lead frames 4a and 4b is provided in advance in parallel with the side 2b of a semiconductor chip 2. After the bonding operation for the final bonding pad 3a along a side 2a and the lead frame 4a has been finished, the direction of bonding operation of a capillary is changed to the direction of bonding operation between a bonding pad 3b along the side 2b and the lead frame 4b, and a bonding operation is performed in the area 6. Subsequently, a wire bonding between the bonding pad 3b and the lead frame 4b is conducted along the side 2b.

公开(公告)号：JPS5973294A

公开(公告)日：1984-04-25

申请号：JP18129582

申请日：1982-10-18

Applicant: Toshiba Kk

Inventor： CHIBA KOUICHI ,  TSURUTA TOSHIROU

IPC: B25J17/00

公开(公告)号：JPS60182146A

公开(公告)日：1985-09-17

申请号：JP3712884

申请日：1984-02-28

Applicant: TOSHIBA KK

Inventor： CHIBA KOUICHI ,  SAKAMOTO TSUGIO ,  TERASAKA YOSHIO

IPC: H01L21/603 ,  H01L21/60

Abstract: PURPOSE:To automatically set the off-center quantity in a short period by a method wherein the position of a ball is determined by performing a pattern recognition, and the center corresponding to the bonding position of an optical readout part is coincided with the position of the ball. CONSTITUTION:In the case of a pattern recognition device 12, an optical leading part 15 reads out a picture pattern, a pattern discriminating part 16 distinguishes the pattern of a gold ball, and the position of the gold ball is computed by a position recognizing part 17 taking into consideration of the distance of movement of an X-Y table device 10 and the position of the picture pattern in visual field. The distance between said position of the gold ball and the center part corresponding to the bonding position of the optical reading part 15 which was set in advance in calculated, the optical reading part 15 is shifted in the amount of the above-mentioned distance by the X-Y table device 10, and its center part is coincided with the position of the gold ball. The off-center quantity is set by an off-center quantity setting device 13.

公开(公告)号：JPS6030119A

公开(公告)日：1985-02-15

申请号：JP13847483

申请日：1983-07-28

Applicant: TOSHIBA KK

Inventor： CHIBA KOUICHI ,  TERASAKA YOSHIO ,  SASAOKA KENJI

IPC: H01L21/68 ,  H01L21/02 ,  H01L21/67

Abstract: PURPOSE:To identify patterns accurately and avoid eroneous wire bonding by a method wherein identification marks are provided in or near the bonding pads and bonding positions are determined by the pattern identification of those marks. CONSTITUTION:Near a bonding pad 4 of a group of bonding pads 4 positioned at a far end, an identification mark 7 for pattern identification is provided. The identification mark 7 is provided also near a bonding pad 4 of the bonding pads in a facing row also positioned at the far ends. When a leadframe on a substrate and the bonding pads 4 are wire-bonded with wires such as gold wires, the identification mark 7 provided near the bonding pad 4 formed on a semiconductor pellet 3 is read by a TV camera and the like for pattern identification to determine the bonding position and the leadframe and the bonding pads 4 are wire-bonded by a bonder.

公开(公告)号：JPS613418A

公开(公告)日：1986-01-09

申请号：JP12368984

申请日：1984-06-18

Applicant: TOSHIBA KK

Inventor： KANEDA KATSUHIKO ,  CHIBA KOUICHI ,  KASHIMA NORIYASU

IPC: H01L21/677 ,  H01L21/52 ,  H01L21/58 ,  H01L21/67 ,  H01L21/68

Abstract: PURPOSE:To enable the safe and accurate teaching of the pick-up position of semiconductor chips which requires no skill by calculating a quantity of position discrepancy by collating the data of an image picked up by a TV camera with the reference data. CONSTITUTION:A means for arranging semiconductor chips 7 in trays 13 with the predetermined state and a means for arranging plural trays 13 in stockers 14 with the predetermined state are provided. Then the operation process including the program that a quantity of position discrepancy is calculated by collating the data of an image of the predetermined position of said stocker 14 picked up by a TV camera 9 with the previously stored reference data and the program that based on the above quantity, the semiconductor chips 7 of the first tray 13 to be arranged in the stocker 14 are took out in order by a pick-up tool and the chips 7 of the second tray 13 are took out in order and a means for transporting the took-out chips 7 to the mounting position automatically are provided.

公开(公告)号：JPS613417A

公开(公告)日：1986-01-09

申请号：JP12368884

申请日：1984-06-18

Applicant: TOSHIBA KK

Inventor： CHIBA KOUICHI ,  KANEDA KATSUHIKO ,  YAMAGUCHI MASAYOSHI ,  NEMOTO TOSHIYA ,  SUEMATSU MUTSUMI ,  FUJITA NOBUYUKI ,  TAMAI KOUICHI

IPC: H01L21/52 ,  H01L21/58 ,  H01L21/60

Abstract: PURPOSE:To effect bonding to the plural bonding positions having differences in height automatically with accuracy at a high speed by focusing a TV camera so as to make a quantity of discrepancy of focus zero which is calculated by collation of an image pick-up output signal with a reference signal. CONSTITUTION:A pattern recognition circuit 23 collates a binary signal pattern of an image of a substance to be bonded 16 picked up by a TV camera 11 with a reference pattern which is stored previously and calculates a quantity of discrepancy in position. From this quantity, a real position is detected and bonding is effected automatically. In this case, the control process is included which includes the program that a quantity of position discrepancy is calculated by collating an image pick-up output signal of the predetermined position of substrance 16 with the previously stored reference signal at a time of when an image of substance to be bonded 16 is picked up and positioning of the TV camera in Z-axis direction and focusing of an optical lens of the TV camera 11 are carried out so that the above quantity becomes zero.