A FORKED PROBE FOR TESTING SEMICONDUCTOR DEVICES
    1.
    发明申请
    A FORKED PROBE FOR TESTING SEMICONDUCTOR DEVICES 审中-公开
    用于测试半导体器件的激光探测器

    公开(公告)号:WO2009035456A3

    公开(公告)日:2009-09-24

    申请号:PCT/US2007078433

    申请日:2007-09-13

    Inventor: ISMAIL SALLEH

    CPC classification number: G01R1/06727 G01R1/07342

    Abstract: A novel forked probe design for use in a novel probe card is presented that comprises a forked bending element that more efficiently stores displacement energy. Specifically, the novel probe card comprising a substrate and a forked probe connected to the substrate. The forked probe includes a base that is connected to the substrate and a forked bending element connected to the base, wherein the forked bending element comprises at least a first prong connected to a second prong through a prong connecting structure and a handle connected to the prong connecting structure. Connected to the first prong is the probe tip that is adapted to make contact with the DUT. Refinements to the probe card include that the first and second prongs are adapted to bend such that each prong elastically stores a portion of the displacement energy when the probe tip contacts the DUT. Also, the forked bending element may be manufactured using photolithography and using layered photolithography. Each prong may be comprised of different materials. And the forked bending element may be comprised of a nickel alloy. Also, the first prong may be constructed to be stiffer than the second prong, which may yield a shorter scrub length. The stiffness of the prongs may be manipulated by altering the geometry and/or material of the prongs.

    Abstract translation: 提出了一种用于新型探针卡的新颖的分叉探针设计,其包括更有效地存储位移能量的叉形弯曲元件。 具体地说,该新颖的探针卡包括一个基片和一个与基片相连的叉形探针。 叉形探头包括连接到基底的基座和连接到基座的叉形弯曲元件,其中叉形弯曲元件至少包括通过插脚连接结构连接到第二插脚的第一插脚和连接到插脚的手柄 连接结构。 连接到第一个插脚是适于与DUT接触的探头。 对探针卡的细化包括第一和第二插脚适于弯曲,使得当探针尖端接触DUT时,每个插脚弹性地存储位移能量的一部分。 此外,叉形弯曲元件可以使用光刻法和使用分层光刻法来制造。 每个插脚可能由不同的材料组成。 并且叉形弯曲元件可以由镍合金构成。 此外,第一个插脚可以被构造成比第二个插脚更硬,这可能产生较短的擦拭长度。 可以通过改变插脚的几何形状和/或材料来操纵插脚的刚度。

    LATERAL INTERPOSER CONTACT DESIGN AND PROBE CARD ASSEMBLY
    2.
    发明申请
    LATERAL INTERPOSER CONTACT DESIGN AND PROBE CARD ASSEMBLY 审中-公开
    横向插针接触设计和探针卡组件

    公开(公告)号:WO2008069967A3

    公开(公告)日:2008-10-30

    申请号:PCT/US2007024631

    申请日:2007-11-30

    Abstract: The present invention is directed to an interposer having an interposer substrate with an upper surface and a lower surface and at least one resilient contact element having an upper portion and a lower portion. The upper portion extends in a substantially vertical fashion above the upper surface of said interposer substrate, and the lower portion extends in a substantially vertical fashion below the lower surface of said interposer substrate. The upper and lower portions of the resilient contact element are substantially resilient in a direction parallel to the substrate.

    Abstract translation: 本发明涉及一种中介层,其具有带有上表面和下表面的中介层基底以及具有上部和下部的至少一个弹性接触元件。 上部以基本垂直的方式在所述插入基板的上表面上方延伸,并且下部在所述插入基板的下表面下方以基本垂直的方式延伸。 弹性接触元件的上部和下部在平行于基板的方向上基本上是弹性的。

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