公开(公告)号：WO2007040668A3

公开(公告)日：2009-04-16

申请号：PCT/US2006021938

申请日：2006-06-06

Applicant: TOUCHDOWN TECHNOLOGIES INC

Inventor： YABUKI RICHARD

IPC: H01L23/48 ,  H01L21/44

CPC classification number: G01R1/06744 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/1134 ,  H01L2224/13078 ,  H01L2224/1308 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/13684 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/14 ,  H01R13/24 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

Abstract: A method for providing bump structures (202) that can be formed by conventional stud bump bonding techniques is disclosed. The bumps (210), (225), (230), (235) can be arranged in a buttressed configuration that allows for substantial lateral and vertical contact loads, and substantial heights. A side-by-side configuration may be used to build a stacked bump contact that is substantially taller and stronger than is possible under current techniques. Other arrangements can be selected to optimize the load bearing capacity in any direction or combination of directions.

Abstract translation: 公开了一种用于提供可以通过常规的柱形凸块接合技术形成的凸块结构（202）的方法。 凸起（210），（225），（230），（235）可以布置成支撑构造，其允许实质的横向和垂直接触负载以及实质高度。 可以使用并排配置来构建比当前技术下可能的基本上更高和更强的堆叠凸点接触。 可以选择其他布置来优化任何方向或方向组合的承载能力。

公开(公告)号：WO2008069967A3

公开(公告)日：2008-10-30

申请号：PCT/US2007024631

申请日：2007-11-30

Applicant: TOUCHDOWN TECHNOLOGIES INC

Inventor： KINGHORN DAVID ,  GARABEDIAN RAFFI ,  YABUKI RICHARD ,  ISMAIL SALLEH

IPC: G01R1/073

CPC classification number: G01R1/07378 ,  H01R12/52 ,  H01R13/24 ,  H01R13/2435 ,  H01R13/2464 ,  H01R13/2485 ,  H05K3/325

Abstract: The present invention is directed to an interposer having an interposer substrate with an upper surface and a lower surface and at least one resilient contact element having an upper portion and a lower portion. The upper portion extends in a substantially vertical fashion above the upper surface of said interposer substrate, and the lower portion extends in a substantially vertical fashion below the lower surface of said interposer substrate. The upper and lower portions of the resilient contact element are substantially resilient in a direction parallel to the substrate.

Abstract translation: 本发明涉及一种中介层，其具有带有上表面和下表面的中介层基底以及具有上部和下部的至少一个弹性接触元件。 上部以基本垂直的方式在所述插入基板的上表面上方延伸，并且下部在所述插入基板的下表面下方以基本垂直的方式延伸。 弹性接触元件的上部和下部在平行于基板的方向上基本上是弹性的。