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    Filling materials and methods of filling through holes for improved adhesion and hermeticity in glass substrates and other electronic components
    2.
    发明授权
    Filling materials and methods of filling through holes for improved adhesion and hermeticity in glass substrates and other electronic components 有权
    填充材料和填充孔的方法，以提高玻璃基板和其他电子部件的粘合性和密封性

    公开(公告)号：US09337060B1

    公开(公告)日：2016-05-10

    申请号：US14568879

    申请日：2014-12-12

    Applicant: Triton Microtechnologies

    Inventor： Tim Mobley ,  Roupen Leon Keusseyan

    IPC: H01L21/48 ,  H05K3/40 ,  H01L23/08 ,  H01L23/15 ,  H05K1/03

    CPC classification number: H01L21/486 ,  H01L21/4803 ,  H01L23/08 ,  H01L23/15 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/14 ,  H05K1/0306 ,  H05K3/4038 ,  H01L2924/00

    Abstract: A glass substrate and method of processing the glass substrate for use in semi-conductor packaging applications. The glass substrate has top surface and a bottom surface. At least one through-hole extends from the top surface to the bottom surface of the glass substrate. At least one interior layer is disposed inside the through-hole. At least one external layer is disposed on the top surface and at least one external layer is disposed on the bottom surface. The through holes of the glass substrate are filled with a metallized paste material using thick film technology. The glass substrate is planarized after metallization to clean and flatten a surface of the glass substrate. The surface of the glass substrate is coated with at least one redistribution layer of a metal, a metal oxide, an alloy, a polymer, or a combination thereof. The paste material has improved adhesion to the through-holes. The filled through-holes are hermetic and have a low resistivity.

    Abstract translation: 玻璃基板和用于半导体封装应用的玻璃基板的加工方法。 玻璃基板具有顶表面和底表面。 至少一个通孔从玻璃基板的顶表面延伸到底表面。 至少一个内层设置在通孔的内部。 至少一个外层设置在顶表面上，并且至少一个外层设置在底表面上。 使用厚膜技术，用金属化的糊料填充玻璃基板的通孔。 在金属化之后，玻璃基板被平坦化，以清洁和平坦化玻璃基板的表面。 玻璃基板的表面涂覆有金属，金属氧化物，合金，聚合物或其组合的至少一个再分配层。 糊料材料具有改善的对通孔的粘附性。 填充的通孔是密封的并且具有低电阻率。

    Low cost and high performance bonding of wafer to interposer and method of forming vias and circuits
    5.
    发明授权
    Low cost and high performance bonding of wafer to interposer and method of forming vias and circuits 有权
    晶片与插入件的低成本和高性能结合以及形成通孔和电路的方法

    公开(公告)号：US09111917B2

    公开(公告)日：2015-08-18

    申请号：US13666089

    申请日：2012-11-01

    Applicant: TRITON MICROTECHNOLOGIES

    Inventor： Tim Mobley

    IPC: H01L21/48 ,  H01L23/15

    CPC classification number: H01L21/486 ,  H01L23/15 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A low cost and high performance method for bonding a wafer to an interposer is provided. The technology provides designs and metallization techniques for through via glass applications that is thermal coefficient expansion matched to the glass or synthetic fused quartz substrates. An off-the-shelf glass, such as borosilicate based or Fused Synthetic Quartz, is used with a thick film Cu or Ag and/or a Sodium Ion Enriched (SIE) coating or glass, which may be applied or fired onto the substrate or wafer. Polymer based coatings can be applied in a sequential build-up process for purposes of redistribution of signals from a silicon integrated circuit to the opposite side of the substrate or wafer. Additionally, metallizations can be applied on top of the polymers and patterned to create a multilayer circuit.

    Abstract translation: 提供了一种用于将晶片接合到插入件的低成本和高性能的方法。 该技术提供了通过玻璃应用的设计和金属化技术，其是与玻璃或合成熔凝石英基板匹配的热系数膨胀。 使用诸如硼硅酸盐或熔融合成石英的现成玻璃与厚膜Cu或Ag和/或钠离子富集（SIE）涂层或玻璃一起使用，其可以施加或烧制到基底上，或 晶圆。 基于聚合物的涂层可以以顺序建立过程施加，用于将信号从硅集成电路重新分配到衬底或晶片的相对侧。 另外，金属化可以施加在聚合物的顶部并被图案化以产生多层电路。

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