公开(公告)号：JPH0367534B2

公开(公告)日：1991-10-23

申请号：JP10367685

申请日：1985-05-17

Applicant: UBE INDUSTRIES

Inventor： KUNIMOTO AKIHIRO ,  TAKABAYASHI SEIICHIRO ,  MATSUI JUJI ,  SHIRASAKI YASUYUKI

IPC: C08G73/00 ,  C08G73/10 ,  C08J5/18 ,  C09J7/00 ,  C09J179/08

公开(公告)号：JP2571484B2

公开(公告)日：1997-01-16

申请号：JP29101791

申请日：1991-08-20

Applicant: UBE INDUSTRIES

Inventor： MATSUI JUJI ,  IMATANI KATSUO

IPC: B24D3/28 ,  B24D3/00 ,  B32B5/16 ,  B32B27/34 ,  C08J5/18 ,  C08L79/00 ,  C08L79/08

公开(公告)号：JPH062828B2

公开(公告)日：1994-01-12

申请号：JP11227786

申请日：1986-05-15

Applicant: UBE INDUSTRIES

Inventor： KUNIMOTO AKIHIRO ,  TAKABAYASHI SEIICHIRO ,  MATSUI JUJI

IPC: C08J5/12 ,  C08G73/10 ,  C08J5/18 ,  C08J7/12 ,  C09D179/08 ,  H05K3/38

Abstract: A process for the production of a polyimide film having an increased adhesiveness which includes the steps of: evenly coating a surface treating solution which contains a heat-resistant surface treating agent of aminosilane type, epoxysilane type or titanate type in an amount not less than 0.5 wt. % on a surface of a solid film comprising an aromatic polymer composition which contains 100 parts by weight of an aromatic polyamioc acid and 5-150 parts by weight of an organic polar solvent and heating the solid film having the coated surface treating solution at a temperature of 100 DEG -600 DEG C., to imidize the polyamic acid constituting the solid film as well as to dry the film.