公开(公告)号：DE19839086B4

公开(公告)日：2007-03-15

申请号：DE19839086

申请日：1998-08-27

Applicant: UNITED MICROELECTRONICS CORP

Inventor： LIN JUEN-KUEN ,  LAI CHIEN-HSIN ,  PENG PENG-YIH ,  WU KUN-LIN ,  CHIU DANIEL ,  YANG CHIH-CHIANG ,  WU JUAN-YUAN ,  CHIU HAO-KUANG

IPC: B24B37/04 ,  B24B57/02 ,  H01L21/306

公开(公告)号：GB2344302B

公开(公告)日：2002-11-06

申请号：GB9920572

申请日：1998-09-16

Applicant: UNITED MICROELECTRONICS CORP

Inventor： LIN JUEN-KUEN ,  LAI CHIEN-HSIN ,  PENG PENG-YIH ,  WU KUN-LIN ,  CHIU DANIEL ,  YANG CHIH-CHIANG ,  WU JUAN-YUAN ,  CHIU HAO-KUANG

IPC: B24B37/04 ,  B24B57/02

公开(公告)号：FR2797603A1

公开(公告)日：2001-02-23

申请号：FR0011872

申请日：2000-09-18

Applicant: UNITED MICROELECTRONICS CORP

Inventor： LIN JUEN KUEN ,  LAI CHIEN HSIN ,  PENG PENG YIH ,  WU KUN LIN ,  CHIU DANIEL ,  YANG CHIH CHIANG ,  WU JUAN YUAN ,  CHIU HAO KUANG

IPC: B24B37/04 ,  B24B57/02 ,  B24B33/055 ,  B24B33/10

Abstract: Shallow trench isolation production includes insulation layer planarization using a chemical-mechanical polishing (CMP) holder sleeve (50) having suspension passages (52). A shallow trench isolation is produced in a substrate by: (a) removing a substrate portion, exposed by an opening in a mask layer, to form a trench; (b) forming an insulation layer on the substrate to fill the trench; and (c) using a CMP machine, having a holder sleeve (50) with a group of suspension passages (52), to planarize the insulation layer, the mask layer acting as a stop layer.

公开(公告)号：GB2345257A

公开(公告)日：2000-07-05

申请号：GB9920574

申请日：1998-09-16

Applicant: UNITED MICROELECTRONICS CORP

Inventor： LIN JUEN-KUEN ,  LAI CHIEN-HSIN ,  PENG PENG-YIH ,  WU KUN-LIN ,  CHIU DANIEL ,  YANG CHIH-CHIANG ,  WU JUAN-YUAN ,  CHIU HAO-KUANG

IPC: B24B37/04 ,  B24B57/02

Abstract: A chemical mechanical polishing process has the wafer retained by a retainer ring 40 for holding a semiconductor wafer to be polished. The retainer ring comprises slurry passages 42 on the bottom of the retainer ring and extending from an inner surface of the ring to an outer surface. The ring allows slurry to be delivered more evenly to the wafer giving improved planarization of the wafer. A method of forming a trench isolation in a substrate is also disclosed.

公开(公告)号：GB2344303A

公开(公告)日：2000-06-07

申请号：GB9920573

申请日：1998-09-16

Applicant: UNITED MICROELECTRONICS CORP

Inventor： LIN JUEN-KUEN ,  LAI CHIEN-HSIN ,  PENG PENG-YIH ,  WU KUN-LIN ,  CHIU DANIEL ,  YANG CHIH-CHIANG ,  WU JUAN-YUAN ,  CHIU HAO-KUANG

IPC: B24B37/04 ,  B24B57/02

Abstract: A chemical mechanical polishing machine includes a retainer ring 80 for holding a semiconductor wafer to be polished. The retainer ring comprises slurry passages 82 on the bottom of the retainer ring. Each passage gradually increases in size from the inlet (diameter d 1 ) on the outer circumference of the ring to the outlet (diameter d 2 ) on the inner circumference of the ring. The ring allows slurry to be delivered more evenly to the wafer giving improved planarization of the wafer.

公开(公告)号：GB2344302A

公开(公告)日：2000-06-07

申请号：GB9920572

申请日：1998-09-16

Applicant: UNITED MICROELECTRONICS CORP

Inventor： LIN JUEN-KUEN ,  LAI CHIEN-HSIN ,  PENG PENG-YIH ,  WU KUN-LIN ,  CHIU DANIEL ,  YANG CHIH-CHIANG ,  WU JUAN-YUAN ,  CHIU HAO-KUANG

IPC: B24B37/04 ,  B24B57/02

Abstract: A chemical mechanical polishing machine includes a retainer ring 50 for holding a semiconductor wafer to be polished. The retainer ring comprises slurry passages 52 on the bottom of the retainer ring and extending from an inner surface of the ring to an outer surface, the passages being interconnected by at least one circular path 54. The ring allows slurry to be delivered more evenly to the wafer giving improved planarization of the wafer.

公开(公告)号：DE19839086A1

公开(公告)日：1999-03-25

申请号：DE19839086

申请日：1998-08-27

Applicant: UNITED MICROELECTRONICS CORP

Inventor： LIN JUEN-KUEN ,  LAI CHIEN-HSIN ,  PENG PENG-YIH ,  WU KUN-LIN ,  CHIU DANIEL ,  YANG CHIH-CHIANG ,  WU JUAN-YUAN ,  CHIU HAO-KUANG

IPC: B24B37/04 ,  B24B57/02 ,  H01L21/306

公开(公告)号：GB2344303B

公开(公告)日：2002-12-11

申请号：GB9920573

申请日：1998-09-16

Applicant: UNITED MICROELECTRONICS CORP

Inventor： LIN JUEN-KUEN ,  LAI CHIEN-HSIN ,  PENG PENG-YIH ,  WU KUN-LIN ,  CHIU DANIEL ,  YANG CHIH-CHIANG ,  WU JUAN-YUAN ,  CHIU HAO-KUANG

IPC: B24B37/04 ,  B24B57/02

公开(公告)号：FR2767735B1

公开(公告)日：2001-09-14

申请号：FR9810824

申请日：1998-08-28

Applicant: UNITED MICROELECTRONICS CORP

Inventor： LIN JUEN KUEN ,  LAI CHIEN HSIN ,  PENG PENG YIH ,  WU KUN LIN ,  CHIU DANIEL ,  YANG CHIH CHIANG ,  WU JUAN YUAN ,  CHIU HAO KUANG

IPC: B24B37/04 ,  B24B57/02 ,  B24B33/055 ,  B24B33/10

公开(公告)号：NL1010252C2

公开(公告)日：2000-05-01

申请号：NL1010252

申请日：1998-10-05

Applicant: UNITED MICROELECTRONICS CORP

Inventor： LIN JUEN-KUEN ,  LAI CHIEN-HSIN ,  PENG PENG-YIH ,  WU KUN-LIN ,  CHIU DANIEL ,  YANG CHIH-CHIANG ,  WU JUAN-YUAN ,  CHIU HAO-KUANG

IPC: B24B37/04 ,  B24B57/02 ,  H01L21/3105