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公开(公告)号:JPH11226866A
公开(公告)日:1999-08-24
申请号:JP24621998
申请日:1998-08-31
Applicant: UNITED MICROELECTRONICS CORP
Inventor: LIN JUEN-KUEN , LAI CHIEN-HSIN , PENG PENG-YIH , WU KUN-LIN , KYU UNBO , YANG CHIH-CHIANG , WU JUAN-YUAN , CHIU HAO-KUANG
IPC: B24B37/00 , B24B37/04 , B24B37/30 , B24B37/32 , H01L21/304
Abstract: PROBLEM TO BE SOLVED: To improve the smoothness by forming a plurality of slurry passages in a bottom fringe part of a hold ring and arranging the slurry passages at substantially equal interval. SOLUTION: A hold ring 40 is formed in such a way that it has a plurality of slurry passages, paths, namely, pipe passages 42. This slurry passage 42 can be formed as a lower groove of the hold ring 40, a groove or a pipe passage through the hold ring or a space having the other shape. For example, a plurality of straight grooves arranged at substantially equal interval around the hold ring 60 are formed. In this case, while grinding is done, the hold ring 40 rotates at a predetermined speed and these straight grooves 42 are directed in such a manner that they form an acute angle of attack for slurry supplied from the outside of the hold ring 40. For this reason, it is possible to circulate slurry smoothly on a surface of a wafer on an inner side of the hold ring 40 by supplying slurry through the hold ring 40 due to the assistance of the straight grooves 42.
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公开(公告)号:GB2342605B
公开(公告)日:2002-06-05
申请号:GB9820209
申请日:1998-09-16
Applicant: UNITED MICROELECTRONICS CORP
Inventor: LIN JUEN-KUEN , LAI CHIEN-HSIN , PENG PENG-YIH , WU KUN-LIN , CHIU DANIEL , YANG CHIH-CHIANG , WU JUAN-YUAN , CHIU HAO-KUANG
IPC: B24B37/04 , B24B57/02 , H01L21/304
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公开(公告)号:GB2342605A
公开(公告)日:2000-04-19
申请号:GB9820209
申请日:1998-09-16
Applicant: UNITED MICROELECTRONICS CORP
Inventor: LIN JUEN-KUEN , LAI CHIEN-HSIN , PENG PENG-YIH , WU KUN-LIN , CHIU DANIEL , YANG CHIH-CHIANG , WU JUAN-YUAN , CHIU HAO-KUANG
IPC: B24B37/04 , B24B57/02 , H01L21/304
Abstract: The chemical mechanical polishing machine and comprises a retainer ring having plurality of slurry passages at the bottom of the retainer ring. The retainer ring may further comprise a circular path intercrossing the passages and set in the retaining ring. By conducting the slurry through the slurry passages and optionally the circular pathway, a wafer is planarized within the chemical mechanical polishing machine.
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公开(公告)号:GB2344302A
公开(公告)日:2000-06-07
申请号:GB9920572
申请日:1998-09-16
Applicant: UNITED MICROELECTRONICS CORP
Inventor: LIN JUEN-KUEN , LAI CHIEN-HSIN , PENG PENG-YIH , WU KUN-LIN , CHIU DANIEL , YANG CHIH-CHIANG , WU JUAN-YUAN , CHIU HAO-KUANG
Abstract: A chemical mechanical polishing machine includes a retainer ring 50 for holding a semiconductor wafer to be polished. The retainer ring comprises slurry passages 52 on the bottom of the retainer ring and extending from an inner surface of the ring to an outer surface, the passages being interconnected by at least one circular path 54. The ring allows slurry to be delivered more evenly to the wafer giving improved planarization of the wafer.
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公开(公告)号:DE19839086A1
公开(公告)日:1999-03-25
申请号:DE19839086
申请日:1998-08-27
Applicant: UNITED MICROELECTRONICS CORP
Inventor: LIN JUEN-KUEN , LAI CHIEN-HSIN , PENG PENG-YIH , WU KUN-LIN , CHIU DANIEL , YANG CHIH-CHIANG , WU JUAN-YUAN , CHIU HAO-KUANG
IPC: B24B37/04 , B24B57/02 , H01L21/306
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公开(公告)号:DE19839086B4
公开(公告)日:2007-03-15
申请号:DE19839086
申请日:1998-08-27
Applicant: UNITED MICROELECTRONICS CORP
Inventor: LIN JUEN-KUEN , LAI CHIEN-HSIN , PENG PENG-YIH , WU KUN-LIN , CHIU DANIEL , YANG CHIH-CHIANG , WU JUAN-YUAN , CHIU HAO-KUANG
IPC: B24B37/04 , B24B57/02 , H01L21/306
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公开(公告)号:GB2344302B
公开(公告)日:2002-11-06
申请号:GB9920572
申请日:1998-09-16
Applicant: UNITED MICROELECTRONICS CORP
Inventor: LIN JUEN-KUEN , LAI CHIEN-HSIN , PENG PENG-YIH , WU KUN-LIN , CHIU DANIEL , YANG CHIH-CHIANG , WU JUAN-YUAN , CHIU HAO-KUANG
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公开(公告)号:DE19901749A1
公开(公告)日:2000-07-20
申请号:DE19901749
申请日:1999-01-18
Applicant: UNITED MICROELECTRONICS CORP
Inventor: LIN JUEN-KUEN , LAI CHIEN-HSIN , PENG PENG-YIH , YANG EDWARD , WU KUN-LIN , YU FU-YANG
IPC: B24B37/26 , B24D13/12 , B24D13/14 , H01L21/304 , H01L21/306 , B24B37/04 , B28D5/04
Abstract: The pad has annular (30) and curved grooves. The curved grooves are designed according to flow equations derived from source and vortex flows. The grooves uniformly distribute the slurry. The angle and depth of the curved grooves which are calculated by boundary layer effect of streamlined groove (32) function are used to design an optimum structure for the polishing pad.
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公开(公告)号:GB2345257A
公开(公告)日:2000-07-05
申请号:GB9920574
申请日:1998-09-16
Applicant: UNITED MICROELECTRONICS CORP
Inventor: LIN JUEN-KUEN , LAI CHIEN-HSIN , PENG PENG-YIH , WU KUN-LIN , CHIU DANIEL , YANG CHIH-CHIANG , WU JUAN-YUAN , CHIU HAO-KUANG
Abstract: A chemical mechanical polishing process has the wafer retained by a retainer ring 40 for holding a semiconductor wafer to be polished. The retainer ring comprises slurry passages 42 on the bottom of the retainer ring and extending from an inner surface of the ring to an outer surface. The ring allows slurry to be delivered more evenly to the wafer giving improved planarization of the wafer. A method of forming a trench isolation in a substrate is also disclosed.
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公开(公告)号:GB2344303A
公开(公告)日:2000-06-07
申请号:GB9920573
申请日:1998-09-16
Applicant: UNITED MICROELECTRONICS CORP
Inventor: LIN JUEN-KUEN , LAI CHIEN-HSIN , PENG PENG-YIH , WU KUN-LIN , CHIU DANIEL , YANG CHIH-CHIANG , WU JUAN-YUAN , CHIU HAO-KUANG
Abstract: A chemical mechanical polishing machine includes a retainer ring 80 for holding a semiconductor wafer to be polished. The retainer ring comprises slurry passages 82 on the bottom of the retainer ring. Each passage gradually increases in size from the inlet (diameter d 1 ) on the outer circumference of the ring to the outlet (diameter d 2 ) on the inner circumference of the ring. The ring allows slurry to be delivered more evenly to the wafer giving improved planarization of the wafer.
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