公开(公告)号：JP2001035822A

公开(公告)日：2001-02-09

申请号：JP19511999

申请日：1999-07-08

Applicant: UNITED MICROELECTRONICS CORP

Inventor： YO MEISEI ,  CHIN GAKUCHU ,  RIN SOEI ,  WU JUAN-YUAN

IPC: H01L21/304

Abstract: PROBLEM TO BE SOLVED: To provide a chemical mechanical polishing station that allows an operator to know the completion of polishing with ease. SOLUTION: This chemical mechanical polishing station serves to polish wafers in a damascene process step, and comprises a slurry supplier 32, a polishing pad 30, a polishing head 36 for decending wafer 38 while holding and rotating the wafer 38, a light emitting device 40 for irradiating slurry 34 with a light beam, an optical sensor 41 for receiving a reflected beam, and a spectrum analyzer connected to the sensor 41 for analyzing changes in color within the slurry 34.