公开(公告)号：JP2000306867A

公开(公告)日：2000-11-02

申请号：JP11076999

申请日：1999-04-19

Applicant: UNITED MICROELECTRONICS CORP

Inventor： CHIN GAKUCHU ,  YU KEISEI ,  WU JUAN-YUAN ,  RO KATETSU

IPC: H01L21/768 ,  H01L21/288 ,  H01L21/304 ,  H01L21/3063

Abstract: PROBLEM TO BE SOLVED: To provide a method for increasing uniformity of mechanochemical polishing, using an electrolytic conductor layer. SOLUTION: In this method for increasing uniformity of mechanochemical polishing using an electrolytic conductor layer, upon formation of a conductor layer, the conductor layer is processed in an electrolytic process to decrease the thickness of the conductor layer and remove uneven parts on its surface, and thereafter the surface of the conductor layer is polished in a mechanochemical polishing process. The thickness of the conductor layer is decreased by the electrolytic process, thereby shortening the time necessary by the subsequent mechanochemical polishing process. At the same time, since charges 34 are concentrated on projected parts on the surface of the conductor layer, the electrolysis rate of the projected parts becomes faster than that of recessed parts thereon, unevenness on the conductor layer surface is improved. When the conductor layer is formed through electroplating, its efficiency is further improved.