Abstract:
The present invention relates to a light source for generating an optical frequency comb. The present invention further relates to a method for manufacturing the optical resonator used in this light source. The present invention additionally relates to microelectromechanical systems, MEMS, optical switch and system comprising the same. The present invention also relates to a sensor and to a method for manufacturing a suspended silicon nitride structure comprised in the sensor. According to the present invention, a single-step LPCVD deposited monolithic stoichiometric Si3N4 layer is used on a mono-crystalline aluminum oxide substrate such as sapphire. The thickness of the Si3N4 layer exceeds 500 nm. This layer can be realized with relatively low residual stress.
Abstract:
The disclosure relates to a method for producing three-dimensional cell cluster on an inorganic cell culture platform comprising three-dimensional structures, preferably fractal structures. Such three-dimensional structures are useful for culturing cells and tissues, preferably in three dimensions. Such three-dimensional structures are useful for inducing differentiation, preferably of non-embryonic stem cells. In particular, such three-dimensional (3D) structures are useful for culturing primary tissue cells.
Abstract:
A method of manufacturing a plurality of through-holes (132) in a layer of material by subjecting the layer to directional dry etching to provide through-holes (132) in the layer of material; For batch-wise production, the method comprises after a step of providing a layer of first material (220) on base material and before the step of directional dry etching, providing a plurality of holes at the central locations of pits (210), etching base material at the central locations of the pits (210) so as to form a cavity (280) with an aperture (281), depositing a second layer of material (240) on the base material in the cavity (280), and subjecting the second layer of material (240) in the cavity (280) to said step of directional dry etching using the aperture (281) as the opening (141) of a shadow mask.
Abstract:
A method of manufacturing a plurality of through-holes (132) in a layer of material by subjecting the layer to directional dry etching to provide through-holes (132) in the layer of material; For batch-wise production, the method comprises after a step of providing a layer of first material (220) on base material and before the step of directional dry etching, providing a plurality of holes at the central locations of pits (210), etching base material at the central locations of the pits (210) so as to form a cavity (280) with an aperture (281), depositing a second layer of material (240) on the base material in the cavity (280), and subjecting the second layer of material (240) in the cavity (280) to said step of directional dry etching using the aperture (281) as the opening (141) of a shadow mask.
Abstract:
The invention relates to a method for making a 3D nanostructure having a nanosubstructure, comprising the steps of: i) providing a mold comprising at least one sharp concave corner; ii) conformational depositing at least one structural material in the sharp concave corner; iii) isotropically removing structural material; iv) depositing at least one other structural material; v) removing earlier deposited structural material; vi) forming a nanosubstructure; and vii) removing the mold thereby providing the 3D nanostructure having the nanosubstructure.
Abstract:
The invention relates to a method for making a 3D nanostructure having a nanosubstructure, comprising the steps of: i) providing a mold comprising at least one sharp concave corner; ii) conformational depositing at least one structural material in the sharp concave corner; iii) isotropically removing structural material; iv) depositing at least one other structural material; v) removing earlier deposited structural material; vi) forming a nanosubstructure; and vii) removing the mold thereby providing the 3D nanostructure having the nanosubstructure.