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    SUBSTRATE STRUCTURE HAVING COMPONENT-DISPOSING AREA AND MANUFACTURING PROCESS THEREOF
    4.
    发明申请
    SUBSTRATE STRUCTURE HAVING COMPONENT-DISPOSING AREA AND MANUFACTURING PROCESS THEREOF 有权
    具有组件处理区域的基板结构及其制造工艺

    公开(公告)号：US20140138130A1

    公开(公告)日：2014-05-22

    申请号：US13740286

    申请日：2013-01-14

    Applicant: UNIMICRON TECHNOLOGY CORP.

    Inventor： Cheng-Jui Chang ,  Ming-Hao Wu

    IPC: H05K1/11 ,  H05K1/09 ,  H05K13/04

    CPC classification number: H01L21/4857 ,  H01L23/13 ,  H01L23/49822 ,  H01L24/32 ,  H01L24/48 ,  H01L24/81 ,  H01L24/85 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15333 ,  H01L2924/37001 ,  H05K1/183 ,  H05K3/4697 ,  H05K2201/09127 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

    Abstract: A substrate structure having a component-disposing area and a process thereof are provided. The substrate structure having a component-disposing area includes a core layer, a first dielectric-layer, a laser-resistant metallic-pattern and a second dielectric-layer. The core layer includes a first surface, a component-disposing area and a patterned metallic-layer disposed on the first surface and including multiple pads, and the pads are located within the component-disposing area. The first dielectric-layer is disposed on the core layer and includes multiple openings to respectively expose the pads. The laser-resistant metallic-pattern is disposed on the first dielectric-layer and surrounds a projection area of the first dielectric-layer which the component-disposing area is orthogonally projected on. The second dielectric-layer is disposed on the first dielectric-layer and covers the laser-resistant metallic-pattern, the second dielectric-layer includes a component-disposing cavity corresponding to the projection area, penetrating through the second dielectric-layer and communicated with the openings to expose the pads.

    Abstract translation: 提供了具有部件配置区域的基板结构及其工艺。 具有部件配置区域的基板结构包括芯层，第一介电层，耐激光金属图案和第二介电层。 芯层包括第一表面，部件布置区域和设置在第一表面上并且包括多个焊盘的图案化金属层，并且焊盘位于部件布置区域内。 第一介电层设置在芯层上并且包括多个开口以分别暴露焊盘。 激光抵抗金属图案设置在第一电介质层上并且包围第一电介质层的投影区域，其中元件布置区域正交地投影在其上。 第二电介质层设置在第一电介质层上并覆盖耐激光金属图案，第二介电层包括与投影区域对应的部件设置腔，穿透第二介电层并与 露出垫的开口。

    Pillar structure and manufacturing method thereof
    7.
    发明授权
    Pillar structure and manufacturing method thereof 有权

    公开(公告)号：US10121757B2

    公开(公告)日：2018-11-06

    申请号：US14953020

    申请日：2015-11-27

    Applicant: Unimicron Technology Corp.

    Inventor： Cheng-Jui Chang

    IPC: H01L23/00 ,  H05K1/00

    Abstract: A pillar structure is disposed on a substrate. The pillar structure includes a pad, a metal wire bump, a metal wire, and a metal plating layer. The pad is disposed on the substrate. The metal wire bump is disposed on the pad. The metal wire is connected to the metal wire bump. The metal wire extends in a first extension direction, the substrate extends in a second extension direction, and the first extension direction is perpendicular to the second extension direction. The metal plating layer covers the pad and completely encapsulates the metal wire bump and the metal wire.

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