中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

36 records (took 0.026 seconds)

    WIRING BOARD STRUCTURE
    5.
    发明申请
    WIRING BOARD STRUCTURE 审中-公开
    接线板结构

    公开(公告)号：US20150053462A1

    公开(公告)日：2015-02-26

    申请号：US14062912

    申请日：2013-10-25

    Applicant: Unimicron Technology Corp.

    Inventor： Ming-Hao Wu ,  Wei-Ming Cheng ,  Hung-Lin Chang

    IPC: H05K1/02

    CPC classification number: H05K1/0206 ,  H01L21/568 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73259 ,  H05K1/0203 ,  H05K1/0207 ,  H05K1/16 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/0195 ,  H05K2201/09527 ,  H05K2201/10219

    Abstract: A wiring board structure adapted to carry a heat generating component is provided. The wiring board structure includes a core layer, an active cooler, a dielectric layer and a plurality of conductive vias. The core layer has a cavity penetrating through the core layer. The active cooler includes a cold surface and a hot surface. The active cooler is disposed in the cavity. The dielectric layer covers the core layer and fills a gap between the active cooler and the cavity. The heat-generating component is disposed on an outer surface of the dielectric layer. The conductive vias are disposed in the dielectric layer and connecting the cold surface and the outer surface to connect the heat-generating component and the active cooler. A wiring board structure having an active cooling via is also provided.

    Abstract translation: 提供适于承载发热部件的布线板结构。 布线板结构包括芯层，有源冷却器，电介质层和多个导电通孔。 芯层具有穿透芯层的腔体。 主动冷却器包括冷表面和热表面。 有源冷却器设置在空腔中。 电介质层覆盖芯层并填充主动式冷却器和空腔之间的间隙。 发热部件设置在电介质层的外表面上。 导电通孔设置在电介质层中，并连接冷表面和外表面，以连接发热部件和主动冷却器。 还提供了具有主动冷却通路的布线板结构。

    CIRCUIT BOARD STRUCTURE
    6.
    发明公开
    CIRCUIT BOARD STRUCTURE 审中-公开

    公开(公告)号：US20230262880A1

    公开(公告)日：2023-08-17

    申请号：US18162713

    申请日：2023-02-01

    Applicant: Unimicron Technology Corp.

    Inventor： Chih-Chiang Lu ,  Jun-Rui Huang ,  Ming-Hao Wu ,  Tung-Chang Lin

    IPC: H05K1/02 ,  H05K1/11

    CPC classification number: H05K1/025 ,  H05K1/112 ,  H05K1/0216 ,  H05K2201/095

    Abstract: Provided is a circuit board structure including a substrate, a loop-wrapping ground layer, an insulating structure, a first build-up layer, a top wiring layer, a bottom wiring layer, a first conductive via, and a plurality of second conductive vias. The aforementioned structure defines a signal transmitting structure. An equivalent circuit of the signal transmitting structure at least includes a first equivalent circuit, a second equivalent circuit, a third equivalent circuit and a fourth equivalent circuit, which correspond to different uniform transmitting sections respectively. The first equivalent circuit, the second equivalent circuit, the third equivalent circuit and the fourth equivalent circuit are connected in series with each other according to an ABCD transmission matrix series connection principle.

    MANUFACTURING METHOD OF CIRCUIT BOARD STRUCTURE
    8.
    发明申请
    MANUFACTURING METHOD OF CIRCUIT BOARD STRUCTURE 审中-公开

    公开(公告)号：US20180295723A1

    公开(公告)日：2018-10-11

    申请号：US16008060

    申请日：2018-06-14

    Applicant: Unimicron Technology Corp.

    Inventor： Ming-Hao Wu ,  Wen-Fang Liu

    IPC: H05K1/11 ,  H05K3/00

    CPC classification number: H05K1/111 ,  H05K1/115 ,  H05K3/0044 ,  H05K3/3452 ,  H05K3/4697 ,  H05K2201/0376 ,  H05K2203/0228 ,  H05K2203/025

    Abstract: A manufacturing method of a circuit board structure includes the following steps: providing an inner circuit structure which includes a core layer; performing a build-up process to laminate a first build-up circuit structure on a first patterned circuit layer of the inner circuit structure, wherein the first build-up circuit structure includes an inner dielectric layer, and the inner dielectric layer directly covers an upper surface of the core layer and the first patterned circuit layer; removing a portion of the first build-up circuit structure to form an opening extending from a first surface of the first build-up circuit structure relatively far away from the inner circuit structure to a portion of the inner dielectric layer; performing a sandblasting process on a first inner surface of the inner dielectric layer exposed by the opening to at least remove the portion of the inner dielectric layer exposed by the opening.

    Circuit board structure and manufacturing method thereof
    9.
    发明授权
    Circuit board structure and manufacturing method thereof 有权

    公开(公告)号：US10039184B2

    公开(公告)日：2018-07-31

    申请号：US15427061

    申请日：2017-02-08

    Applicant: Unimicron Technology Corp.

    Inventor： Ming-Hao Wu ,  Wen-Fang Liu

    IPC: H05K1/11 ,  H05K3/00

    CPC classification number: H05K1/111 ,  H05K1/115 ,  H05K3/0044 ,  H05K3/3452 ,  H05K3/4697 ,  H05K2201/0376 ,  H05K2203/0228 ,  H05K2203/025

    Abstract: A circuit board structure includes an inner circuit structure and a first build-up circuit structure. The inner circuit structure includes a core layer having an upper surface and a lower surface opposite to each other, a first patterned circuit layer disposed on the upper surface, a second patterned circuit layer disposed on the lower surface and a conductive via connecting the first and the second patterned circuit layers. The first build-up circuit structure is disposed on the upper surface of the core layer and covers the first patterned circuit layer, wherein the first build-up circuit structure at least has a cavity, the cavity exposes a portion of the first patterned circuit layer and a cross-sectional profile of an edge of a top surface of the portion of the first patterned circuit layer exposed by the cavity is a curved surface.

Patent Agency Ranking