公开(公告)号：EP2120519B1

公开(公告)日：2011-12-28

申请号：EP09250489.3

申请日：2009-02-24

Applicant: Unimicron Technology Corp.

Inventor： Chen, Tsung-Yuan ,  Chiang, Shu-Sheng ,  Cheng, David C. H.

IPC: H05K3/02 ,  H05K1/00 ,  H05K1/11 ,  H05K3/10 ,  H05K3/00

CPC classification number: H05K3/465 ,  H05K1/0265 ,  H05K3/0032 ,  H05K3/0038 ,  H05K3/107 ,  H05K3/426 ,  H05K3/428 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/09536 ,  H05K2201/09736 ,  Y10T29/49147

公开(公告)号：EP2120519A1

公开(公告)日：2009-11-18

申请号：EP09250489.3

申请日：2009-02-24

Applicant: Unimicron Technology Corp.

Inventor： Chen, Tsung-Yuan ,  Chiang, Shu-Sheng ,  Cheng, David C. H.

IPC: H05K3/02 ,  H05K1/00 ,  H05K1/11 ,  H05K3/10 ,  H05K3/00

CPC classification number: H05K3/465 ,  H05K1/0265 ,  H05K3/0032 ,  H05K3/0038 ,  H05K3/107 ,  H05K3/426 ,  H05K3/428 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/09536 ,  H05K2201/09736 ,  Y10T29/49147

Abstract: An electrical interconnecting structure suitable for a circuit board is provided. The electrical interconnecting structure includes a core (200), an ultra fine pattern (204a, 204b), and a patterned conductive layer. The core (200) has a surface, and the ultra fine pattern (204a, 204b) is inlaid in the surface of the core. The patterned conductive layer (210a, 210b) is disposed on the surface of the core (200) and is partially connected to the ultra fine pattern, since the ultra fine pattern of the electrical interconnecting structure is inlaid in the surface of the core and is partially connected to the patterned conductive layer located on the surface of the core. There is a through hole (200) and a through via (202a).

Abstract translation: 提供了适用于电路板的电互连结构。 电互连结构包括芯（200），超细图案（204a，204b）和图案化导电层。 芯（200）具有表面，并且超细图案（204a，204b）镶嵌在芯的表面中。 图案化的导电层（210a，210b）设置在芯（200）的表面上，并且部分地连接到超细图案，因为电互连结构的超细图案镶嵌在芯的表面中，并且是 部分地连接到位于芯的表面上的图案化导电层。 通孔（200）和通孔（202a）。

公开(公告)号：EP2120515A1

公开(公告)日：2009-11-18

申请号：EP09250862.1

申请日：2009-03-26

Applicant: Unimicron Technology Corp.

Inventor： Chen, Tsung-Yuan ,  Chiang, Shu-Sheng ,  Cheng, David C. H.

IPC: H05K1/05 ,  H05K3/10 ,  H05K3/42 ,  H05K3/04

CPC classification number: H05K1/02 ,  H05K1/0265 ,  H05K1/0298 ,  H05K1/115 ,  H05K3/045 ,  H05K3/107 ,  H05K3/426 ,  H05K3/465 ,  H05K2201/0352 ,  H05K2201/09736 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: A circuit board structure comprising a core layer, a fine circuit pattern and an external patterned conductive layer is provided. The core layer has surface material being dielectric material. The fine circuit pattern is inlaid in the core layer, and the external patterned conductive layer is disposed on a surface of the composite layer. After fine circuit grooves are formed on the surface of the composite layer, conductive material is filled into the grooves to form the fine circuit pattern inlaid in the core layer. Since this fine circuit pattern has relatively fine line width and spacing, the circuit board structure has a higher wiring density.

Abstract translation: 提供了包括芯层，精细电路图案和外部图案化导电层的电路板结构。 芯层具有表面材料为介电材料。 精细电路图案嵌入在芯层中，并且外部图案化导电层设置在复合层的表面上。 在复合层的表面上形成精细电路槽之后，将导电材料填充到沟槽中以形成嵌入在芯层中的精细电路图案。 由于该微细电路图形具有相对较细的线宽和间隔，所以电路板结构具有较高的布线密度。