公开(公告)号：US20160073505A1

公开(公告)日：2016-03-10

申请号：US14477874

申请日：2014-09-05

Applicant: Unimicron Technology Corp.

Inventor： Cheng-Po Yu ,  Kuo-Wei Li

IPC: H05K3/00 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K3/007 ,  H05K1/0373 ,  H05K3/421 ,  H05K3/4661 ,  H05K3/4682 ,  H05K2201/0154

Abstract: A manufacturing method of multilayer flexible circuit structure including the following steps is provided. Two first flexible substrates are correspondingly bonded on two sides of a release film, and two conductive materials are correspondingly formed on the two first flexible substrates. The two conductive materials are patterned to form two first inner-layer circuits. Two outer build-up structures are bonded on the two corresponding first flexible substrates. The release film is removed, so as to separate the two first flexible substrates. An outer-layer circuit is formed on each of the first flexible substrates and the corresponding outer build-up structure, wherein the outer-layer circuit is connected to the corresponding first inner-layer circuit, and each of the first flexible substrates, the corresponding first inner-layer circuit, the outer build-up structure and the outer-layer circuit correspondingly form a multilayer flexible circuit structure. Another manufacturing method of multilayer flexible circuit structure is also provided.

Abstract translation: 提供了包括以下步骤的多层柔性电路结构的制造方法。 两个第一柔性基板相应地结合在剥离膜的两侧上，并且两个导电材料相应地形成在两个第一柔性基板上。 将两个导电材料图案化以形成两个第一内层电路。 两个外部积聚结构结合在两个对应的第一柔性基底上。 去除剥离膜，以分离两个第一柔性基底。 在每个第一柔性基板和相应的外部积层结构上形成外层电路，其中外层电路连接到对应的第一内层电路，并且每个第一柔性基板，相应的 第一内层电路，外部积层结构和外层电路相应地形成多层柔性电路结构。 还提供了另一种多层柔性电路结构的制造方法。

公开(公告)号：US11600936B2

公开(公告)日：2023-03-07

申请号：US17322906

申请日：2021-05-18

Applicant: Unimicron Technology Corp.

Inventor： Tzyy-Jang Tseng ,  Pei-Wei Wang ,  Ching-Ho Hsieh ,  Shao-Chien Lee ,  Kuo-Wei Li

IPC: H05K1/14 ,  H01R12/62 ,  H05K1/02 ,  H05K1/11 ,  H05K1/03 ,  H05K3/00 ,  H05K3/40 ,  H05K3/46

Abstract: A circuit board structure has a first flexible circuit board, a second flexible circuit board, and a rigid board structure. The first flexible circuit board has a first dielectric layer and a first conductive circuit. The second flexible circuit board has a second dielectric layer and a second conductive circuit. The rigid board structure connects the first flexible circuit board and the second flexible circuit board. The rigid board structure has a third dielectric layer and a third conductive circuit. A dielectric loss value of the third dielectric layer is less than that of each of the first dielectric layer and the second dielectric layer. The third conductive circuit is electrically connected to the first and second conductive circuits.

公开(公告)号：US11114782B2

公开(公告)日：2021-09-07

申请号：US16540038

申请日：2019-08-13

Applicant: Unimicron Technology Corp.

Inventor： Tzyy-Jang Tseng ,  Pei-Wei Wang ,  Ching-Ho Hsieh ,  Shao-Chien Lee ,  Kuo-Wei Li

IPC: H05K1/02 ,  H01R12/62 ,  H05K1/14 ,  H05K1/11 ,  H05K1/03 ,  H05K3/00 ,  H05K3/40 ,  H05K3/46

Abstract: A circuit board structure has a first flexible circuit board, a second flexible circuit board, and a rigid board structure. The first flexible circuit board has a first dielectric layer and a first conductive circuit. The second flexible circuit board has a second dielectric layer and a second conductive circuit. The rigid board structure connects the first flexible circuit board and the second flexible circuit board. The rigid board structure has a third dielectric layer and a third conductive circuit. A dielectric loss value of the third dielectric layer is less than that of each of the first dielectric layer and the second dielectric layer. The third conductive circuit is electrically connected to the first and second conductive circuits.