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公开(公告)号：US11335670B2
公开(公告)日：2022-05-17
申请号：US16907183
申请日：2020-06-20
Applicant: Unimicron Technology Corp.
Inventor： Ming-Ru Chen , Tzyy-Jang Tseng , Cheng-Chung Lo
Abstract: A manufacturing method of a light emitting diode (LED) package structure includes the following steps. A carrier is provided. A redistribution layer is formed on the carrier. A plurality of active devices are formed on the carrier. A plurality of LEDs are transferred on the redistribution layer. The LEDs and the active devices are respectively electrically connected to the redistribution layer. The active devices are adapted to drive the LEDs, respectively. A molding compound is formed on the redistribution layer to encapsulate the LEDs. The carrier is removed to expose a bottom surface of the redistribution layer.
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公开(公告)号：US11715715B2
公开(公告)日：2023-08-01
申请号：US17200922
申请日：2021-03-15
Applicant: Unimicron Technology Corp.
Inventor： Tzyy-Jang Tseng , Ming-Ru Chen , Cheng-Chung Lo , Chin-Sheng Wang , Wen-Sen Tang
IPC: H01L23/00 , H01L25/075 , H01L27/12 , H01L33/62
CPC classification number: H01L24/13 , H01L24/03 , H01L24/05 , H01L24/11 , H01L25/0753 , H01L27/1214 , H01L33/62 , H01L2224/03312 , H01L2224/03552 , H01L2224/0401 , H01L2224/0518 , H01L2224/05082 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05164 , H01L2224/05166 , H01L2224/05171 , H01L2224/05193 , H01L2224/11464 , H01L2224/13013 , H01L2224/13014 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2924/12041 , H01L2924/1426 , H01L2933/0066
Abstract: A manufacturing method of a metal bump structure is provided. A driving base is provided. At least one pad and an insulating layer are formed on the driving base. The pad is formed on an arrangement surface of the driving base and has an upper surface. The insulating layer covers the arrangement surface of the driving base and the pad, and exposes a part of the upper surface of the pad. A patterned metal layer is formed on the upper surface of the pad exposed by the insulating layer, and extends to cover a part of the insulating layer. An electro-less plating process is performed to form at least one metal bump on the patterned metal layer. A first extension direction of the metal bump is perpendicular to a second extension direction of the driving base.
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公开(公告)号：US20220238471A1
公开(公告)日：2022-07-28
申请号：US17200922
申请日：2021-03-15
Applicant: Unimicron Technology Corp.
Inventor： Tzyy-Jang Tseng , Ming-Ru Chen , Cheng-Chung Lo , Chin-Sheng Wang , Wen-Sen Tang
IPC: H01L23/00 , H01L25/075 , H01L27/12 , H01L33/62
Abstract: A manufacturing method of a metal bump structure is provided. A driving base is provided. At least one pad and an insulating layer are formed on the driving base. The pad is formed on an arrangement surface of the driving base and has an upper surface. The insulating layer covers the arrangement surface of the driving base and the pad, and exposes a part of the upper surface of the pad. A patterned metal layer is formed on the upper surface of the pad exposed by the insulating layer, and extends to cover a part of the insulating layer. An electro-less plating process is performed to form at least one metal bump on the patterned metal layer. A first extension direction of the metal bump is perpendicular to a second extension direction of the driving base.
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公开(公告)号：US11923350B2
公开(公告)日：2024-03-05
申请号：US18079884
申请日：2022-12-13
Applicant: Unimicron Technology Corp.
Inventor： Ming-Ru Chen , Tzyy-Jang Tseng , Cheng-Chung Lo
CPC classification number: H01L25/167 , H01L33/62 , H01L33/56 , H01L2933/0066
Abstract: A manufacturing method of a light emitting diode (LED) package structure includes the following steps. A carrier is provided. A redistribution layer is formed on the carrier. A plurality of active devices are formed on the carrier. A plurality of LEDs are transferred on the redistribution layer. The LEDs and the active devices are respectively electrically connected to the redistribution layer. The active devices are adapted to drive the LEDs, respectively. A molding compound is formed on the redistribution layer to encapsulate the LEDs. The carrier is removed to expose a bottom surface of the redistribution layer.
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Patent Agency Ranking
公开(公告)号：US20220231004A1
公开(公告)日：2022-07-21
申请号：US17714121
申请日：2022-04-05
Applicant: Unimicron Technology Corp.
Inventor： Ming-Ru Chen , Tzyy-Jang Tseng , Cheng-Chung Lo
Abstract: A manufacturing method of a light emitting diode (LED) package structure includes the following steps. A carrier is provided. A redistribution layer is formed on the carrier. A plurality of active devices are formed on the carrier. A plurality of LEDs are transferred on the redistribution layer. The LEDs and the active devices are respectively electrically connected to the redistribution layer. The active devices are adapted to drive the LEDs, respectively. A molding compound is formed on the redistribution layer to encapsulate the LEDs. The carrier is removed to expose a bottom surface of the redistribution layer.
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公开(公告)号：US11991824B2
公开(公告)日：2024-05-21
申请号：US17448893
申请日：2021-09-26
Applicant: Unimicron Technology Corp.
Inventor： Tzyy-Jang Tseng , Cheng-Ta Ko , Pu-Ju Lin , Chi-Hai Kuo , Shao-Chien Lee , Ming-Ru Chen , Cheng-Chung Lo
IPC: H05K1/02 , G02F1/1333 , G02F1/1368 , H05K1/03 , H05K1/11 , H05K3/00 , H10K59/12 , H10K59/123 , H10K59/124 , H10K59/131
CPC classification number: H05K1/115 , H05K1/0306 , H05K3/0067 , H05K3/0094
Abstract: A circuit board structure includes a first sub-circuit board, a second sub-circuit board, and a third sub-circuit board. The first sub-circuit board has an upper surface and a lower surface opposite to each other, and includes at least one first conductive through hole. The second sub-circuit board is disposed on the upper surface of the first sub-circuit board and includes at least one second conductive through hole. The third sub-circuit board is disposed on the lower surface of the first sub-circuit board and includes at least one third conductive through hole. At least two of the first conductive through hole, the second conductive through hole, and the third conductive through hole are alternately arranged in an axial direction perpendicular to an extending direction of the first sub-circuit board. The first, second and third sub-circuit boards are electrically connected to one another.
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公开(公告)号：US11837591B2
公开(公告)日：2023-12-05
申请号：US17714121
申请日：2022-04-05
Applicant: Unimicron Technology Corp.
Inventor： Ming-Ru Chen , Tzyy-Jang Tseng , Cheng-Chung Lo
CPC classification number: H01L25/167 , H01L33/62 , H01L33/56 , H01L2933/0066
Abstract: A manufacturing method of a light emitting diode (LED) package structure includes the following steps. A carrier is provided. A redistribution layer is formed on the carrier. A plurality of active devices are formed on the carrier. A plurality of LEDs are transferred on the redistribution layer. The LEDs and the active devices are respectively electrically connected to the redistribution layer. The active devices are adapted to drive the LEDs, respectively. A molding compound is formed on the redistribution layer to encapsulate the LEDs. The carrier is removed to expose a bottom surface of the redistribution layer.
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公开(公告)号：US20210327861A1
公开(公告)日：2021-10-21
申请号：US16907183
申请日：2020-06-20
Applicant: Unimicron Technology Corp.
Inventor： Ming-Ru Chen , Tzyy-Jang Tseng , Cheng-Chung Lo
Abstract: A manufacturing method of a light emitting diode (LED) package structure includes the following steps. A carrier is provided. A redistribution layer is formed on the carrier. A plurality of active devices are formed on the carrier. A plurality of LEDs are transferred on the redistribution layer. The LEDs and the active devices are respectively electrically connected to the redistribution layer. The active devices are adapted to drive the LEDs, respectively. A molding compound is formed on the redistribution layer to encapsulate the LEDs. The carrier is removed to expose a bottom surface of the redistribution layer.
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公开(公告)号：US20230116522A1
公开(公告)日：2023-04-13
申请号：US18079884
申请日：2022-12-13
Applicant: Unimicron Technology Corp.
Inventor： Ming-Ru Chen , Tzyy-Jang Tseng , Cheng-Chung Lo
Abstract: A manufacturing method of a light emitting diode (LED) package structure includes the following steps. A carrier is provided. A redistribution layer is formed on the carrier. A plurality of active devices are formed on the carrier. A plurality of LEDs are transferred on the redistribution layer. The LEDs and the active devices are respectively electrically connected to the redistribution layer. The active devices are adapted to drive the LEDs, respectively. A molding compound is formed on the redistribution layer to encapsulate the LEDs. The carrier is removed to expose a bottom surface of the redistribution layer.
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