公开(公告)号：US11715715B2

公开(公告)日：2023-08-01

申请号：US17200922

申请日：2021-03-15

Applicant: Unimicron Technology Corp.

Inventor： Tzyy-Jang Tseng ,  Ming-Ru Chen ,  Cheng-Chung Lo ,  Chin-Sheng Wang ,  Wen-Sen Tang

IPC: H01L23/00 ,  H01L25/075 ,  H01L27/12 ,  H01L33/62

CPC classification number: H01L24/13 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L25/0753 ,  H01L27/1214 ,  H01L33/62 ,  H01L2224/03312 ,  H01L2224/03552 ,  H01L2224/0401 ,  H01L2224/0518 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05193 ,  H01L2224/11464 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2924/12041 ,  H01L2924/1426 ,  H01L2933/0066

Abstract: A manufacturing method of a metal bump structure is provided. A driving base is provided. At least one pad and an insulating layer are formed on the driving base. The pad is formed on an arrangement surface of the driving base and has an upper surface. The insulating layer covers the arrangement surface of the driving base and the pad, and exposes a part of the upper surface of the pad. A patterned metal layer is formed on the upper surface of the pad exposed by the insulating layer, and extends to cover a part of the insulating layer. An electro-less plating process is performed to form at least one metal bump on the patterned metal layer. A first extension direction of the metal bump is perpendicular to a second extension direction of the driving base.

公开(公告)号：US20220238471A1

公开(公告)日：2022-07-28

申请号：US17200922

申请日：2021-03-15

Applicant: Unimicron Technology Corp.

Inventor： Tzyy-Jang Tseng ,  Ming-Ru Chen ,  Cheng-Chung Lo ,  Chin-Sheng Wang ,  Wen-Sen Tang

IPC: H01L23/00 ,  H01L25/075 ,  H01L27/12 ,  H01L33/62

Abstract: A manufacturing method of a metal bump structure is provided. A driving base is provided. At least one pad and an insulating layer are formed on the driving base. The pad is formed on an arrangement surface of the driving base and has an upper surface. The insulating layer covers the arrangement surface of the driving base and the pad, and exposes a part of the upper surface of the pad. A patterned metal layer is formed on the upper surface of the pad exposed by the insulating layer, and extends to cover a part of the insulating layer. An electro-less plating process is performed to form at least one metal bump on the patterned metal layer. A first extension direction of the metal bump is perpendicular to a second extension direction of the driving base.