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公开(公告)号：US20170055349A1
公开(公告)日：2017-02-23
申请号：US14833129
申请日：2015-08-23
Applicant: Unimicron Technology Corp.
Inventor： Hung-Lin Chang , Ta-Han Lin
CPC classification number: H05K1/186 , H01L23/3121 , H01L2224/04105 , H01L2224/19 , H01L2224/73259 , H01L2224/92224 , H01L2924/15153 , H01L2924/19105 , H05K1/0298 , H05K1/0326 , H05K1/0333 , H05K1/0346 , H05K1/111 , H05K1/115 , H05K3/4644 , H05K3/4697 , H05K2201/0129 , H05K2201/0145 , H05K2201/09081 , H05K2201/09545
Abstract: A package structure includes a circuit substrate, at least one electronic component, and a connecting slot. The circuit substrate includes at least one core layer, a build-up structure including at least three patterned circuit layers, at least two dielectric layers and conductive through holes, and circuit pads. The electronic component is embedded in at least one of the dielectric layers and located in a disposition area. The electronic component is electrically connected to one of the patterned circuit layers through a portion of the conductive through holes. The connecting slot has a bottom portion, a plurality of sidewall portions connecting the bottom portion, and a plurality of connecting pads located on the sidewall portions. The circuit substrate is assembled to the bottom portion, and the circuit pads are electrically connected to the connecting pads through a bent area of the core layer that is bent relative to the disposition area.
Abstract translation: 封装结构包括电路基板，至少一个电子部件和连接槽。 电路基板包括至少一个芯层，包括至少三个图案化电路层，至少两个介电层和导电通孔以及电路板的堆积结构。 电子部件嵌入在至少一个电介质层中并且位于配置区域中。 电子部件通过导电通孔的一部分电连接到图案化电路层之一。 连接槽具有底部，连接底部的多个侧壁部分和位于侧壁部分上的多个连接垫。 电路基板组装到底部，并且电路板通过相对于配置区域弯曲的芯层的弯曲区域电连接到连接焊盘。
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公开(公告)号：US09686866B2
公开(公告)日：2017-06-20
申请号：US14833129
申请日：2015-08-23
Applicant: Unimicron Technology Corp.
Inventor： Hung-Lin Chang , Ta-Han Lin
CPC classification number: H05K1/186 , H01L23/3121 , H01L2224/04105 , H01L2224/19 , H01L2224/73259 , H01L2224/92224 , H01L2924/15153 , H01L2924/19105 , H05K1/0298 , H05K1/0326 , H05K1/0333 , H05K1/0346 , H05K1/111 , H05K1/115 , H05K3/4644 , H05K3/4697 , H05K2201/0129 , H05K2201/0145 , H05K2201/09081 , H05K2201/09545
Abstract: A package structure includes a circuit substrate, at least one electronic component, and a connecting slot. The circuit substrate includes at least one core layer, a build-up structure including at least three patterned circuit layers, at least two dielectric layers and conductive through holes, and circuit pads. The electronic component is embedded in at least one of the dielectric layers and located in a disposition area. The electronic component is electrically connected to one of the patterned circuit layers through a portion of the conductive through holes. The connecting slot has a bottom portion, a plurality of sidewall portions connecting the bottom portion, and a plurality of connecting pads located on the sidewall portions. The circuit substrate is assembled to the bottom portion, and the circuit pads are electrically connected to the connecting pads through a bent area of the core layer that is bent relative to the disposition area.
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