公开(公告)号：US20210195761A1

公开(公告)日：2021-06-24

申请号：US17194323

申请日：2021-03-08

Applicant: Unimicron Technology Corp.

Inventor： Kai-Ming YANG ,  Chen-Hao LIN ,  Wang-Hsiang TSAI ,  Cheng-Ta KO

IPC: H05K3/40 ,  H01L21/768 ,  H01L21/48 ,  H05K1/11 ,  H05K1/18 ,  H05K1/14 ,  H01L23/14 ,  H01L23/15 ,  H01L23/498 ,  H01L23/36 ,  H01L23/538 ,  H05K3/46 ,  H01L23/00 ,  H01L21/683

Abstract: A package structure includes a metal layer, a composite layer of a non-conductor inorganic material and an organic material, a sealant, a chip, a circuit layer structure, and an insulating protective layer. The composite layer of the non-conductor inorganic material and the organic material is disposed on the metal layer. The sealant is bonded on the composite layer of the non-conductor inorganic material and the organic material. The chip is embedded in the sealant, and the chip has electrode pads. The circuit layer structure is formed on the sealant and the chip. The circuit layer structure includes at least one dielectric layer and at least one circuit layer. The dielectric layer has conductive blind holes. The insulating protective layer is formed on the circuit layer structure. The insulating protective layer has openings, so as to expose parts of the surface of the circuit layer structure in the openings.

公开(公告)号：US20170374748A1

公开(公告)日：2017-12-28

申请号：US15701435

申请日：2017-09-11

Applicant: Unimicron Technology Corp.

Inventor： Kai-Ming YANG ,  Chen-Hao LIN ,  Wang-Hsiang TSAI ,  Cheng-Ta KO

IPC: H05K3/40 ,  H05K1/14 ,  H01L21/48 ,  H01L23/14 ,  H01L23/15 ,  H05K1/18 ,  H01L23/498 ,  H05K1/11 ,  H01L21/768

CPC classification number: H05K3/4038 ,  H01L21/4846 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/145 ,  H01L23/147 ,  H01L23/15 ,  H01L23/36 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/04105 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/96 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2924/37001 ,  H05K1/0271 ,  H05K1/11 ,  H05K1/112 ,  H05K1/142 ,  H05K1/183 ,  H05K3/4673 ,  H05K3/4682 ,  H05K3/4694 ,  H05K2201/10674 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49165

Abstract: A package structure includes a metal layer, a composite layer of a non-conductor inorganic material and an organic material, a sealant, a chip, a circuit layer structure, and an insulating protective layer. The composite layer of the non-conductor inorganic material and the organic material is disposed on the metal layer. The sealant is bonded on the composite layer of the non-conductor inorganic material and the organic material. The chip is embedded in the sealant, and the chip has electrode pads. The circuit layer structure is formed on the sealant and the chip. The circuit layer structure includes at least one dielectric layer and at least one circuit layer. The dielectric layer has conductive blind holes. The insulating protective layer is formed on the circuit layer structure. The insulating protective layer has openings, so as to expose parts of the surface of the circuit layer structure in the openings.

公开(公告)号：US20200068721A1

公开(公告)日：2020-02-27

申请号：US16672512

申请日：2019-11-03

Applicant: Unimicron Technology Corp.

Inventor： Kai-Ming YANG ,  Chen-Hao LIN ,  Wang-Hsiang TSAI ,  Cheng-Ta KO

IPC: H05K3/40 ,  H05K1/18 ,  H05K1/11 ,  H05K1/14 ,  H01L23/14 ,  H01L23/15 ,  H01L23/498 ,  H01L21/48 ,  H01L21/768

Abstract: A package structure, includes a metal layer, an insulating composite layer disposed thereon, a sealant bonded on the insulating composite layer, a chip embedded in the sealant, a circuit layer structure disposed on the sealant and the chip, and a protecting layer. The chip has a plurality of electrode pads exposed from the sealant. The circuit layer structure includes at least one dielectric layer and at least one circuit layer. The dielectric layer has a plurality of conductive blind vias. The dielectric layer and the sealant are made of the same material. The circuit layer is disposed on the dielectric layer and extends into the conductive blind vias, and the bottommost circuit layer is electrically connected to the electrode pads through the conductive blind vias. The protecting layer is formed on the circuit layer structure and has a plurality of openings exposing a portion of the circuit layer structure.