公开(公告)号：US20220285255A1

公开(公告)日：2022-09-08

申请号：US17232109

申请日：2021-04-15

Applicant: Unimicron Technology Corp.

Inventor： Yan-Jia Peng ,  Kuo-Ching Chen ,  Pu-Ju Lin

IPC: H01L23/498 ,  H05K3/46 ,  H01L23/12 ,  H01L23/528 ,  H01L23/532 ,  H01L23/16 ,  H01L23/00 ,  H01L21/50 ,  H01L21/768

Abstract: A method of fabricating a wiring board with an embedded interposer substrate includes preparing a main substrate, forming a recess on the main substrate, placing an interposer substrate into the recess, electrically connecting a second pad of the interposer substrate and the first pad of the main substrate, and filling a gap between the interposer substrate and the main substrate with an underfill. The recess exposes a first pad of the main substrate. A second pad of interposer substrate and the first pad of the main substrate are made of the same metal and formed in different outer surface profiles. The underfill entirely touches side surfaces and a bottom surface of the interposer substrate.

公开(公告)号：US11488900B2

公开(公告)日：2022-11-01

申请号：US17232109

申请日：2021-04-15

Applicant: Unimicron Technology Corp.

Inventor： Yan-Jia Peng ,  Kuo-Ching Chen ,  Pu-Ju Lin

IPC: H01L23/498 ,  H05K3/46 ,  H01L23/12 ,  H01L23/528 ,  H01L21/768 ,  H01L23/16 ,  H01L23/00 ,  H01L21/50 ,  H01L23/532

Abstract: A method of fabricating a wiring board with an embedded interposer substrate includes preparing a main substrate, forming a recess on the main substrate, placing an interposer substrate into the recess, electrically connecting a second pad of the interposer substrate and the first pad of the main substrate, and filling a gap between the interposer substrate and the main substrate with an underfill. The recess exposes a first pad of the main substrate. A second pad of interposer substrate and the first pad of the main substrate are made of the same metal and formed in different outer surface profiles. The underfill entirely touches side surfaces and a bottom surface of the interposer substrate.

公开(公告)号：US11234324B1

公开(公告)日：2022-01-25

申请号：US17171814

申请日：2021-02-09

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Ping-Che Yang ,  Tsun-Sheng Chou ,  Yan-Jia Peng

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/40 ,  H05K1/11 ,  H05K3/00

Abstract: A circuit board structure includes a first dielectric layer, at least one first circuit layer, a second dielectric layer, and an insulating protection layer. The first circuit layer is mounted on the first dielectric layer, and includes at least one first circuit. The second dielectric layer is mounted on the first circuit layer, and includes at least one thermally conductive bump and at least one electrically conductive bump. The electrically conductive bump is electrically connected to the first circuit. The insulating protection layer is mounted on the second dielectric layer. The thermally conductive bump directly contacts the glass substrate. When lasering is applied to cut the glass substrate for de-bonding, the lasering heat energy can be absorbed and dissipated by the thermally conductive bump, resolving the problem of circuit de-bonding and raising the process yield. In addition, a manufacturing method of the circuit board structure is provided.