公开(公告)号：US11901097B2

公开(公告)日：2024-02-13

申请号：US17288838

申请日：2019-10-28

Applicant: University of Houston System

Inventor： Goran Majkic ,  Anis Ben Yahia ,  Wenbo Luo ,  Venkat Selvamanickam ,  Soumen Kar

IPC: H01B12/06

CPC classification number: H01B12/06

Abstract: A round superconductor wire and method for fabricating same are disclosed. Embodiments are directed to a round superconductor wire including at least two superconductor tapes wound on a wire former. Each superconductor tape includes: bottom stabilizer and silver layers; substrate disposed above the bottom silver layer; buffer film stack disposed above the substrate; superconductor film disposed above the buffer film stack; top silver layer disposed above the superconductor film; and top stabilizer layer disposed above the top silver layer. At least one of the bottom stabilizer layer, bottom silver layer, substrate, buffer film stack, superconductor film, top silver layer, or top stabilizer layer is of a different width, thickness, or material composition in one of the superconductor tapes than in another of the superconductor tapes. These and other embodiments achieve a round superconductor wire having improved current density in high magnetic field applications when made in small diameters.

公开(公告)号：US20210358660A1

公开(公告)日：2021-11-18

申请号：US17288838

申请日：2019-10-28

Applicant: University of Houston System

Inventor： Goran Majkic ,  Anis Ben Yahia ,  Wenbo Luo ,  Venkat Selvamanickam ,  Soumen Kar

IPC: H01B12/06

Abstract: A round superconductor wire and method for fabricating same are disclosed. Embodiments are directed to a round superconductor wire including at least two superconductor tapes wound on a wire former. Each superconductor tape includes: bottom stabilizer and silver layers; substrate disposed above the bottom silver layer; buffer film stack disposed above the substrate; superconductor film disposed above the buffer film stack; top silver layer disposed above the superconductor film; and top stabilizer layer disposed above the top silver layer. At least one of the bottom stabilizer layer, bottom silver layer, substrate, buffer film stack, superconductor film, top silver layer, or top stabilizer layer is of a different width, thickness, or material composition in one of the superconductor tapes than in another of the superconductor tapes. These and other embodiments achieve a round superconductor wire having improved current density in high magnetic field applications when made in small diameters.