Round superconductor wires
    2.
    发明授权

    公开(公告)号:US11901097B2

    公开(公告)日:2024-02-13

    申请号:US17288838

    申请日:2019-10-28

    CPC classification number: H01B12/06

    Abstract: A round superconductor wire and method for fabricating same are disclosed. Embodiments are directed to a round superconductor wire including at least two superconductor tapes wound on a wire former. Each superconductor tape includes: bottom stabilizer and silver layers; substrate disposed above the bottom silver layer; buffer film stack disposed above the substrate; superconductor film disposed above the buffer film stack; top silver layer disposed above the superconductor film; and top stabilizer layer disposed above the top silver layer. At least one of the bottom stabilizer layer, bottom silver layer, substrate, buffer film stack, superconductor film, top silver layer, or top stabilizer layer is of a different width, thickness, or material composition in one of the superconductor tapes than in another of the superconductor tapes. These and other embodiments achieve a round superconductor wire having improved current density in high magnetic field applications when made in small diameters.

    Superconductor with improved flux pinning at low temperatures

    公开(公告)号:US11488746B2

    公开(公告)日:2022-11-01

    申请号:US17074223

    申请日:2020-10-19

    Abstract: A REBCO superconductor tape that can achieve a lift factor greater than or equal to approximately 3.0 or 4.0 in an approximately 3 T magnetic field applied perpendicular to a REBCO tape at approximately 30 K. In an embodiment, the REBCO superconductor tape can include a critical current density less than or equal to approximately 4.2 MA/cm2 at 77 K in the absence of an external magnetic field. In another embodiment, the REBCO superconductor tape can include a critical current density greater than or equal to approximately 12 MA/cm2 at approximately 30 K in a magnetic field of approximately 3 T having an orientation parallel to a c-axis.

    Ultra-thin film superconducting tapes

    公开(公告)号:US11309480B2

    公开(公告)日:2022-04-19

    申请号:US15573632

    申请日:2016-05-11

    Abstract: An ultra-thin film superconducting tape and method for fabricating same is disclosed. Embodiments are directed to a superconducting tape being fabricated by processes which include removing a portion of the superconducting tape's substrate subsequent the substrate's initial formation, whereby a thickness of the superconducting tape is reduced to 15-80 μm.

    ROUND SUPERCONDUCTOR WIRES
    8.
    发明申请

    公开(公告)号:US20210358660A1

    公开(公告)日:2021-11-18

    申请号:US17288838

    申请日:2019-10-28

    Abstract: A round superconductor wire and method for fabricating same are disclosed. Embodiments are directed to a round superconductor wire including at least two superconductor tapes wound on a wire former. Each superconductor tape includes: bottom stabilizer and silver layers; substrate disposed above the bottom silver layer; buffer film stack disposed above the substrate; superconductor film disposed above the buffer film stack; top silver layer disposed above the superconductor film; and top stabilizer layer disposed above the top silver layer. At least one of the bottom stabilizer layer, bottom silver layer, substrate, buffer film stack, superconductor film, top silver layer, or top stabilizer layer is of a different width, thickness, or material composition in one of the superconductor tapes than in another of the superconductor tapes. These and other embodiments achieve a round superconductor wire having improved current density in high magnetic field applications when made in small diameters.

    Superconductor with Improved Flux Pinning at Low Temperatures

    公开(公告)号:US20210104340A1

    公开(公告)日:2021-04-08

    申请号:US17074223

    申请日:2020-10-19

    Abstract: A REBCO superconductor tape that can achieve a lift factor greater than or equal to approximately 3.0 or 4.0 in an approximately 3 T magnetic field applied perpendicular to a REBCO tape at approximately 30 K. In an embodiment, the REBCO superconductor tape can include a critical current density less than or equal to approximately 4.2 MA/cm2 at 77 K in the absence of an external magnetic field. In another embodiment, the REBCO superconductor tape can include a critical current density greater than or equal to approximately 12 MA/cm2 at approximately 30 K in a magnetic field of approximately 3 T having an orientation parallel to a c-axis.

    Superconductor and Method for Superconductor Manufacturing
    10.
    发明申请
    Superconductor and Method for Superconductor Manufacturing 审中-公开
    超导体和超导体制造方法

    公开(公告)号:US20150357088A1

    公开(公告)日:2015-12-10

    申请号:US13907356

    申请日:2013-05-31

    CPC classification number: H01B12/06 H01B13/0036 H01L39/126 H01L39/247

    Abstract: Disclosed is a superconducting article comprising a silver overlayer consisting of no more than about 20% of grains over about 1 μm, having a minimum Vickers micro-hardness value of about 100, and a porosity of less than about 1%. A method of manufacturing a superconducting tape is disclosed as comprising, deposition of silver, oxygenation at about 400° C. for about 30 minutes, slitting, deposition of silver at a temperature of less than about 250° C., and application of copper.

    Abstract translation: 公开了一种超导制品,其包含由约1μm以上的不超过约20%的晶粒构成的银覆盖层,具有约100的最小维氏显微硬度值和小于约1%的孔隙率。 公开了一种制造超导带的方法,包括:在约400℃下氧化约30分钟,在小于约250℃的温度下切割银,沉积银,并施加铜。

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