公开(公告)号：WO1989000346A1

公开(公告)日：1989-01-12

申请号：PCT/US1988002210

申请日：1988-06-28

Applicant: WESTERN DIGITAL CORP.

Inventor： WESTERN DIGITAL CORP. ,  PATTERSON, Timothy, P. ,  HOGE, Carl, E. ,  BAIA, Joseph

IPC: H01R09/09

CPC classification number: H05K3/3442 ,  H01L23/13 ,  H01L23/49805 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01R12/716 ,  H05K1/0271 ,  H05K1/0284 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/42 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09181 ,  H05K2201/09709 ,  Y02P70/613 ,  H01L2924/00014

Abstract: A plated plastic castellated interconnect (20) comprises a substrate (22) made from a molded polymeric material and having top and bottom surfaces (30, 34) with a plurality of separate mutually spaced apart castellations (32) integrally molded to the substrate (22) and projecting from the bottom surface (34) of the substrate (22). A plurality of separate spaced apart recessed regions (40) may be molded in an edge of the substrate (22) and aligned with the castellations (32). A plurality of metal conductors (46) are plated to the substrate (22) as separate conductive circuit traces (48), so that each circuit trace (48) extends continuously from the top surface (30) along the surface of a corresponding recess (40) and to a common plane on a respective castellation (32) at the bottom (34) of the substrate (22). The plated metal castellations are arranged for soldering or gluing to contacts (99) on a printed circuit board (102) for electrical connection to an electrical component such as an IC chip (26) connected to the circuit traces (48) on the substrate (22). The plated plastic castellations on one component provide high lead pitch densities, complex configurations, and compliancy of electrical connections to a second electrical component, as well as other advantages.

Abstract translation: 电镀塑料雉形互连（20）包括由模制的聚合材料制成并具有顶表面和底表面（30,34）的基底（22），所述顶表面和底表面（30,34）具有与基底（22）整体成型的多个分离的相互间隔的雉（（32） ）并从衬底（22）的底表面（34）突出。 多个分离的间隔开的凹陷区域（40）可以模制在衬底（22）的边缘中并且与蓖体（32）对准。 多个金属导体（46）作为单独的导电电路迹线（48）被电镀到基板（22）上，使得每个电路迹线（48）沿着相应凹部的表面从顶表面（30）连续延伸 40）并且到位于衬底（22）的底部（34）处的相应的座标（32）上的公共平面。 电镀金属的蓖房被布置用于焊接或胶合到印刷电路板（102）上的触点（99），用于电连接到诸如连接到基板上的电路迹线（48）的IC芯片（26）的电气部件 22）。 一个组件上的电镀塑料雉鸡提供高引线间距密度，复杂配置以及与第二电气部件的电连接的兼容性以及其它优点。