公开(公告)号：US20170162518A1

公开(公告)日：2017-06-08

申请号：US15147401

申请日：2016-05-05

Applicant: WIN Semiconductors Corp.

Inventor： PEI-CHUN LIAO ,  PO-WEI TING ,  CHIH-FENG CHIANG ,  YU-KAI WU ,  YU-FAN CHANG ,  RE-CHING LIN ,  SHU-HSIAO TSAI ,  CHENG-KUO LIN

IPC: H01L23/00 ,  B81B7/00 ,  G01C19/00 ,  H01L25/16

Abstract: A chip stack having a protection structure for semiconductor device package, which comprises a first chip and a second chip stacked with each other, wherein said first chip has a first surface, said second chip has a second surface, said first surface and said second surface are two surfaces facing to each other, wherein at least one metal pillar is formed on at least one of said first surface and said second surface and connected with the other, at least one protection ring is formed on at least one of said first surface and said second surface and having a first gap with the other, and at least one electrical device is formed on at least one of said first surface and said second surface, wherein said at least one electrical device is located inside at least one of said at least one protection ring.

公开(公告)号：US20170203959A1

公开(公告)日：2017-07-20

申请号：US15474613

申请日：2017-03-30

Applicant: WIN Semiconductors Corp.

Inventor： PEI-CHUN LIAO ,  PO-WEI TING ,  CHIH-FENG CHIANG ,  YU-KAI WU ,  YU-FAN CHANG ,  RE-CHING LIN ,  SHU-HSIAO TSAI ,  CHENG-KUO LIN

IPC: B81B7/00 ,  H03H9/25

CPC classification number: H03H9/25 ,  B81B7/0077 ,  B81B2201/0242 ,  B81B2201/0271 ,  B81B2201/0278 ,  B81B2203/0315 ,  G01C19/5783 ,  H01L23/562 ,  H01L24/29 ,  H01L25/162 ,  H01L25/165 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2225/06541

Abstract: A chip stack having a protection structure for semiconductor device package comprises a first chip and a second chip stacked with each other. A first surface of the first chip and a second surface of the second chip are facing to each other. At least one metal pillar is formed on at least one of the first surface and the second surface and connected with the other. At least one protection ring is formed on at least one of the first surface and the second surface and having a first gap with the other. At least one electrical device is formed on at least one of the first surface and the second surface and is located inside at least one of the at least one protection ring, wherein the at least one electrical device includes a temperature sensor.