公开(公告)号：GB2383892B

公开(公告)日：2004-10-27

申请号：GB0305798

申请日：2001-08-14

Applicant: WORLD PROPERTIES INC

Inventor： FITTS BRUCE B ,  LANDI VINCENT R ,  ROY SAROJ K

IPC: C08J5/00 ,  H01B1/04 ,  H01B1/20 ,  H01B1/24 ,  H01M2/14 ,  H01M4/00 ,  H01M4/66 ,  H01M8/02

Abstract: A conductive, moldable composite material for the manufacture of electrochemical cell components comprising a thermosetting resin system and conductive filler wherein the thermosetting resin composition comprises: (1) a polybutadiene or polyisoprene resin; (2) an optional functionalized liquid polybutadiene or polyisoprene resin; (3) an optional butadiene- or isoprene-containing copolymer; and (4) an optional low molecular weight polymer. In a preferred embodiment, the conductive moldable composite material is used to form a bipolar plate, current collector or other electrochemical cell component. Articles made of the conductive moldable composite material are resistant to chemical attack and hydrolysis, have excellent mechanical strength and toughness, have a volume resistivity of about 0.116 ohm-cm or less and preferably about 0.04 ohm-cm or less and a thermal conductivity of at least about 5 watts/meter ° K.

公开(公告)号：GB2389701A

公开(公告)日：2003-12-17

申请号：GB0319464

申请日：2002-01-18

Applicant: WORLD PROPERTIES INC ,  DAIS ANALYTIC CORP

Inventor： FITTS BRUCE B ,  LANDI VINCENT R ,  ROY SAROJ K ,  JOHNSON BRIAN C ,  EHRENBERG SCOTT G

IPC: C25B9/04 ,  H01M8/02 ,  H01M8/04 ,  H01M8/24

Abstract: A component for an electrochemical cell comprises a thermally and electrically conductive core with an active area substantially covered by an electrically and thermally conductive polymeric composite, wherein the conductive polymeric composite is adhered to the core by an adhesion promoter. The electrically conductive polymeric composite preferably comprises a thermosetting polybutadiene-or polyisoprene- based resin system and an electrically conductive filler. The component is resistant to chemical attack and hydrolysis, and has excellent mechanical strength and toughness. Components may be manufactured having a volume resistivity of about 0.500 ohm-cm or less and a thermal conductivity of at least about 5 watts/meter {K.,. In addition, the component is economical to produce due to inexpensive starting materials as well as the use of conventional processing equipment.

公开(公告)号：DE10196589T1

公开(公告)日：2003-07-10

申请号：DE10196589

申请日：2001-08-14

Applicant: WORLD PROPERTIES INC

Inventor： FITTS BRUCE B ,  ROY SAROJ K ,  LANDI VINCENT R

IPC: C08J5/00 ,  H01B1/04 ,  H01B1/20 ,  H01B1/24 ,  H01M2/14 ,  H01M4/00 ,  H01M4/66 ,  H01M8/02

Abstract: A conductive, moldable composite material for the manufacture of electrochemical cell components comprising a thermosetting resin system and conductive filler wherein the thermosetting resin composition comprises: (1) a polybutadiene or polyisoprene resin; (2) an optional functionalized liquid polybutadiene or polyisoprene resin; (3) an optional butadiene- or isoprene-containing copolymer; and (4) an optional low molecular weight polymer. In a preferred embodiment, the conductive moldable composite material is used to form a bipolar plate, current collector or other electrochemical cell component. Articles made of the conductive moldable composite material are resistant to chemical attack and hydrolysis, have excellent mechanical strength and toughness, have a volume resistivity of about 0.116 ohm-cm or less and preferably about 0.04 ohm-cm or less and a thermal conductivity of at least about 5 watts/meter ° K.

公开(公告)号：DE10295503T5

公开(公告)日：2005-09-08

申请号：DE10295503

申请日：2002-01-18

Applicant: WORLD PROPERTIES INC ,  DAIS ANALYTIC CORP

Inventor： FITTS BRUCE B ,  LANDI VINCENT R ,  ROY SAROJ KUMAR ,  JOHNSON BRIAN C ,  EHRENBERG SCOTT G

IPC: C25B9/04 ,  H01M8/02 ,  H01M8/04 ,  H01M8/24

Abstract: A component for an electrochemical cell comprises a thermally and electrically conductive core with an active area substantially covered by an electrically and thermally conductive polymeric composite, wherein the conductive polymeric composite is adhered to the core by an adhesion promoter. The electrically conductive polymeric composite preferably comprises a thermosetting polybutadiene- or polyisoprene-based resin system and an electrically conductive filler. The component is resistant to chemical attack and hydrolysis, and has excellent mechanical strength and toughness. Components may be manufactured having a volume resistivity of about 0.500 ohm-cm or less and a thermal conductivity of at least about 5 watts/meter ° K,. In addition, the component is economical to produce due to inexpensive starting materials as well as the use of conventional processing equipment.

公开(公告)号：GB2383892A

公开(公告)日：2003-07-09

申请号：GB0305798

申请日：2001-08-14

Applicant: WORLD PROPERTIES INC

Inventor： FITTS BRUCE B ,  LANDI VINCENT R ,  ROY SAROJ K

IPC: C08J5/00 ,  H01B1/04 ,  H01B1/20 ,  H01B1/24 ,  H01M2/14 ,  H01M4/00 ,  H01M4/66 ,  H01M8/02

Abstract: A conductive, moldable composite material for the manufacture of electrochemical cell components comprising a thermosetting resin system and conductive filler wherein the thermosetting resin composittion comprises: (1) a polybutadiene or polyisoprene resin; (2) an optional functionalized liquid polybutadiene or polyisoprene resin; (3) an optional butadiene- or isoprene-containing copolymer; and (4) an optional low molecular weight polymer. In a preferred embodiment, the conductive moldable composite material is used to form a bipolar plate, current collector or other electrochemical cell component. Articles made of the conductive moldable composite material are resistant to chemical attack and hydrolysis, have excellent mechanical strength and toughness, have a volume resistivity of about 1.006 ohm-cm or less and preferably about 0.04 ohm-cm or less and a thermal conductivity of at least about 5 watts/meter {K.

公开(公告)号：AU8543601A

公开(公告)日：2002-02-25

申请号：AU8543601

申请日：2001-08-14

Applicant: WORLD PROPERTIES INC

Inventor： FITTS BRUCE B ,  LANDI VINCENT R ,  ROY SAROJ K

IPC: C08J5/00 ,  H01B1/04 ,  H01B1/20 ,  H01B1/24 ,  H01M2/14 ,  H01M4/00 ,  H01M4/66 ,  H01M8/02

Abstract: A conductive, moldable composite material for the manufacture of electrochemical cell components comprising a thermosetting resin system and conductive filler wherein the thermosetting resin composition comprises: (1) a polybutadiene or polyisoprene resin; (2) an optional functionalized liquid polybutadiene or polyisoprene resin; (3) an optional butadiene- or isoprene-containing copolymer; and (4) an optional low molecular weight polymer. In a preferred embodiment, the conductive moldable composite material is used to form a bipolar plate, current collector or other electrochemical cell component. Articles made of the conductive moldable composite material are resistant to chemical attack and hydrolysis, have excellent mechanical strength and toughness, have a volume resistivity of about 0.116 ohm-cm or less and preferably about 0.04 ohm-cm or less and a thermal conductivity of at least about 5 watts/meter ° K.

公开(公告)号：AU4959501A

公开(公告)日：2001-10-15

申请号：AU4959501

申请日：2001-03-29

Applicant: WORLD PROPERTIES INC

Inventor： FITTS BRUCE B ,  HAVELES ELANA E ,  MANSO DAVID E ,  LANDI VINCENT R

IPC: C08L9/00 ,  C08L53/00 ,  H05B3/42 ,  H05B3/46 ,  H05B3/48 ,  H05B3/82 ,  H05K1/03 ,  H05B3/00

Abstract: Articles are formed from a thermosetting composition based on polybutadiene or polyisoprene resins which are subjected to a high temperature cure step of greater than 250° C. The thermosetting compositions may include fillers such as particulate ceramic fillers and may also include woven webs for improved dimensional stability and decreased brittleness. The formation process of this invention is particularly well suited for making electrical circuit substrates for microwave and digital circuits, typically in the form of the thermosetting composition being laminated on one or both opposed surfaces to metal conductive foil (e.g., copper). The compositions find particular utility for encapsulating and electrically insulating electrical resistance heating elements for use with fluids.

公开(公告)号：WO0215302A3

公开(公告)日：2003-01-23

申请号：PCT/US0141713

申请日：2001-08-14

Applicant: WORLD PROPERTIES INC

Inventor： FITTS BRUCE B ,  LANDI VINCENT R ,  ROY SAROJ K

IPC: C08J5/00 ,  H01B1/04 ,  H01B1/20 ,  H01B1/24 ,  H01M2/14 ,  H01M4/00 ,  H01M4/66 ,  H01M8/02

CPC classification number: H01M4/668 ,  C08J5/00 ,  C08J2321/00 ,  H01B1/24 ,  H01M4/666 ,  H01M8/0221 ,  H01M8/0226 ,  Y02P70/56

Abstract: A conductive, moldable composite material for the manufacture of electrochemical cell components comprising a thermosetting resin system and conductive filler wherein the thermosetting resin composittion comprises: (1) a polybutadiene or polyisoprene resin; (2) an optional functionalized liquid polybutadiene or polyisoprene resin; (3) an optional butadiene- or isoprene-containing copolymer; and (4) an optional low molecular weight polymer. In a preferred embodiment, the conductive moldable composite material is used to form a bipolar plate, current collector or other electrochemical cell component. Articles made of the conductive moldable composite material are resistant to chemical attack and hydrolysis, have excellent mechanical strength and toughness, have a volume resistivity of about 1.006 ohm-cm or less and preferably about 0.04 ohm-cm or less and a thermal conductivity of at least about 5 watts/meter DEG K.

Abstract translation: 一种用于制造包含热固性树脂体系和导电填料的电化学电池部件的导电的可成型复合材料，其中所述热固性树脂复合物包括：（1）聚丁二烯或聚异戊二烯树脂; （2）任选的官能化液体聚丁二烯或聚异戊二烯树脂; （3）任选的含丁二烯或异戊二烯的共聚物; 和（4）任选的低分子量聚合物。 在优选实施例中，导电可成型复合材料用于形成双极板，集电器或其它电化学电池元件。 由导电性可成型复合材料制成的制品耐化学侵蚀和水解，具有优异的机械强度和韧性，体积电阻率为约1.006欧姆 - 厘米或更小，优选约0.04欧姆 - 厘米或更小，热导率为 至少约5瓦/米DEG。

公开(公告)号：WO0176322A3

公开(公告)日：2002-01-31

申请号：PCT/US0110085

申请日：2001-03-29

Applicant: WORLD PROPERTIES INC

Inventor： FITTS BRUCE B ,  HAVELES ELANA E ,  MANSO DAVID E ,  LANDI VINCENT R

IPC: C08L9/00 ,  C08L53/00 ,  H05B3/42 ,  H05B3/46 ,  H05B3/48 ,  H05B3/82 ,  H05K1/03 ,  H05B3/14

CPC classification number: C08L9/00 ,  C08L53/00 ,  H05B3/42 ,  H05B3/46 ,  H05B3/48 ,  H05B3/82 ,  H05K1/032 ,  C08L2666/24 ,  C08L2666/04

Abstract: Articles are formed from a thermosetting composition based on polybutadiene or polyisoprene resins which are subjected to a high temperature cure step of greater than 250 DEG C. The thermosetting compositions may include fillers such as particulate ceramic fillers and may also include woven webs for improved dimensional stability and decreased brittleness. The formation process of this invention is particularly well suited for making electrical circuit substrates for microwave and digital circuits, typically in the form of the thermosetting composition being laminated on one or both opposed surfaces to metal conductive foil (e.g., copper). The compositions find particular utility for encapsulating and electrically insulating electrical resistance heating elements for use with fluids.

Abstract translation: 制品由基于聚丁二烯或聚异戊二烯树脂的热固性组合物形成，其经受高于250℃的高温固化步骤。热固性组合物可包括填料如颗粒陶瓷填料，还可包括用于改善尺寸稳定性的织造网 并降低脆性。 本发明的形成方法特别适用于制造用于微波和数字电路的电路基板，通常以热固性组合物的形式层压在金属导电箔（例如铜）的一个或两个相对的表面上。 该组合物特别用于封装和电绝缘用于流体的电阻加热元件。