中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

19 records (took 0.022 seconds)

    1.
    发明专利
    未知

    公开(公告)号：DE69937336D1

    公开(公告)日：2007-11-29

    申请号：DE69937336

    申请日：1999-08-12

    Applicant: WORLD PROPERTIES INC

    Inventor： LANDI VINCENT R

    IPC: C08J5/04 ,  H05K1/03 ,  B32B15/08 ,  C08K3/00 ,  C08K3/34 ,  C08K3/40 ,  C08K7/02 ,  C08K7/28 ,  C08L9/00 ,  C08L9/06 ,  C08L23/16 ,  C08L53/00 ,  H05K1/02 ,  H05K1/16

    Abstract: An electrical substrate material is presented comprising a thermosetting matrix which includes a polybutadiene or polyisoprene resin, an unsaturated butadiene- or isoprene-containing polymer and an ethylene propylene rubber; a particulate filler and, a fabric. Preferred ethylene propylene rubbers are ethylene propylene copolymers and ethylene propylene diene terpolymer rubbers wherein the diene is dicyclopentadiene. The ethylene propylene rubber is present in an amount of up to about 20 wt % with respect to the resin, preferably in an amount of about 1 to about 7 wt %, more preferably about 5 wt %. The presence of the ethylene propylene rubber enhances the dielectric strength of the resulting electrical substrate material, while other electrical, chemical, and mechanical properties of the material are not adversely effected.

    THERMOSETTING COMPOSITION FOR ELECTROCHEMICAL CELL COMPONENTS AND METHODS OF MAKING THEREOF
    3.
    发明申请
    THERMOSETTING COMPOSITION FOR ELECTROCHEMICAL CELL COMPONENTS AND METHODS OF MAKING THEREOF 审中-公开
    电化学电池组件的热固化组合物及其制备方法

    公开(公告)号：WO0215302A3

    公开(公告)日：2003-01-23

    申请号：PCT/US0141713

    申请日：2001-08-14

    Applicant: WORLD PROPERTIES INC

    Inventor： FITTS BRUCE B ,  LANDI VINCENT R ,  ROY SAROJ K

    IPC: C08J5/00 ,  H01B1/04 ,  H01B1/20 ,  H01B1/24 ,  H01M2/14 ,  H01M4/00 ,  H01M4/66 ,  H01M8/02

    CPC classification number: H01M4/668 ,  C08J5/00 ,  C08J2321/00 ,  H01B1/24 ,  H01M4/666 ,  H01M8/0221 ,  H01M8/0226 ,  Y02P70/56

    Abstract: A conductive, moldable composite material for the manufacture of electrochemical cell components comprising a thermosetting resin system and conductive filler wherein the thermosetting resin composittion comprises: (1) a polybutadiene or polyisoprene resin; (2) an optional functionalized liquid polybutadiene or polyisoprene resin; (3) an optional butadiene- or isoprene-containing copolymer; and (4) an optional low molecular weight polymer. In a preferred embodiment, the conductive moldable composite material is used to form a bipolar plate, current collector or other electrochemical cell component. Articles made of the conductive moldable composite material are resistant to chemical attack and hydrolysis, have excellent mechanical strength and toughness, have a volume resistivity of about 1.006 ohm-cm or less and preferably about 0.04 ohm-cm or less and a thermal conductivity of at least about 5 watts/meter DEG K.

    Abstract translation: 一种用于制造包含热固性树脂体系和导电填料的电化学电池部件的导电的可成型复合材料，其中所述热固性树脂复合物包括：（1）聚丁二烯或聚异戊二烯树脂; （2）任选的官能化液体聚丁二烯或聚异戊二烯树脂; （3）任选的含丁二烯或异戊二烯的共聚物; 和（4）任选的低分子量聚合物。 在优选实施例中，导电可成型复合材料用于形成双极板，集电器或其它电化学电池元件。 由导电性可成型复合材料制成的制品耐化学侵蚀和水解，具有优异的机械强度和韧性，体积电阻率为约1.006欧姆 - 厘米或更小，优选约0.04欧姆 - 厘米或更小，热导率为 至少约5瓦/米DEG。

    HEATING ELEMENTS COMPRISING POLYBUTADIENE AND POLYISOPRENE BASED THERMOSETTING COMPOSITIONS
    4.
    发明申请
    HEATING ELEMENTS COMPRISING POLYBUTADIENE AND POLYISOPRENE BASED THERMOSETTING COMPOSITIONS 审中-公开
    包含聚丁二烯和聚异戊二烯基热固性组合物的加热元素

    公开(公告)号：WO0176322A3

    公开(公告)日：2002-01-31

    申请号：PCT/US0110085

    申请日：2001-03-29

    Applicant: WORLD PROPERTIES INC

    Inventor： FITTS BRUCE B ,  HAVELES ELANA E ,  MANSO DAVID E ,  LANDI VINCENT R

    IPC: C08L9/00 ,  C08L53/00 ,  H05B3/42 ,  H05B3/46 ,  H05B3/48 ,  H05B3/82 ,  H05K1/03 ,  H05B3/14

    CPC classification number: C08L9/00 ,  C08L53/00 ,  H05B3/42 ,  H05B3/46 ,  H05B3/48 ,  H05B3/82 ,  H05K1/032 ,  C08L2666/24 ,  C08L2666/04

    Abstract: Articles are formed from a thermosetting composition based on polybutadiene or polyisoprene resins which are subjected to a high temperature cure step of greater than 250 DEG C. The thermosetting compositions may include fillers such as particulate ceramic fillers and may also include woven webs for improved dimensional stability and decreased brittleness. The formation process of this invention is particularly well suited for making electrical circuit substrates for microwave and digital circuits, typically in the form of the thermosetting composition being laminated on one or both opposed surfaces to metal conductive foil (e.g., copper). The compositions find particular utility for encapsulating and electrically insulating electrical resistance heating elements for use with fluids.

    Abstract translation: 制品由基于聚丁二烯或聚异戊二烯树脂的热固性组合物形成，其经受高于250℃的高温固化步骤。热固性组合物可包括填料如颗粒陶瓷填料，还可包括用于改善尺寸稳定性的织造网 并降低脆性。 本发明的形成方法特别适用于制造用于微波和数字电路的电路基板，通常以热固性组合物的形式层压在金属导电箔（例如铜）的一个或两个相对的表面上。 该组合物特别用于封装和电绝缘用于流体的电阻加热元件。

    Thermosetting composition for electrochemical cell components and methods of making thereof
    6.
    发明专利
    Thermosetting composition for electrochemical cell components and methods of making thereof 未知

    公开(公告)号：GB2383892A

    公开(公告)日：2003-07-09

    申请号：GB0305798

    申请日：2001-08-14

    Applicant: WORLD PROPERTIES INC

    Inventor： FITTS BRUCE B ,  LANDI VINCENT R ,  ROY SAROJ K

    IPC: C08J5/00 ,  H01B1/04 ,  H01B1/20 ,  H01B1/24 ,  H01M2/14 ,  H01M4/00 ,  H01M4/66 ,  H01M8/02

    Abstract: A conductive, moldable composite material for the manufacture of electrochemical cell components comprising a thermosetting resin system and conductive filler wherein the thermosetting resin composittion comprises: (1) a polybutadiene or polyisoprene resin; (2) an optional functionalized liquid polybutadiene or polyisoprene resin; (3) an optional butadiene- or isoprene-containing copolymer; and (4) an optional low molecular weight polymer. In a preferred embodiment, the conductive moldable composite material is used to form a bipolar plate, current collector or other electrochemical cell component. Articles made of the conductive moldable composite material are resistant to chemical attack and hydrolysis, have excellent mechanical strength and toughness, have a volume resistivity of about 1.006 ohm-cm or less and preferably about 0.04 ohm-cm or less and a thermal conductivity of at least about 5 watts/meter {K.

    Silanated copper foils, method of making, and use thereof
    7.
    发明专利
    Silanated copper foils, method of making, and use thereof 未知

    公开(公告)号：AU2002332593A1

    公开(公告)日：2003-03-10

    申请号：AU2002332593

    申请日：2002-08-21

    Applicant: WORLD PROPERTIES INC

    Inventor： LANDI VINCENT R ,  NEILL JOHN T ,  KIM KI-SOO

    IPC: B32B15/08 ,  C09D4/00 ,  H05K3/38 ,  B32B15/00 ,  B05D7/00

    Abstract: A coated foil comprises a thick silane layer disposed on the copper foil, wherein the silane layer is present in an amount greater than or equal to about 0.1 gram per square meter. The copper foil may further comprise thermal barrier. The silanated copper foil may further comprise an elastomer layer disposed on a side of the thick silane layer opposite the copper foil. When the silanated copper foil is used in the manufacture of circuit materials the circuit materials demonstrate improved bond retention after exposure to acidic processing conditions.

    Thermosetting composition for electrochemical cell components and methods of making thereof
    8.
    发明专利
    Thermosetting composition for electrochemical cell components and methods of making thereof 未知

    公开(公告)号：AU8543601A

    公开(公告)日：2002-02-25

    申请号：AU8543601

    申请日：2001-08-14

    Applicant: WORLD PROPERTIES INC

    Inventor： FITTS BRUCE B ,  LANDI VINCENT R ,  ROY SAROJ K

    IPC: C08J5/00 ,  H01B1/04 ,  H01B1/20 ,  H01B1/24 ,  H01M2/14 ,  H01M4/00 ,  H01M4/66 ,  H01M8/02

    Abstract: A conductive, moldable composite material for the manufacture of electrochemical cell components comprising a thermosetting resin system and conductive filler wherein the thermosetting resin composition comprises: (1) a polybutadiene or polyisoprene resin; (2) an optional functionalized liquid polybutadiene or polyisoprene resin; (3) an optional butadiene- or isoprene-containing copolymer; and (4) an optional low molecular weight polymer. In a preferred embodiment, the conductive moldable composite material is used to form a bipolar plate, current collector or other electrochemical cell component. Articles made of the conductive moldable composite material are resistant to chemical attack and hydrolysis, have excellent mechanical strength and toughness, have a volume resistivity of about 0.116 ohm-cm or less and preferably about 0.04 ohm-cm or less and a thermal conductivity of at least about 5 watts/meter ° K.

    10.
    发明专利
    未知

    公开(公告)号：DE112005000177T5

    公开(公告)日：2006-12-28

    申请号：DE112005000177

    申请日：2005-01-19

    Applicant: WORLD PROPERTIES INC

    Inventor： SETHUMADHAVAN MURALI ,  LANDI VINCENT R ,  BORGES LUIS D

    IPC: H05K1/03 ,  C08G77/04 ,  H05K3/46

    Abstract: An electrical circuit material having a conductive layer disposed a substrate, wherein the substrate comprises an organic or inorganic polymer comprising a covalently bound polyhedral silsesquioxane (POSS). The substrate may further comprise an additional dispersed POSS, any other fillers including fibrous webs. Use of covalently bound POSS allows for flame retardancy in compositions having acceptable dielectric constants and dissipation factors.

Patent Agency Ranking