公开(公告)号：AU4959501A

公开(公告)日：2001-10-15

申请号：AU4959501

申请日：2001-03-29

Applicant: WORLD PROPERTIES INC

Inventor： FITTS BRUCE B ,  HAVELES ELANA E ,  MANSO DAVID E ,  LANDI VINCENT R

IPC: C08L9/00 ,  C08L53/00 ,  H05B3/42 ,  H05B3/46 ,  H05B3/48 ,  H05B3/82 ,  H05K1/03 ,  H05B3/00

Abstract: Articles are formed from a thermosetting composition based on polybutadiene or polyisoprene resins which are subjected to a high temperature cure step of greater than 250° C. The thermosetting compositions may include fillers such as particulate ceramic fillers and may also include woven webs for improved dimensional stability and decreased brittleness. The formation process of this invention is particularly well suited for making electrical circuit substrates for microwave and digital circuits, typically in the form of the thermosetting composition being laminated on one or both opposed surfaces to metal conductive foil (e.g., copper). The compositions find particular utility for encapsulating and electrically insulating electrical resistance heating elements for use with fluids.

公开(公告)号：WO0176322A3

公开(公告)日：2002-01-31

申请号：PCT/US0110085

申请日：2001-03-29

Applicant: WORLD PROPERTIES INC

Inventor： FITTS BRUCE B ,  HAVELES ELANA E ,  MANSO DAVID E ,  LANDI VINCENT R

IPC: C08L9/00 ,  C08L53/00 ,  H05B3/42 ,  H05B3/46 ,  H05B3/48 ,  H05B3/82 ,  H05K1/03 ,  H05B3/14

CPC classification number: C08L9/00 ,  C08L53/00 ,  H05B3/42 ,  H05B3/46 ,  H05B3/48 ,  H05B3/82 ,  H05K1/032 ,  C08L2666/24 ,  C08L2666/04

Abstract: Articles are formed from a thermosetting composition based on polybutadiene or polyisoprene resins which are subjected to a high temperature cure step of greater than 250 DEG C. The thermosetting compositions may include fillers such as particulate ceramic fillers and may also include woven webs for improved dimensional stability and decreased brittleness. The formation process of this invention is particularly well suited for making electrical circuit substrates for microwave and digital circuits, typically in the form of the thermosetting composition being laminated on one or both opposed surfaces to metal conductive foil (e.g., copper). The compositions find particular utility for encapsulating and electrically insulating electrical resistance heating elements for use with fluids.

Abstract translation: 制品由基于聚丁二烯或聚异戊二烯树脂的热固性组合物形成，其经受高于250℃的高温固化步骤。热固性组合物可包括填料如颗粒陶瓷填料，还可包括用于改善尺寸稳定性的织造网 并降低脆性。 本发明的形成方法特别适用于制造用于微波和数字电路的电路基板，通常以热固性组合物的形式层压在金属导电箔（例如铜）的一个或两个相对的表面上。 该组合物特别用于封装和电绝缘用于流体的电阻加热元件。