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    MEMS TRANSDUCERS
    1.
    发明申请
    MEMS TRANSDUCERS 审中-公开
    MEMS传感器

    公开(公告)号：WO2009136196A2

    公开(公告)日：2009-11-12

    申请号：PCT/GB2009/050473

    申请日：2009-05-07

    Applicant: WOLFSON MICROELECTRONICS PLC ,  McMULLEN, Robert Errol ,  LAMING, Richard Ian ,  TRAYNOR, Anthony Bernard ,  HOEKSTRA, Tsjerk Hans

    Inventor： McMULLEN, Robert Errol ,  LAMING, Richard Ian ,  TRAYNOR, Anthony Bernard ,  HOEKSTRA, Tsjerk Hans

    IPC: B81B7/04

    CPC classification number: B06B1/0292

    Abstract: A MEMS device comprises a substrate having at least a first transducer optimized for transmitting pressure waves, and at least a second transducer optimized for detecting pressure waves. The transducers can be optimised for transmitting or receiving by varying the diameter, thickness or mass of the membrane and/or electrode of each respective transducer. Various embodiments are described showing arrays of transducers, with different configurations of transmitting and receiving transducers. Embodiments are also disclosed having an array of transmitting transducers and an array of receiving transducers, wherein elements in the array of transmitting and /or receiving transducers are arranged to have different resonant frequencies. At least one of said first and second transducers may comprise an internal cavity that is sealed from the outside of the transducer.

    Abstract translation: MEMS器件包括具有至少第一传感器的衬底，该第一传感器优化用于传送压力波，以及至少第二传感器，其优化用于检测压力波。 可以通过改变每个相应换能器的膜和/或电极的直径，厚度或质量来优化传感器的传播或接收。 描述了各种实施例，其示出了具有不同配置的发射和接收换能器的换能器阵列。 还公开了具有发射换能器阵列和接收换能器阵列的实施例，其中发射和/或接收换能器阵列中的元件布置成具有不同的谐振频率。 所述第一和第二换能器中的至少一个可以包括从换能器的外部密封的内部空腔。

    MEMS PROCESS AND DEVICE
    2.
    发明申请
    MEMS PROCESS AND DEVICE 审中-公开
    MEMS工艺和器件

    公开(公告)号：WO2007107736A2

    公开(公告)日：2007-09-27

    申请号：PCT/GB2007/000972

    申请日：2007-03-20

    Applicant: WOLFSON MICROELECTRONICS PLC ,  LAMING, Richard Ian ,  BEGBIE, Mark ,  TRAYNOR, Anthony

    Inventor： LAMING, Richard Ian ,  BEGBIE, Mark ,  TRAYNOR, Anthony

    IPC: B81C1/00

    CPC classification number: B81C1/00158 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81C99/004 ,  B81C2201/0109 ,  H04R7/10 ,  H04R7/18 ,  H04R19/005 ,  H04R2307/207 ,  Y10S977/733

    Abstract: A MEMS device, for example a capacitive microphone, comprises a flexible membrane 11 that is free to move in response to pressure differences generated by sound waves. A first electrode 13 is mechanically coupled to the flexible membrane 11 , and together form a first capacitive plate of the capacitive microphone device. A second electrode 23 is mechanically coupled to a generally rigid structural layer or back-plate 14, which together form a second capacitive plate of the capacitive microphone device. The capacitive microphone is formed on a substrate 1 , for example a silicon wafer. A back- volume 33 is provided below the membrane 11 , and is formed using a "back-etch" through the substrate 1. A first cavity 9 is located directly below the membrane 11 , and is formed using a first sacrificial layer during the fabrication process. Interposed between the first and second electrodes 13 and 23 is a second cavity 17, which is formed using a second sacrificial layer during the fabrication process. A plurality of bleed holes 15 connect the first cavity 9 and the second cavity 17. Acoustic holes 31 are arranged in the back-plate 14 so as to allow free movement of air molecules, such that the sound waves can enter the second cavity 17. The first and second cavities 9 and 17 in association with the back-volume 33 allow the membrane 11 to move in response to the sound waves entering via the acoustic holes 31 in the back-plate 14. The provision of first and second sacrifjciaj layers has the advantage of protecting the membrane during manufacture, and disassociating the back etch process from the definition of the membrane. The bleed holes 15 aid with the removal of the first and second sacrificial layers. The bleed holes 15 also contribute to the operating characteristics of the microphone.

    Abstract translation: MEMS器件，例如电容麦克风，包括响应于由声波产生的压力差而自由移动的柔性膜11。 第一电极13机械耦合到柔性膜11，并且一起形成电容式麦克风装置的第一电容板。 第二电极23机械地耦合到大致刚性的结构层或背板14，它们一起形成电容式麦克风装置的第二电容板。 电容麦克风形成在基板1上，例如硅晶片。 背部体积33设置在膜11的下方，并且通过基底1的“背蚀刻”形成。第一腔9位于膜11的正下方，并且在制造期间使用第一牺牲层形成 处理。 介于第一和第二电极13和23之间的是第二腔17，其在制造过程中使用第二牺牲层形成。 多个排放孔15连接第一腔9和第二腔17.声孔31布置在背板14中，以便允许空气分子的自由运动，使得声波可以进入第二腔17。 与背部体积33相关联的第一和第二腔9和17允许膜11响应于通过背板14中的声孔31进入的声波而移动。提供第一和第二牺牲层具有 在制造过程中保护膜的优点，以及使背蚀刻工艺与膜的定义分离。 排出孔15有助于去除第一和第二牺牲层。 排放孔15也有助于麦克风的操作特性。

    MEMS DEVICE
    5.
    发明公开
    MEMS DEVICE 有权
    MEMS器件

    公开(公告)号：EP1997347A1

    公开(公告)日：2008-12-03

    申请号：EP07732063.8

    申请日：2007-03-20

    Applicant: Wolfson Microelectronics plc

    Inventor： LAMING, Richard Ian ,  BEGBIE, Mark

    IPC: H04R19/00

    CPC classification number: B81C1/00158 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81C99/004 ,  B81C2201/0109 ,  H04R7/10 ,  H04R7/18 ,  H04R19/005 ,  H04R2307/207 ,  Y10S977/733

    Abstract: A micro-electrical-mechanical device comprises: a transducer arrangement having at least a membrane being mounted with respect to a substrate; and electrical interface means for relating electrical signals to movement of the membrane; in which the transducer arrangement comprises stress alleviating formations which at least partially decouple the membrane from expansion or contraction of the substrate.

    Abstract translation: 一种微机电装置包括：换能器装置，其具有至少一个相对于基板安装的膜片; 以及用于将电信号与膜的运动相关联的电接口装置; 其中换能器装置包括应力缓和结构，该应力缓解结构至少部分地将膜与基板的膨胀或收缩分离。

    METHOD FOR FABRICATING A MEMS MICROPHONE
    7.
    发明公开
    METHOD FOR FABRICATING A MEMS MICROPHONE 有权
    用于生产MEMS显微镜

    公开(公告)号：EP1996507A2

    公开(公告)日：2008-12-03

    申请号：EP07732064.6

    申请日：2007-03-20

    Applicant: Wolfson Microelectronics plc

    Inventor： LAMING, Richard Ian ,  BEGBIE, Mark ,  TRAYNOR, Anthony

    IPC: B81C1/00

    CPC classification number: B81C1/00158 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81C99/004 ,  B81C2201/0109 ,  H04R7/10 ,  H04R7/18 ,  H04R19/005 ,  H04R2307/207 ,  Y10S977/733

    Abstract: A MEMS device, for example a capacitive microphone, comprises a flexible membrane (11) that is free to move in response to pressure differences generated by sound waves. A first electrode (13) is mechanically coupled to the flexible membrane (11), and together form a first capacitive plate of the capacitive microphone device. A second electrode (23) is mechanically coupled to a generally rigid structural layer or back-plate (14), which together form a second capacitive plate of the capacitive microphone device. The capacitive microphone is formed on a substrate (1), for example a silicon wafer. A back- volume (33) is provided below the membrane (11), and is formed using a 'back-etch' through the substrate (1). A first cavity (9) is located directly below the membrane (11), and is formed using a first sacrificial layer during the fabrication process. Interposed between the first and second electrodes (13 and 23) is a second cavity (17), which is formed using a second sacrificial layer during the fabrication process. A plurality of bleed holes (15) connect the first cavity (9) and the second cavity (17). Acoustic holes (31) are arranged in the back-plate (14) so as to allow free movement of air molecules, such that the sound waves can enter the second cavity (17). The first and second cavities (9 and 17) in association with the back-volume (33) allow the membrane (11) to move in response to the sound waves entering via the acoustic holes (31) in the back-plate (14). The provision of first and second sacrifjciaj layers has the advantage of protecting the membrane during manufacture, and disassociating the back etch process from the definition of the membrane. The bleed holes (15) aid with the removal of the first and second sacrificial layers. The bleed holes (15) also contribute to the operating characteristics of the microphone.

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