Abstract:
A method and apparatus for forming a high resolution LED array. A plurality of LED chips are provided to form the LED array. Each LED chip has an electrode that is inward biased at each end of the chip by a predetermined amount. The size of each LED chip is removed by reducing, at each end of each chip, an amount of chip material substantially equal to the predetermined amount. The array is formed by placing each chip end to end with a gap between each chip, wherein the gap is suitably large for placement accuracies and a consistent pitch of 21.2 mu m is maintained between each LED on each chip.
Abstract:
A method and apparatus for forming a high resolution LED array. A plurality of LED chips are provided to form the LED array. Each LED chip has an electrode that is inward biased at each end of the chip by a predetermined amount. The size of each LED chip is removed by reducing, at each end of each chip, an amount of chip material substantially equal to the predetermined amount. The array is formed by placing each chip end to end with a gap between each chip, wherein the gap is suitably large for placement accuracies and a consistent pitch of 21.2 mu m is maintained between each LED on each chip.
Abstract:
A maintenance assembly (129) for cleaning a plurality of printheads (125,126) in a printing machine comprises two or more cleaning members (150), each of the cleaning members (150) sized and positioned to clean at least one but less than all of the plurality of printheads (125,126) when in a cleaning position. A drive mechanism (174) associated with each of the two or more cleaning members (150) is configured to selectively move an associated cleaning member to and from the cleaning position and a retracted position. The cleaning members (150) are supported on a frame with a mechanism (130) provided for translating the frame into position juxtaposed with the plurality of printheads and a further mechanism to swipe the cleaning members across the printheads. The maintenance assembly (129) is operable to clean only selected printheads in a single operation.
Abstract:
PROBLEM TO BE SOLVED: To provide a more accurate and simplified method of manufacturing a high-density inkjet printhead assembly including an external manifold.SOLUTION: The method comprises: dispensing a photosensitive interstitial layer 50 to fill spaces between adjacent piezoelectric elements 20 and to contact a diaphragm 36; removing a first portion of the photosensitive interstitial layer 50 in the spaces between adjacent piezoelectric elements 20 and leaving a second portion of the photosensitive interstitial layer 50 in the spaces between adjacent piezoelectric elements 20; and with the second portion of the photosensitive interstitial layer 50 in the spaces between adjacent piezoelectric elements 20, attaching the plurality of piezoelectric elements 20 to a plurality of electrodes 114 to provide an electrical pathway between each piezoelectric element 20 and the electrode 114 attached thereto.
Abstract:
PROBLEM TO BE SOLVED: To provide a high resolution LED array and its forming method. SOLUTION: An LED array is formed by providing a plurality of LED array chips 51 and 53. Each LED array chip 51, 53 is provided, at the opposite ends thereof, with electrodes 52 shifted inward by a specified amount. Size of each LED chip 51, 53 is reduced by removing the chip material, at the opposite ends thereof, by an amount substantially equal to the specified amount. The array is formed by arranging the chips 51 and 53 in series through a gap 58. COPYRIGHT: (C)2003,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a bonding method without delamination in an ink jet printhead configured by connecting two materials.SOLUTION: A method for assembling a printhead can include a step of using an ultrasonic bonding process to bond two or more printhead layers together. In an embodiment, an ultrasonic frequency is directed to an interface between a first layer and a second layer to generate heat at the interface. In an embodiment, the heat melts at least one of the first layer and the second layer, and the layers are cooled to cure the melted layer. In another embodiment, the heat generated using the ultrasonic frequency cures an adhesive layer between the first layer and the second layer.
Abstract:
PROBLEM TO BE SOLVED: To provide a method and a structure for forming an interstitial layer of an inkjet print head which has a dielectric interstitial layer to a uniform thickness.SOLUTION: A flexible upper plate 72 stuck to a press can be used to apply pressure to an uncured dielectric interstitial layer 50. The uncured dielectric interstitial layer 50 is brought into contact with the flexible upper plate 72 and is cured while holding the contact and while applying a pressure to the uncured dielectric interstitial layer 50 using the press 68. Use of not a hard upper plate, but the flexible upper plate 72 forms an interstitial layer which is more uniform or has a flat upper surface on the array of piezoelectric elements 20.
Abstract:
PROBLEM TO BE SOLVED: To provide methods for manufacturing a print head having electrical contacts which are easier to manufacture than prior structures, and the resulting print head.SOLUTION: The method for forming an inkjet print head can include attaching a plurality of piezoelectric elements 20 to a diaphragm 36, dispensing an interstitial layer 50 over the diaphragm, and forming a plurality of patterned conductive traces 80 on the interstitial layer to physically and electrically contact the plurality of piezoelectric elements. The plurality of patterned traces can be formed using, for example, photolithography, a lift-off process, laser ablation, etc. Electrical communication between the plurality of patterned conductive traces and the plurality of piezoelectric elements can be established through surface contact between the two structures, without the requirement of a separate conductor.
Abstract:
PROBLEM TO BE SOLVED: To provide a molded nozzle plate with alignment features for simplified assembly of an ink jet print head.SOLUTION: The ink jet print head includes a molded nozzle plate 370. The molded nozzle plate further includes a nozzle hole surface having two or more nozzle holes 330 in the nozzle plate, a sidewall 390 defining cavities surrounding the nozzle hole surface, and the molded die alignment features 380 in the cavities of the nozzle plate. The MEMS die is positioned in the cavities according to the molded die alignment features.
Abstract:
PROBLEM TO BE SOLVED: To provide a silicon based module having space-saving and high-definition properties and to provide a method of forming the module. SOLUTION: The silicon based module includes a substrate 106 on which chip assemblies 102, 104 are fixed. On the assembly 102, a silicon chip 108 and a driver die 110 having an electrical circuitry are installed, and the assembly 104 includes a silicon chip 112 and a driver die 114 having the electrical circuitry. Further, component parts corresponding to the assemblies 102, 104 are aligned each other along in a longitudinal direction L of the substrate, and also along in a width direction P of the substrate perpendicular to the longitudinal direction L. COPYRIGHT: (C)2011,JPO&INPIT