1.
    发明专利
    未知

    公开(公告)号:DE60319894D1

    公开(公告)日:2008-05-08

    申请号:DE60319894

    申请日:2003-01-10

    Applicant: XEROX CORP

    Abstract: A method and apparatus for forming a high resolution LED array. A plurality of LED chips are provided to form the LED array. Each LED chip has an electrode that is inward biased at each end of the chip by a predetermined amount. The size of each LED chip is removed by reducing, at each end of each chip, an amount of chip material substantially equal to the predetermined amount. The array is formed by placing each chip end to end with a gap between each chip, wherein the gap is suitably large for placement accuracies and a consistent pitch of 21.2 mu m is maintained between each LED on each chip.

    2.
    发明专利
    未知

    公开(公告)号:DE60319894T2

    公开(公告)日:2008-06-26

    申请号:DE60319894

    申请日:2003-01-10

    Applicant: XEROX CORP

    Abstract: A method and apparatus for forming a high resolution LED array. A plurality of LED chips are provided to form the LED array. Each LED chip has an electrode that is inward biased at each end of the chip by a predetermined amount. The size of each LED chip is removed by reducing, at each end of each chip, an amount of chip material substantially equal to the predetermined amount. The array is formed by placing each chip end to end with a gap between each chip, wherein the gap is suitably large for placement accuracies and a consistent pitch of 21.2 mu m is maintained between each LED on each chip.

    3.
    发明专利
    未知

    公开(公告)号:AT545507T

    公开(公告)日:2012-03-15

    申请号:AT10156821

    申请日:2010-03-18

    Applicant: XEROX CORP

    Abstract: A maintenance assembly (129) for cleaning a plurality of printheads (125,126) in a printing machine comprises two or more cleaning members (150), each of the cleaning members (150) sized and positioned to clean at least one but less than all of the plurality of printheads (125,126) when in a cleaning position. A drive mechanism (174) associated with each of the two or more cleaning members (150) is configured to selectively move an associated cleaning member to and from the cleaning position and a retracted position. The cleaning members (150) are supported on a frame with a mechanism (130) provided for translating the frame into position juxtaposed with the plurality of printheads and a further mechanism to swipe the cleaning members across the printheads. The maintenance assembly (129) is operable to clean only selected printheads in a single operation.

    Use of photoresist material as interstitial fill for pzt printhead fabrication
    4.
    发明专利
    Use of photoresist material as interstitial fill for pzt printhead fabrication 有权
    使用光电材料作为PZT PRINTHEAD制造的绝缘膜

    公开(公告)号:JP2012201114A

    公开(公告)日:2012-10-22

    申请号:JP2012045240

    申请日:2012-03-01

    Abstract: PROBLEM TO BE SOLVED: To provide a more accurate and simplified method of manufacturing a high-density inkjet printhead assembly including an external manifold.SOLUTION: The method comprises: dispensing a photosensitive interstitial layer 50 to fill spaces between adjacent piezoelectric elements 20 and to contact a diaphragm 36; removing a first portion of the photosensitive interstitial layer 50 in the spaces between adjacent piezoelectric elements 20 and leaving a second portion of the photosensitive interstitial layer 50 in the spaces between adjacent piezoelectric elements 20; and with the second portion of the photosensitive interstitial layer 50 in the spaces between adjacent piezoelectric elements 20, attaching the plurality of piezoelectric elements 20 to a plurality of electrodes 114 to provide an electrical pathway between each piezoelectric element 20 and the electrode 114 attached thereto.

    Abstract translation: 要解决的问题:提供一种更精确和简化的制造包括外部歧管的高密度喷墨打印头组件的方法。 解决方案:该方法包括:分配感光间隙层50以填充相邻压电元件20之间的空间并接触隔膜36; 去除相邻的压电元件20之间的空间中的光敏间隙层50的第一部分,并将光敏间隙层50的第二部分留在相邻的压电元件20之间的空间中; 并且在相邻压电元件20之间的空间中的感光间隙层50的第二部分,将多个压电元件20附接到多个电极114,以在每个压电元件20和附接到其之间的电极114之间提供电路径。 版权所有(C)2013,JPO&INPIT

    PRINT BAR, LED ARRAY FOR PRINT BAR AND ITS PRODUCING METHOD

    公开(公告)号:JP2003243697A

    公开(公告)日:2003-08-29

    申请号:JP2003004979

    申请日:2003-01-10

    Applicant: XEROX CORP

    Abstract: PROBLEM TO BE SOLVED: To provide a high resolution LED array and its forming method. SOLUTION: An LED array is formed by providing a plurality of LED array chips 51 and 53. Each LED array chip 51, 53 is provided, at the opposite ends thereof, with electrodes 52 shifted inward by a specified amount. Size of each LED chip 51, 53 is reduced by removing the chip material, at the opposite ends thereof, by an amount substantially equal to the specified amount. The array is formed by arranging the chips 51 and 53 in series through a gap 58. COPYRIGHT: (C)2003,JPO

    Ultrasonic laminating of materials for ink jet printheads
    6.
    发明专利
    Ultrasonic laminating of materials for ink jet printheads 有权
    喷墨打印机材料的超声波层压

    公开(公告)号:JP2013169795A

    公开(公告)日:2013-09-02

    申请号:JP2013016748

    申请日:2013-01-31

    Abstract: PROBLEM TO BE SOLVED: To provide a bonding method without delamination in an ink jet printhead configured by connecting two materials.SOLUTION: A method for assembling a printhead can include a step of using an ultrasonic bonding process to bond two or more printhead layers together. In an embodiment, an ultrasonic frequency is directed to an interface between a first layer and a second layer to generate heat at the interface. In an embodiment, the heat melts at least one of the first layer and the second layer, and the layers are cooled to cure the melted layer. In another embodiment, the heat generated using the ultrasonic frequency cures an adhesive layer between the first layer and the second layer.

    Abstract translation: 要解决的问题:提供在通过连接两种材料构成的喷墨打印头中不发生分层的粘合方法。解决方案:一种组装打印头的方法可以包括使用超声波接合工艺将两个或更多个打印头层粘合在一起的步骤。 在一个实施例中,超声波频率被引导到第一层和第二层之间的界面,以在界面处产生热量。 在一个实施例中,热量熔化第一层和第二层中的至少一层,并且将层冷却以固化熔融层。 在另一个实施例中,使用超声频率产生的热量固化在第一层和第二层之间的粘合剂层。

    Flattening method for interstitial polymer using flexible flat plate
    7.
    发明专利
    Flattening method for interstitial polymer using flexible flat plate 有权
    使用柔性平板的间隔聚合物的平滑方法

    公开(公告)号:JP2013001119A

    公开(公告)日:2013-01-07

    申请号:JP2012133324

    申请日:2012-06-12

    Abstract: PROBLEM TO BE SOLVED: To provide a method and a structure for forming an interstitial layer of an inkjet print head which has a dielectric interstitial layer to a uniform thickness.SOLUTION: A flexible upper plate 72 stuck to a press can be used to apply pressure to an uncured dielectric interstitial layer 50. The uncured dielectric interstitial layer 50 is brought into contact with the flexible upper plate 72 and is cured while holding the contact and while applying a pressure to the uncured dielectric interstitial layer 50 using the press 68. Use of not a hard upper plate, but the flexible upper plate 72 forms an interstitial layer which is more uniform or has a flat upper surface on the array of piezoelectric elements 20.

    Abstract translation: 要解决的问题:提供一种形成具有均匀厚度的电介质间隙层的喷墨打印头的间隙层的方法和结构。 粘贴在压机上的柔性上板72可以用于对未固化的介质间隙层50施加压力。将未固化的介质间隙层50与柔性上板72接触并固化,同时保持 接触并且同时使用压力机68向未固化的介质间隙层50施加压力。使用不是硬的上板,但是柔性上板72形成更均匀的间隙层或在阵列上具有平坦的上表面 压电元件20.版权所有(C)2013,JPO&INPIT

    High density multilayer interconnect for print head
    8.
    发明专利
    High density multilayer interconnect for print head 有权
    高密度多层印刷头连接

    公开(公告)号:JP2012196960A

    公开(公告)日:2012-10-18

    申请号:JP2012042539

    申请日:2012-02-28

    CPC classification number: B41J2/14233 B41J2/161

    Abstract: PROBLEM TO BE SOLVED: To provide methods for manufacturing a print head having electrical contacts which are easier to manufacture than prior structures, and the resulting print head.SOLUTION: The method for forming an inkjet print head can include attaching a plurality of piezoelectric elements 20 to a diaphragm 36, dispensing an interstitial layer 50 over the diaphragm, and forming a plurality of patterned conductive traces 80 on the interstitial layer to physically and electrically contact the plurality of piezoelectric elements. The plurality of patterned traces can be formed using, for example, photolithography, a lift-off process, laser ablation, etc. Electrical communication between the plurality of patterned conductive traces and the plurality of piezoelectric elements can be established through surface contact between the two structures, without the requirement of a separate conductor.

    Abstract translation: 要解决的问题:提供制造具有比现有结构更容易制造的电触头的打印头的方法以及所得到的打印头。 解决方案:用于形成喷墨打印头的方法可以包括将多个压电元件20附接到隔膜36,在隔膜上分配间隙层50,并且在间隙层上形成多个图案化导电迹线80到 物理和电接触多个压电元件。 可以使用例如光刻,剥离过程,激光烧蚀等形成多个图案化迹线。可以通过两个图案化导电迹线和两个压电元件之间的表面接触来建立多个图案化导电迹线与多个压电元件之间的电连接 结构,不需要单独的导体。 版权所有(C)2013,JPO&INPIT

    Molded nozzle plate with alignment features for simplified assembly
    9.
    发明专利
    Molded nozzle plate with alignment features for simplified assembly 有权
    具有对准功能的模制喷嘴板,用于简化组装

    公开(公告)号:JP2011245858A

    公开(公告)日:2011-12-08

    申请号:JP2011111715

    申请日:2011-05-18

    Abstract: PROBLEM TO BE SOLVED: To provide a molded nozzle plate with alignment features for simplified assembly of an ink jet print head.SOLUTION: The ink jet print head includes a molded nozzle plate 370. The molded nozzle plate further includes a nozzle hole surface having two or more nozzle holes 330 in the nozzle plate, a sidewall 390 defining cavities surrounding the nozzle hole surface, and the molded die alignment features 380 in the cavities of the nozzle plate. The MEMS die is positioned in the cavities according to the molded die alignment features.

    Abstract translation: 要解决的问题:为了提供具有用于简化喷墨打印头的组装的对准特征的模制喷嘴板。 喷墨打印头包括模制喷嘴板370.模制喷嘴板还包括喷嘴孔表面,喷嘴孔表面在喷嘴板中具有两个或更多个喷嘴孔330,侧壁390限定围绕喷嘴孔表面的空腔, 以及在喷嘴板的空腔中的模制模具对准特征380。 MEMS模具根据模制的模具对准特征定位在空腔中。 版权所有(C)2012,JPO&INPIT

    Silicon based module array and method of forming the same
    10.
    发明专利
    Silicon based module array and method of forming the same 审中-公开
    基于硅的模块阵列及其形成方法

    公开(公告)号:JP2011156864A

    公开(公告)日:2011-08-18

    申请号:JP2011005415

    申请日:2011-01-14

    Abstract: PROBLEM TO BE SOLVED: To provide a silicon based module having space-saving and high-definition properties and to provide a method of forming the module. SOLUTION: The silicon based module includes a substrate 106 on which chip assemblies 102, 104 are fixed. On the assembly 102, a silicon chip 108 and a driver die 110 having an electrical circuitry are installed, and the assembly 104 includes a silicon chip 112 and a driver die 114 having the electrical circuitry. Further, component parts corresponding to the assemblies 102, 104 are aligned each other along in a longitudinal direction L of the substrate, and also along in a width direction P of the substrate perpendicular to the longitudinal direction L. COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题:提供具有节省空间和高清晰度特性的硅基模块,并提供形成该模块的方法。 解决方案:硅基模块包括其上固定有芯片组件102,104的基板106。 在组件102上,安装具有电路的硅芯片108和驱动器芯片110,并且组件104包括硅芯片112和具有电路的驱动器芯片114。 此外,对应于组件102,104的部件沿着基板的纵向方向L彼此对准,并且还沿垂直于纵向方向L的基板的宽度方向P彼此对准。(C )2011,JPO&INPIT

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