PASSIVE SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR

    公开(公告)号:JP2001237497A

    公开(公告)日:2001-08-31

    申请号:JP2000396560

    申请日:2000-12-27

    Applicant: XEROX CORP

    Abstract: PROBLEM TO BE SOLVED: To solve the problem, where it is especially severe for a device where an oxide layer is embedded substantially deep under a wafer surface, such as a vertical cavity surface radiation laser, related to a conventional method, in which the embedded oxide layer is accessed by mesa-etch, a non-flatness level of the wafer is deteriorated to cause following complex processes, and further, a large amount of removed substance causes the mechanical integrity of the device and to decrease increases its heat resistance. SOLUTION: A passive semiconductor structure 400 comprises a base layer, plural semiconductor layers which are formed on the base layer and comprise at least one semiconductor layer comprising oxidizable substance, and at least one hole, which extends from a top layer and enters at least one semiconductor layer comprising oxidizable substance. Since the substance between cavities etched remains as is, excellent mechanical integrity and thermal conductivity are maintained.

    FABRY-PEROT CAVITY SPECTROPHOTOMETER AND ITS MANUFACTURING METHOD

    公开(公告)号:JP2001235369A

    公开(公告)日:2001-08-31

    申请号:JP2000379910

    申请日:2000-12-14

    Applicant: XEROX CORP

    Abstract: PROBLEM TO BE SOLVED: To provide a compact and economical spectrophotometer with a color detecting ability capable of being assembled in a color printer. SOLUTION: The Fabry-Perot spectrophotometer adjustable in a micro electronic mechanical manner is provided for color detection. The light input to a Fabry-Perot filter adjusted by a switched capacitor circuit is performed by optical fiber, and the spectral band intensity is detected by an integrated light detector.

    SEMICONDUCTOR STRUCTURE AND ITS MANUFACTURING METHOD

    公开(公告)号:JP2001251017A

    公开(公告)日:2001-09-14

    申请号:JP2000396575

    申请日:2000-12-27

    Applicant: XEROX CORP

    Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor structure which oxidizes a buried layer in a plane lateral direction in various applications of a semiconductor; and its manufacturing method. SOLUTION: Instead of forming a mesa which exposes a side wall of a layer to be oxidized, a buried layer 120 to be oxidized is accessed by use of a plurality of etched cavities 110. A profile and size of the obtained oxidized region are defined by a profile of each cavity and a mutual arrangement of the cavity. As an area between the cavities 110 is still a plane, subsequent steps, for example, a formation of an electric contact and a photolithograpy are facilitated.

    OPTOELECTRONIC INTEGRATED CIRCUIT AND ITS MANUFACTURING METHOD

    公开(公告)号:JP2001237410A

    公开(公告)日:2001-08-31

    申请号:JP2000396561

    申请日:2000-12-27

    Applicant: XEROX CORP

    Abstract: PROBLEM TO BE SOLVED: To solve the problem in that the normal method for accessing a buried oxide layer through mesa etching complicates the next process step because of the thereby elevated level of the non-planarity of a wafer. SOLUTION: The optoelectronic integrated circuit comprises a first semiconductor device having a topmost surface and bottom surface, a second semiconductor device having a first surface, and at least one hole which is located between the bottom surface of the first semiconductor device and the first surface of the second semiconductor device and extends from the topmost surface to an oxidizable layer to gain entry. The etched cavity method provides easy means for forming electrically isolated regions between the devices in the optoelectronic integrated circuit.

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