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公开(公告)号:BR0204887A
公开(公告)日:2004-06-15
申请号:BR0204887
申请日:2002-11-26
Applicant: XEROX CORP
Inventor: PERREGAUX ALAIN E , HOSIER PAUL A , JEDLICKA JOSEF E , SALATINO NICHOLAS J , TANDON JAGDISH C
IPC: B28D5/02 , H01L21/301 , H01L21/3065 , H01L21/304
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公开(公告)号:DE69820961D1
公开(公告)日:2004-02-12
申请号:DE69820961
申请日:1998-10-14
Applicant: XEROX CORP
Inventor: SEACHMAN NED J , TAILLIE JOSEPH P , CAROLAN KEVIN M , BALDWIN LEROY A , BRUTOVSKI ROBERT , PERREGAUX ALAIN E , HOWER JOHN D
Abstract: A method of electronically determining the location of an edge of a copy substrate (710) to be printed on places the copy substrate (710) between a segmented linear light source (700) and a linear sensor array (712) and a light segment of the linear light source (700) is illuminated. An edge location (Xco) of a shadow created by the copy substrate (710) intersecting the light path between the illuminated light segment and the linear sensor array (712) is measured, and the location of the edge of the copy substrate (710) is calculated based on the measured shadow location (Xco). A second light segment of the linear light source on an opposite side of an expected copy substrate edge position of the light source can also be illuminated, and a second edge location of a shadow created by the copy substrate (710) intersecting the light path be measured wherein this second measurement can be used with the first to calculate the location of the edge of the copy substrate (710). Alternatively, the calculated location can be used to determine a light segment of the linear light source which corresponds to the calculated location. This determined light source is illuminated and the shadow measured. The new measurement is used to calculate the edge of the copy substrate (710).
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公开(公告)号:DE3887232T2
公开(公告)日:1994-06-16
申请号:DE3887232
申请日:1988-08-26
Applicant: XEROX CORP
Inventor: JEDLICKA JOSEF E , PAGE KIMBERLY R , PERREGAUX ALAIN E , WILCZAK FRED F
IPC: B28D5/00 , B27G19/10 , F28D5/00 , H01L21/301 , H01L21/304 , H01L21/306 , H01L27/148
Abstract: A process for forming individual dies (5) having faces that allow the dies to be assembled against other like dies to form one and/or two dimensional scanning arrays wherein the active side of a wafer is etched to form small V-shaped grooves (34) defining the die faces, relatively wide grooves (40) are cut in the inactive side of the wafer opposite each V-shaped groove, and the wafer cut by sawing along the V-shaped grooves, the saw being located so that the side (62) of the saw blade (80) facing the die is aligned with the bottom of the V-shaped groove so that there is retained intact one side (35) of the V-shaped groove to intercept and prevent cracks and chipping caused by sawing from damaging the die active surface and any circuits thereon.
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公开(公告)号:DE3785563T2
公开(公告)日:1993-07-29
申请号:DE3785563
申请日:1987-12-02
Applicant: XEROX CORP
Inventor: DIR GARY A , PERREGAUX ALAIN E
IPC: B41J2/445 , B41J2/485 , G02F1/1335 , G02F1/13363 , G02F1/139 , G02F1/133
Abstract: A transient state liquid crystal image bar (12) having enhanced contrast with lower required driving voltage. The image bar is of the type having a nematic liquid crystal cell configured as a single array of dot shutters energizable by a single frequency voltage with crossed polarizer (14) and analyzer (15). The polarizing axis of the polarizer is at 45 degrees with the liquid crystal molecules (13) in their rest state. Thus, when all the image bar shutters are energized, it is in the non-transmission condition. For bursts of light to pass, the voltage to selected dot shutters is interrupted and reapplied. In one embodiment, the improvement is achieved by an optical compensator (28) or thin prism placed between the polarizer and the liquid crystal cell. In another embodiment, a quarter-wave plate is placed between the liquid crystal cell and the analyzer, with the analyzer being rotated about the image bar's optical axis a predetermined angle from its initial crossed position with respect to the polarizer, so that there is increased extinction of the light exiting from the liquid crystal cell, when the liquid crystal material is in its normally stable energized state.
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公开(公告)号:DE69816560D1
公开(公告)日:2003-08-28
申请号:DE69816560
申请日:1998-10-14
Applicant: XEROX CORP
Inventor: SEACHMAN NED J , TAILLIE JOSEPH P , CAROLAN KEVIN M , BALDWIN LEROY A , BRUTOVSKI ROBERT , PERREGAUX ALAIN E , HOWER JR
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公开(公告)号:DE3885114D1
公开(公告)日:1993-12-02
申请号:DE3885114
申请日:1988-01-20
Applicant: XEROX CORP
Inventor: STEPHANY JOSEPH F , LAKATOS ANDRAS I , HULL VIRGIL J , PERREGAUX ALAIN E
Abstract: A linear array of liquid crystal shutters (12) mounted near a photoreceptor surface (14) and arranged transversely to the direction of travel of the photoreceptor surface; an array of thin film transistors (122) connected to the array of liquid crystal shutters for electrically driving the shutters, and logic means (66) connected to the array of thin film transistors selectively pulsing the liquid crystal shutters to expose the photoreceptor surface selectively a line at a time. The system further includes means for producing an electric field between the opposed electrodes of each of the liquid crystal shutters to prevent passage of light through the shutters, and means for selectively de-energizing each of the pairs of electrodes for a predetermined period in response to the receipt of input data signals.
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公开(公告)号:CA2412370C
公开(公告)日:2009-10-06
申请号:CA2412370
申请日:2002-11-22
Applicant: XEROX CORP
Inventor: SALATINO NICHOLAS J , TANDON JAGDISH C , JEDLICKA JOSEF E , HOSIER PAUL A , PERREGAUX ALAIN E
IPC: H01L21/00 , B28D5/02 , H01L21/301 , H01L21/3065 , H01L21/64
Abstract: The present disclosure relates that by modifying chip die dicing methodology to a U-groove profile from a V-groove profile by modifying the second etch step to be a dry etch instead of a wet etch results in a direct cost savings by eliminating a more expensive process step, as well as the need for stripping the developed photoresist layer. Furthermore, going to a U-groove profile accomplishes additional indirect and greater cost savings resulting from increased process throughput, improved yield, an d reduced metal layer defects.
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公开(公告)号:DE69816560T2
公开(公告)日:2004-02-05
申请号:DE69816560
申请日:1998-10-14
Applicant: XEROX CORP
Inventor: SEACHMAN NED J , TAILLIE JOSEPH P , CAROLAN KEVIN M , BALDWIN LEROY A , BRUTOVSKI ROBERT , PERREGAUX ALAIN E , HOWER JR
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公开(公告)号:DE3885114T2
公开(公告)日:1994-05-11
申请号:DE3885114
申请日:1988-01-20
Applicant: XEROX CORP
Inventor: STEPHANY JOSEPH F , LAKATOS ANDRAS I , HULL VIRGIL J , PERREGAUX ALAIN E
Abstract: A linear array of liquid crystal shutters (12) mounted near a photoreceptor surface (14) and arranged transversely to the direction of travel of the photoreceptor surface; an array of thin film transistors (122) connected to the array of liquid crystal shutters for electrically driving the shutters, and logic means (66) connected to the array of thin film transistors selectively pulsing the liquid crystal shutters to expose the photoreceptor surface selectively a line at a time. The system further includes means for producing an electric field between the opposed electrodes of each of the liquid crystal shutters to prevent passage of light through the shutters, and means for selectively de-energizing each of the pairs of electrodes for a predetermined period in response to the receipt of input data signals.
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公开(公告)号:DE3887232D1
公开(公告)日:1994-03-03
申请号:DE3887232
申请日:1988-08-26
Applicant: XEROX CORP
Inventor: JEDLICKA JOSEF E , PAGE KIMBERLY R , PERREGAUX ALAIN E , WILCZAK FRED F
IPC: B28D5/00 , B27G19/10 , F28D5/00 , H01L21/301 , H01L21/304 , H01L21/306 , H01L27/148
Abstract: A process for forming individual dies (5) having faces that allow the dies to be assembled against other like dies to form one and/or two dimensional scanning arrays wherein the active side of a wafer is etched to form small V-shaped grooves (34) defining the die faces, relatively wide grooves (40) are cut in the inactive side of the wafer opposite each V-shaped groove, and the wafer cut by sawing along the V-shaped grooves, the saw being located so that the side (62) of the saw blade (80) facing the die is aligned with the bottom of the V-shaped groove so that there is retained intact one side (35) of the V-shaped groove to intercept and prevent cracks and chipping caused by sawing from damaging the die active surface and any circuits thereon.
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