公开(公告)号：CA2687424C

公开(公告)日：2013-09-24

申请号：CA2687424

申请日：2008-06-05

Applicant: XILINX INC

Inventor： ZHANG LEILEI

IPC: H01L23/485

Abstract: A contact pad in an integrated circuit is disclosed. The contact pad comprises a flat portion comprising a base (302) of the contact pad; a plurality of projections (304, 306, 308, 310, 312) extending from and substantially perpendicular to the flat portion; and a solder ball (108, 124) attached to the projections and the flat portion. A method of forming a contact pad is also disclosed.

公开(公告)号：CA2687424A1

公开(公告)日：2008-12-11

申请号：CA2687424

申请日：2008-06-05

Applicant: XILINX INC

Inventor： ZHANG LEILEI

IPC: H01L23/485

Abstract: A contact pad in an integrated circuit is disclosed. The contact pad comp rises a flat portion comprising a base (302) of the contact pad; a plurality of projections (304, 306, 308, 310, 312) extending from and substantially p erpendicular to the flat portion; and a solder ball (108, 124) attached to t he projections and the flat portion. A method of forming a contact pad is al so disclosed.

公开(公告)号：WO2010090662A3

公开(公告)日：2010-11-25

申请号：PCT/US2009062189

申请日：2009-10-27

Applicant: XILINX INC

Inventor： ZHANG LEILEI

IPC: H05K3/42

CPC classification number: H05K3/42 ,  H05K1/0366 ,  H05K3/0055 ,  H05K3/16 ,  H05K3/4076 ,  H05K2201/0769 ,  H05K2201/09581 ,  H05K2201/09827

Abstract: A through hole is formed in a circuit board (300) that has fibers (312) dispersed in a polymer matrix. Copper is sputtered within the through hole to form a sufficiently conductive layer for electrolytic plating (308) over the sputtered copper layer (306).

Abstract translation: 通孔形成在具有分散在聚合物基质中的纤维（312）的电路板（300）中。 在通孔内溅射铜以形成用于在溅射的铜层（306）上进行电解电镀（308）的充分导电层。

公开(公告)号：WO03039974A2

公开(公告)日：2003-05-15

申请号：PCT/US0236032

申请日：2002-11-07

Applicant: XILINX INC

Inventor： CHEE SOON-SHIN ,  ZHANG LEILEI

IPC: H01L25/10 ,  H05K1/14 ,  H05K3/28 ,  H05K3/34 ,  B65D

CPC classification number: H01L24/97 ,  H01L25/105 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/1626 ,  H05K1/141 ,  H05K3/284 ,  H05K3/3436 ,  H05K2201/10689 ,  H05K2201/10734 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00

Abstract: A multi-package module package includes a plurality of individually packaged chips. Yield is increased over conventional multi-chip packages because the individual chips can be inexpensively and fully tested before being placed into the multi-package module package. Also, the manufacturing process is simpler because the individual chips can be more easily handled while being tested and attached to the multi-package module package. Further, a standard component surface mount process is used for package assembly. Thus, no new capital investment or process development is needed.

Abstract translation: 多封装模块封装包括多个单独封装的芯片。 产量比传统的多芯片封装增加，因为单个芯片在放入多封装模块封装之前可以经济实惠并经过充分测试。 此外，制造过程更简单，因为在测试和附接到多封装模块封装件时，可以更容易地处理各个芯片。 此外，标准组件表面贴装工艺用于封装组装。 因此，不需要新的资本投资或过程开发。