公开(公告)号：EP4380888A1

公开(公告)日：2024-06-12

申请号：EP22758328.3

申请日：2022-07-29

Applicant: InvenSense, Inc.

Inventor： LEE, Daesung ,  CUTHBERTSON, Alan

IPC: B81B3/00

CPC classification number: B81B2201/023520130101 ,  B81B2201/024220130101 ,  B81C2203/011820130101 ,  B81B2207/0720130101 ,  B81B2207/09320130101 ,  B81C2203/010920130101 ,  B81C2201/11520130101 ,  B81C2203/03520130101 ,  B81B7/02 ,  B81C1/00269 ,  B81B7/0038

公开(公告)号：EP4375232A1

公开(公告)日：2024-05-29

申请号：EP22208689.4

申请日：2022-11-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Partanen, Mikko ,  Kilpinen, Petteri

IPC: B81B7/02 ,  B81C1/00

CPC classification number: B81B7/02 ,  B81B2201/023520130101 ,  B81B2201/024220130101 ,  B81C1/00269 ,  B81B2207/09520130101 ,  B81C2203/011820130101 ,  B81C2203/03120130101

Abstract: This disclosure describes a method for bonding microelectromechanical components with at least two different pressure element cavities. The result is achieved by forming on the cap wafer or/and on the structure wafer a metal layer which allows to hermetically seal one cavity at a first pressure, then hermetically sealing the other cavity at a second pressure.

公开(公告)号：EP4431448A1

公开(公告)日：2024-09-18

申请号：EP23192001.8

申请日：2023-08-17

Applicant: Kabushiki Kaisha Toshiba

Inventor： MASUNISHI, Kei ,  OGAWA, Etsuji ,  TOMIZAWA, Yasushi ,  MIYAZAKI, Fumito ,  ONO, Daiki ,  UCHIDA, Kengo ,  OGAWA, Jumpei ,  ISHIBASHI, Fumitaka ,  MURASE, Hideaki

IPC: B81B3/00 ,  G01P15/125

CPC classification number: B81B2201/023520130101 ,  B81B2203/05120130101 ,  B81B2203/0420130101 ,  B81B3/0037 ,  B81B2203/05620130101 ,  G01P15/097

Abstract: According to one embodiment, a sensor includes a first beam, a first opposing beam, a support portion, a first linking portion, and a first connecting portion. The first beam includes a first portion and a first other portion. A direction from the first portion to the first other portion is along a first direction. A second direction from the first opposing beam to the first beam crosses the first direction. The first opposing beam includes a first opposing portion and a first other opposing portion. The first linking portion is connected to the first other portion and the first other opposing portion. The first connecting portion is connected to the first linking portion. A first connecting portion width along the second direction of the first connecting portion is narrower than a first linking portion width along the second direction of the first linking portion.

公开(公告)号：EP4431447A1

公开(公告)日：2024-09-18

申请号：EP23189874.3

申请日：2023-08-04

Applicant: Kabushiki Kaisha Toshiba

Inventor： MASUNISHI, Kei ,  OGAWA, Etsuji ,  TOMIZAWA, Yasushi

IPC: B81B3/00 ,  G01P15/097

CPC classification number: B81B2201/023520130101 ,  B81B3/0094 ,  B81B2203/016320130101 ,  G01P15/097 ,  G01P2015/082820130101 ,  G01P15/125

Abstract: According to one embodiment, a sensor includes an element section. The element section includes a first beam, a first beam electrode, a second beam, and a second beam electrode. The first beam includes a first portion, a first other portion, and a first intermediate portion between the first portion and the first other portion. The first beam electrode is connected to the first intermediate portion. The second beam includes a second portion, a second other portion, and a second intermediate portion between the second portion and the second other portion. The second beam electrode is connected to the second intermediate portion. The first and the second beam electrodes satisfy at least one of first to eighth conditions.

公开(公告)号：EP3294664B1

公开(公告)日：2024-08-21

申请号：EP16725234.5

申请日：2016-05-09

IPC: B81B3/00

CPC classification number: B81B3/0094 ,  B81B2203/013620130101 ,  B81B2201/023520130101 ,  B81B2201/024220130101

公开(公告)号：EP3912953B1

公开(公告)日：2024-06-26

申请号：EP21174844.7

申请日：2021-05-19

IPC: B81B7/02

CPC classification number: B81B2201/023520130101 ,  B81B2201/024220130101 ,  B81B2201/027120130101 ,  B81C2201/017720130101 ,  B81C2203/011820130101 ,  B81B2203/05320130101 ,  B81C2201/010420130101 ,  B81B2203/030720130101 ,  B81B7/02

公开(公告)号：EP4361561A1

公开(公告)日：2024-05-01

申请号：EP22204378.8

申请日：2022-10-28

Applicant: Murata Manufacturing Co., Ltd.

Inventor： ENDO, Shigeru

IPC: G01C19/5783 ,  G01C21/16 ,  G01P1/02 ,  G01P15/18 ,  B81B7/00

CPC classification number: B81B2201/023520130101 ,  B81B2201/024220130101 ,  G01C19/5783 ,  G01P15/18 ,  G01C21/166 ,  G01P1/023 ,  B81B7/0074

Abstract: This disclosure describes an arrangement that allows the reduction of deformation induced by vibration movements in electronic devices such as Micro Inertial Measurement systems. The result is achieved by the use and particular arrangement of additional printed circuit boards.

公开(公告)号：EP3882640B1

公开(公告)日：2024-04-24

申请号：EP21162249.3

申请日：2021-03-12

IPC: G01P15/08 ,  G01P15/18 ,  B81B3/00 ,  G01C19/5733 ,  G01P15/125

CPC classification number: G01P15/0802 ,  G01P15/125 ,  G01P2015/087120130101 ,  G01P2015/081420130101 ,  B81B3/0051 ,  G01C19/5733 ,  G01P15/18 ,  G01P2015/087420130101 ,  B81B2201/023520130101 ,  B81B2203/05520130101 ,  B81B2203/05620130101 ,  B81B2203/016320130101

公开(公告)号：EP4154021B1

公开(公告)日：2024-05-22

申请号：EP21730764.4

申请日：2021-05-17

IPC: G01P21/00 ,  B81B7/00 ,  B81C99/00 ,  G01P15/125 ,  G01P15/08

CPC classification number: G01P21/00 ,  G01P15/125 ,  G01P2015/083120130101 ,  B81B2207/0320130101 ,  B81B2201/023520130101 ,  B81C99/0045

公开(公告)号：EP3839520B1

公开(公告)日：2024-05-01

申请号：EP20212118.2

申请日：2020-12-07

IPC: G01P15/125 ,  B81B3/00 ,  B81B5/00 ,  G01L1/14 ,  G01L5/00 ,  G01P15/08

CPC classification number: G01P15/125 ,  G01P2015/081420130101 ,  G01P2015/085120130101 ,  G01P2015/087120130101 ,  B81B3/007 ,  B81B2201/023520130101 ,  B81B2203/016320130101 ,  G01L5/0052