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公开(公告)号：EP3294664B1
公开(公告)日：2024-08-21
申请号：EP16725234.5
申请日：2016-05-09
IPC: B81B3/00
CPC classification number: B81B3/0094 , B81B2203/013620130101 , B81B2201/023520130101 , B81B2201/024220130101
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公开(公告)号：EP4113060B1
公开(公告)日：2024-07-24
申请号：EP22178868.0
申请日：2022-06-14
IPC: G01C19/5776
CPC classification number: G01C19/5776 , B81B7/008 , B81B2201/024220130101
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公开(公告)号：EP3912953B1
公开(公告)日：2024-06-26
申请号：EP21174844.7
申请日：2021-05-19
IPC: B81B7/02
CPC classification number: B81B2201/023520130101 , B81B2201/024220130101 , B81B2201/027120130101 , B81C2201/017720130101 , B81C2203/011820130101 , B81B2203/05320130101 , B81C2201/010420130101 , B81B2203/030720130101 , B81B7/02
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公开(公告)号：EP4361561A1
公开(公告)日：2024-05-01
申请号：EP22204378.8
申请日：2022-10-28
Applicant: Murata Manufacturing Co., Ltd.
Inventor： ENDO, Shigeru
IPC: G01C19/5783 , G01C21/16 , G01P1/02 , G01P15/18 , B81B7/00
CPC classification number: B81B2201/023520130101 , B81B2201/024220130101 , G01C19/5783 , G01P15/18 , G01C21/166 , G01P1/023 , B81B7/0074
Abstract: This disclosure describes an arrangement that allows the reduction of deformation induced by vibration movements in electronic devices such as Micro Inertial Measurement systems. The result is achieved by the use and particular arrangement of additional printed circuit boards.
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公开(公告)号：EP4380888A1
公开(公告)日：2024-06-12
申请号：EP22758328.3
申请日：2022-07-29
Applicant: InvenSense, Inc.
Inventor： LEE, Daesung , CUTHBERTSON, Alan
IPC: B81B3/00
CPC classification number: B81B2201/023520130101 , B81B2201/024220130101 , B81C2203/011820130101 , B81B2207/0720130101 , B81B2207/09320130101 , B81C2203/010920130101 , B81C2201/11520130101 , B81C2203/03520130101 , B81B7/02 , B81C1/00269 , B81B7/0038
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Patent Agency Ranking
公开(公告)号：EP4375232A1
公开(公告)日：2024-05-29
申请号：EP22208689.4
申请日：2022-11-22
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Partanen, Mikko , Kilpinen, Petteri
CPC classification number: B81B7/02 , B81B2201/023520130101 , B81B2201/024220130101 , B81C1/00269 , B81B2207/09520130101 , B81C2203/011820130101 , B81C2203/03120130101
Abstract: This disclosure describes a method for bonding microelectromechanical components with at least two different pressure element cavities. The result is achieved by forming on the cap wafer or/and on the structure wafer a metal layer which allows to hermetically seal one cavity at a first pressure, then hermetically sealing the other cavity at a second pressure.
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公开(公告)号：EP3597590B1
公开(公告)日：2024-09-18
申请号：EP19187276.1
申请日：2019-07-19
IPC: B81B7/00
CPC classification number: B81B7/0048 , B81B2201/023520130101 , B81B2201/024220130101 , B81B2203/016320130101 , B81B7/0058
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公开(公告)号：EP4144687B1
公开(公告)日：2024-07-03
申请号：EP22190201.8
申请日：2022-08-12
CPC classification number: B81C2201/011520130101 , B81B2201/023520130101 , B81B2201/024220130101 , B81B2201/026420130101 , B81C2201/017720130101 , B81B7/02 , B81C1/00158 , B81B2203/012720130101
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公开(公告)号：EP4385943A1
公开(公告)日：2024-06-19
申请号：EP22213103.9
申请日：2022-12-13
Applicant: Murata Manufacturing Co., Ltd.
Inventor： LIUKKU, Matti , LEHTINEN, Pekka
IPC: B81B3/00
CPC classification number: B81B2201/024220130101 , B81B3/001 , B81B2203/05820130101
Abstract: A microelectromechanical element comprising a motion-limiting structure which is configured to prevent a main rotor body from coming into direct physical contact with a stator across a vertical rotor-stator gap. The motion-limiting structure comprises a first stopper bump which is a protrusion on the stator which extends toward the rotor. The motion-limiting structure also comprises a second stopper bump, and the second stopper bump is a protrusion on the rotor which extends from the main rotor body toward the stator.
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公开(公告)号：EP4380889A1
公开(公告)日：2024-06-12
申请号：EP22761690.1
申请日：2022-07-29
Applicant: InvenSense, Inc.
Inventor： LEE, Daesung , CUTHBERTSON, Alan
CPC classification number: B81B2201/023520130101 , B81B2201/024220130101 , B81C2203/011820130101 , B81B2207/0720130101 , B81B2207/09320130101 , B81C2203/010920130101 , B81C2201/11520130101 , B81C2203/03520130101 , B81B7/02 , B81C1/00269 , B81B7/0038
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