公开(公告)号：WO2022032278A1

公开(公告)日：2022-02-10

申请号：PCT/US2021/071090

申请日：2021-08-03

Applicant: CSP TECHNOLOGIES, INC.

Inventor： FREEDMAN, Jonathan R. ,  SPANO, William Frederick ,  MYERS, Kasey

IPC: B29C48/02 ,  B05D1/26 ,  B29C48/08 ,  B29C48/154 ,  B29C48/155 ,  B29C48/21 ,  B29C48/255 ,  B29C48/25 ,  B29C48/86 ,  B29C70/88 ,  B05D1/265 ,  B05D7/04 ,  B29C48/022 ,  B29C48/2556 ,  B29C48/266 ,  B29C48/865 ,  B29K2103/08 ,  B29K2105/0097 ,  B29L2031/712

Abstract: Disclosed are methods for forming and adhering an entrained polymer structure to a substrate. The methods include providing a substrate configured to receive application of a molten entrained polymer. A 3A molecular sieve entrained polymer in molten form is applied in a predetermined shape, to a surface of the substrate, to form a solidified entrained polymer structure on the substrate. The entrained polymer includes a monolithic material formed of at least a base polymer and 3A molecular sieve. The surface of the substrate is compatible with the molten entrained polymer so as to thermally bond with it. In this way, the entrained polymer bonds to the substrate and solidifies upon sufficient cooling of the entrained polymer.

公开(公告)号：WO2021124081A1

公开(公告)日：2021-06-24

申请号：PCT/IB2020/061912

申请日：2020-12-14

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： NAPIERALA, Mark E. ,  BRADLEY, Joel J. ,  CHASTEK, Thomas Q. ,  DYSHAW, Nicholas G.

IPC: C09J7/30 ,  B05D1/26 ,  B29C48/05 ,  B29C48/92 ,  B05D1/265 ,  B05D5/10 ,  B29C2948/92571 ,  B29C2948/926 ,  B29C48/02 ,  B29C48/21 ,  B29C48/507 ,  B29C48/67 ,  B29C64/118 ,  B33Y10/00 ,  B33Y70/00

Abstract: Provided are methods and systems for dispensing filament adhesive onto a target substrate. A filament adhesive is applied on a target substrate according to a bead application plan, then the applied bead is checked against performance criteria. A second bead application plan is generated, and subsequent filament bead applied according to the second bead application plan.

公开(公告)号：WO2022003099A1

公开(公告)日：2022-01-06

申请号：PCT/EP2021/068162

申请日：2021-07-01

Applicant: DANAPAK FLEXIBLES A/S

Inventor： JOHANSEN, Peter ,  MØLLER, Rasmus Buch

IPC: B05D1/26 ,  B29C48/08 ,  B32B7/12 ,  B32B27/08 ,  B32B27/18 ,  B32B27/32 ,  B32B27/36 ,  B05D1/265 ,  B05D7/04 ,  B29C48/0016 ,  B29C48/154 ,  B29C48/21 ,  B29C48/92 ,  B32B2250/24 ,  B32B2264/02 ,  B32B2307/31 ,  B32B2307/702 ,  B32B2307/718 ,  B32B2307/732 ,  B32B2439/70 ,  B32B2439/80

Abstract: A heat-sealable packaging film, comprising a base film mainly comprising polyethylene terephthalate, the base film forming a layer of the packaging film; and a heat seal layer mainly comprising an IPA-modified copolyester; wherein the heat seal layer has been extrusion coated on the base film so that the heat seal layer material forms an exterior, amorphous, and heat- sealable heat seal layer.