公开(公告)号：WO2021227261A1

公开(公告)日：2021-11-18

申请号：PCT/CN2020/105732

申请日：2020-07-30

Applicant: 苏州希声科技有限公司

Inventor： 简小华

IPC: A61B8/00 ,  A61B8/4281 ,  B06B1/0648 ,  B06B2201/55 ,  B06B2201/76 ,  G01B11/18 ,  G01N29/04 ,  G01N29/2437 ,  G01N29/34 ,  G01S15/08

Abstract: 一种柔性超声探头(100)、超声成像检测系统及检测方法，探头(100)包括柔性换能器阵列(2)及两端分别与外界连通的外壳(1)，外壳(1)内具有一端开口的填充腔(4)，填充腔(4)的开口朝向外壳(1)的一端，柔性换能器阵列(2)连接在外壳(1)的一端且柔性换能器阵列(2)还与填充腔(4)的开口端密封设置，使得填充腔(4)形成用于填充流体填充剂的密封腔室，探头(100)还包括设置在外壳(1)内的用于检测柔性换能器阵列(2)的不同点的位置的形变探测装置(5)。这一柔性超声探头(100)通过设置填充腔(4)，并在填充腔(4)内填充流体填充剂，能够使得柔性换能器阵列(2)实现不同曲率被检测目标检测成像，并通过内置形变探测装置(5)，可实现对各阵元曲率的实时检测和反馈，提高成像检测的灵活性和自动化。

公开(公告)号：WO2022272217A1

公开(公告)日：2022-12-29

申请号：PCT/US2022/072918

申请日：2022-06-14

Applicant: BOSTON SCIENTIFIC SCIMED, INC.

Inventor： GRAVELEY, Andrew ,  BACKMAN, Lawrence

IPC: B06B1/06 ,  A61B8/08 ,  A61B8/00 ,  G01S7/52 ,  G06F3/043 ,  A61B8/0883 ,  A61B8/12 ,  A61B8/4281 ,  A61B8/445 ,  A61B8/4483 ,  A61B8/4488 ,  B06B1/0215 ,  B06B1/0292 ,  B06B1/0633 ,  B06B1/0677 ,  B06B2201/76 ,  G01S15/8922 ,  G01S7/52079

Abstract: A transducer device may include an active layer having a proximal surface and a backing layer having a distal side and a proximal side, the distal side being adjacent to the proximal surface. The proximal side may include (1) at least one first reflective surface approximately parallel to the proximal surface and positioned a first distance from the proximal surface, and (2) at least one second reflective surface approximately parallel to the proximal surface and positioned a second distance from the proximal surface, the second distance being different than the first distance.

公开(公告)号：WO2021113107A2

公开(公告)日：2021-06-10

申请号：PCT/US2020/061819

申请日：2020-11-23

Applicant: GE PRECISION HEALTHCARE LLC

Inventor： DACRUZ, Edouard ,  DALOZ, Flavien ,  BARRETT, Jason

IPC: G01H11/08 ,  B06B1/06 ,  A61B8/4488 ,  B06B1/0269 ,  B06B1/0622 ,  B06B2201/76 ,  H01L41/09 ,  H01L41/25

Abstract: Various methods and systems are provided for a multi-frequency transducer array. In one example, the transducer array includes an element formed of one or more sub- elements, at least one sub-element having a different resonance frequency. A frequency range of the transducer array may thereby be broadened.

公开(公告)号：WO2023076915A2

公开(公告)日：2023-05-04

申请号：PCT/US2022/078676

申请日：2022-10-26

Applicant: CURATIVE SOUND, LLC

Inventor： MCATEER, Jeffrey, Phillip ,  BARBER, Geoffry, N. ,  OLSON, James, V. ,  WOOD, Randal, Douglas ,  WELSH, Samuel, C. ,  BARR, Joshua, James

IPC: A61B17/22 ,  A61B17/00 ,  A61B17/225 ,  A61B2017/0003 ,  A61B2017/00464 ,  A61B2017/00734 ,  A61H2201/0153 ,  A61H2201/1207 ,  A61H2201/5005 ,  A61H2201/5046 ,  A61H23/008 ,  B06B1/0215 ,  B06B1/0607 ,  B06B1/0622 ,  B06B2201/76 ,  H03K19/177

Abstract: A focused extracorporeal shock wave therapy (f-ESWT) device includes a handheld housing, a battery, and a transducer assembly. The battery is located in the handheld housing. The transducer assembly is located in the handheld housing and is operably connected to the battery. The transducer assembly is configured to generate a focused shock wave using electrical energy from the battery.

公开(公告)号：WO2021113145A8

公开(公告)日：2021-06-10

申请号：PCT/US2020/062303

申请日：2020-11-25

Applicant: GE PRECISION HEALTHCARE LLC

Inventor： DACRUZ, Edouard ,  DALOZ, Flavien ,  BARRETT, Jason

IPC: B06B1/06 ,  A61B8/4488 ,  A61B8/4494 ,  B06B1/0269 ,  B06B1/0607 ,  B06B1/0614 ,  B06B1/0622 ,  B06B2201/76 ,  H01L41/09 ,  H01L41/25

Abstract: Various methods and systems are provided for a multi-frequency transducer array. In one example, the transducer array is fabricated by forming an interdigitated structure from a first comb structure with a first sub-element and a second comb structure with a second sub-element. The interdigitated structure is coupled to a base package, a matching layer, and a backing layer to form a plurality of multi-frequency transducers.

公开(公告)号：WO2021126992A1

公开(公告)日：2021-06-24

申请号：PCT/US2020/065330

申请日：2020-12-16

Applicant: BUTTERFLY NETWORK, INC.

Inventor： CHEN, Kailiang ,  SANCHEZ, Nevada J. ,  LIU, Jianwei

IPC: G01S7/52 ,  A61B8/4494 ,  B06B1/0215 ,  B06B2201/76 ,  H01L25/16 ,  H01L27/20 ,  H01L41/042 ,  H01L41/0475 ,  H01L41/25 ,  H01L41/29

Abstract: Aspects of the technology described herein related to an ultrasound device including a first integrated circuit substrate having first integrated ultrasound circuitry and a second integrated circuit substrate having second integrated ultrasound circuitry. The first and second integrated circuit substrates are arranged in a vertical stack. A first conductive pillar is electrically coupled, through a first redistribution layer, to the first integrated circuit substrate, and a second conductive pillar is electrically coupled, through the first and second redistribution layers, to the second integrated circuit substrate.

公开(公告)号：WO2021113145A2

公开(公告)日：2021-06-10

申请号：PCT/US2020/062303

申请日：2020-11-25

Applicant: GE PRECISION HEALTHCARE LLC

Inventor： DACRUZ, Edouard ,  DALOZ, Flavien ,  BARRETT, Jason

IPC: B06B1/06 ,  A61B8/4488 ,  A61B8/4494 ,  B06B1/0269 ,  B06B1/0614 ,  B06B1/0622 ,  B06B2201/76 ,  G06N3/02 ,  H01L27/18 ,  H01L41/08 ,  H01L41/09 ,  H01L41/25 ,  H01L41/338

Abstract: Various methods and systems are provided for a multi-frequency transducer array. In one example, the transducer array is fabricated by forming an interdigitated structure from a first comb structure with a first sub-element and a second comb structure with a second sub-element. The interdigitated structure is coupled to a base package, a matching layer, and a backing layer to form a plurality of multi-frequency transducers.

公开(公告)号：WO2021113123A2

公开(公告)日：2021-06-10

申请号：PCT/US2020/062006

申请日：2020-11-24

Applicant: GE PRECISION HEALTHCARE LLC

Inventor： DACRUZ, Edouard ,  DALOZ, Flavien ,  BARRETT, Jason

IPC: B06B1/06 ,  H01L41/083 ,  A61B8/4488 ,  B06B1/0269 ,  B06B1/0611 ,  B06B2201/76 ,  H01L41/09

Abstract: Various methods and systems are provided for a multi-frequency transducer array. In one example, ground recovery in the transducer array is enabled by configuring an acoustic stack of the transducer array with an interdigitated structure, a top layer coupled to a front side of the interdigitated structure, and a bottom layer coupled to a back side of the interdigitated structure, where the top layer and the bottom is electrically continuous with the interdigitated structure.