EJE MOTORIZADO CON DISPOSITIVO DE INDEXACION.

    公开(公告)号:MX9804422A

    公开(公告)日:1998-12-31

    申请号:MX9804422

    申请日:1998-06-03

    Abstract: El eje, que comprende un cuerpo de eje y un dispositivo de indexacion, se configura para retener y accionar giratoriamente un cigüeñal relativo a una herramienta esmeriladora, de manera que cada perno sobre el cigüeñal es esmerilado con un alto grado de precision. Un mecanismo de acoplamiento, tal como un par de mordazas con dientes configurados de manera complementaria, esta interpuesto entre el cuerpo de eje y el dispositivo de indexacion. Se aplica la presion a un lado del mecanismo de acoplamiento, de manera que las mordazas se acoplan normalmente y el cuerpo de eje y el dispositivo de indexacion giran como una unidad. La energía motriz es suministrada por un servomotor asegurado a una flecha motriz primaria, la cual se une a una flecha motriz secundaria, a través de un acoplamiento acodado para definir el eje motorizado.

    ENSAMBLE DE CUBO RASPADOR DE LLANTAS DE CUCHILLAS Y SEPARADORES DOBLADOS.

    公开(公告)号:MX9406355A

    公开(公告)日:1997-10-31

    申请号:MX9406355

    申请日:1994-08-19

    Abstract: Se describe un ensamble de cubo raspador para usarse en una máquina pulidora de llantas. El montaje de cubo incluye dos placas terminales, y un conjunto de cuchillas raspadoras de llanta y separadores colocados en filas en circunferencia alternativas. Las cuchillas y los separadores tienen cuerpos con forma alargada, no planos, con las cuchillas anidadas en los separadores adyacentes. El ensamble de cubo raspador resultante permite el uso de un numero par o impar de cuchillas raspadoras en cada fila, y proporciona varios beneficios más descritos en la especificacion.

    BURNISH HEAD FOR MAGNETIC MEDIA
    5.
    发明申请
    BURNISH HEAD FOR MAGNETIC MEDIA 审中-公开
    磁性媒体用头灯

    公开(公告)号:WO1997022441A1

    公开(公告)日:1997-06-26

    申请号:PCT/US1996019788

    申请日:1996-12-16

    Applicant: PHASE METRICS

    CPC classification number: G11B5/84 B24B39/00

    Abstract: A burnish head comprising a slider body (10) having a single crystal diamond (18) attached to a rear portion (19) flies above the disk surface at a relatively low flying height when the disk is rotated at a high angular velocity. The diamond (18) produces acoustic waves that cut or crack disk asperities (24), resulting in a highly-smooth disk surface suitable for near-contact or in-contact magnetic recording.

    Abstract translation: 包括具有附接到后部(19)的单晶金刚石(18)的滑块体(10)的抛光头在盘以高角速度旋转时以相对低的飞行高度飞过盘表面上方。 金刚石(18)产生剪切或破裂圆盘粗糙度(24)的声波,导致适合于近接触或接触磁记录的高度光滑的盘表面。

    RENEWABLE POLISHING LAP
    6.
    发明申请
    RENEWABLE POLISHING LAP 审中-公开
    可再生抛光

    公开(公告)号:WO1997002924A1

    公开(公告)日:1997-01-30

    申请号:PCT/US1996011356

    申请日:1996-07-02

    CPC classification number: B24B37/26

    Abstract: A polishing lap as shown in Figure (5) which is resistant to attack from corrosive and reactive polishing media and which has a surface which is sufficiently resilient to provide good finishes without hindering dimensional controlling and accuracy of the texturing comprises: a lap substrate (1) wherein the surface of the lap substrate (1) has an overall shape and a localized texture; and a replaceable lap film (5) applied to the lap substrate (1) surface and which is deformed to correspond to the localized texture of the lap substrate surface. The polishing lap can be easily reconditioned if contaminated or easily modified for use with different abrasives and polishing media.

    Abstract translation: 如图(5)所示的抛光片,其耐腐蚀性和反应性抛光介质的侵蚀,并且具有足够的弹性以提供良好的表面而不妨碍尺寸控制和纹理的精确度的表面包括:搭接衬底(1) ),其中所述搭接基板(1)的表面具有整体形状和局部纹理; 以及施加到搭接基板(1)表面上的可更换的搭接膜(5),并且其变形以对应于搭接基板表面的局部纹理。 如果污染或易于修改以便与不同的研磨剂和抛光介质一起使用,则可以容易地修复抛光圈。

    A BRUSHLESS SPINDLE MOTOR FOR A GRINDING MACHINE INCLUDING HYDROSTATIC BEARINGS
    7.
    发明申请
    A BRUSHLESS SPINDLE MOTOR FOR A GRINDING MACHINE INCLUDING HYDROSTATIC BEARINGS 审中-公开
    一种用于磨床的无刷电动马达,包括静液压轴承

    公开(公告)号:WO1995003917A1

    公开(公告)日:1995-02-09

    申请号:PCT/US1994008478

    申请日:1994-07-29

    CPC classification number: H02K5/1672 B23Q1/70 B24B41/04 H02K9/19

    Abstract: A grinding machine provided with a spindle (5) rotating under the influence of a cantilever mounted rare earth permanent magnet motor (40). Hydrostatic fluid film bearings (41, 42) are provided between the ends of the spindle (5) and a bronze bearing (64, 65) to support spindle (5) in such a manner so as to eliminate wear. A single oil reservoir (20) is used to supply oil to the hydrostatic bearings (41, 42), as well as to the cooling jacket labyrinth (17) of the motor (40).

    Abstract translation: 一种磨床,其设置有在悬臂式稀土永磁电动机(40)的影响下旋转的主轴(5)。 在主轴(5)的端部和青铜轴承(64,65)之间设置静水流体膜轴承(41,42),以支撑主轴(5),以便消除磨损。 单个储油器(20)用于向静压轴承(41,42)以及电动机(40)的冷却套迷宫(17)供应油。

    POLISHING APPARATUS WITH INDEXING WAFER PROCESSING STATIONS
    8.
    发明申请
    POLISHING APPARATUS WITH INDEXING WAFER PROCESSING STATIONS 审中-公开
    抛光设备与索引加工站

    公开(公告)号:WO1996017711A1

    公开(公告)日:1996-06-13

    申请号:PCT/US1995015732

    申请日:1995-12-05

    CPC classification number: B24B37/107 B24B27/0023 B24B37/345

    Abstract: Apparatus for polishing the side of a thin, flat wafer (100) of a semiconductor material includes first (11) and second (31) polishing heads which each hold a wafer against a wetted polishing surface (12) and which each rotate and oscillate its respective wafer over the polishing surface. When the first polishing head (11) is moved away from the polishing surface (12) to clean, eject, and replace its wafer, the second polishing head (31) occupies a space over the polishing surface normally occupied by the first polishing head (11) so that the polishing surface (12) is used substantially continuously, and not intermittently.

    Abstract translation: 用于抛光半导体材料的薄的平坦晶片(100)的侧面的装置包括第一(11)和第二(31)个抛光头,每个抛光头将晶片保持在润湿的抛光表面(12)上,并且每个抛光头旋转并振荡其 相应的晶片在抛光表面上。 当第一抛光头(11)远离抛光表面(12)移动以清洁,喷射和更换其晶片时,第二抛光头(31)占据由第一抛光头(通常被占据)抛光表面的空间 11),使得抛光表面(12)基本连续地使用,而不是间歇地使用。

    ULTRA-PRECISION LAPPING APPARATUS
    9.
    发明申请
    ULTRA-PRECISION LAPPING APPARATUS 审中-公开
    超精密拉丝装置

    公开(公告)号:WO1995000291A1

    公开(公告)日:1995-01-05

    申请号:PCT/US1994006881

    申请日:1994-06-16

    CPC classification number: B24B37/105

    Abstract: Mechanism for spinning and translating workpieces (11 etc.) in lapping relation with a lapping member (114, 115) with mid-width portion (114) formed to abrade at same or lesser rate than inner and outer portions (115). One embodiment includes a plurality of wafers arranged in a ring in holder mounting (121), a holder axis centered (345) on rectilinear lapping member (fig. 7 & 8), a lapping surface formed to a uniform width not greater than the diameter of the mean circular trajectory of the centroids (361) of the rotating wafers. Another embodiment includes ring-shaped disk lapping member (314, 315), lapping surface width (C) that approximates the diameter of the centroid trajectory of the wafers (361), holder axis offset radially outwardly away from the axis of the lapping disk, for a dimension inversely proportional to the radius of the disk (D). Both embodiments include means for supporting overhanging portions of wafers.

    Abstract translation: 用于与与中间宽度部分(114)的研磨构件(114,115)的研磨关系旋转和平移的机构(11等)以与内部和外部部分(115)相同或更小的速率形成。 一个实施例包括在保持器安装件(121)中布置成环的多个晶片,在直线研磨构件(图7和8)上居中定位的保持器轴线(345),研磨表面形成为不大于直径的均匀宽度 的旋转晶片的重心(361)的平均圆形轨迹。 另一个实施例包括环形盘研磨构件(314,315),接近晶片(361)的重心轨迹的直径的研磨表面宽度(C),保持器轴线偏离研磨盘的轴线径向向外偏移, 其尺寸与盘的半径成反比(D)。 两个实施例包括用于支撑晶片的悬垂部分的装置。

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