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    SYSTEMS AND METHODS FOR COOLING A COMPUTING SYSTEM
    1.
    发明申请
    SYSTEMS AND METHODS FOR COOLING A COMPUTING SYSTEM 审中-公开

    公开(公告)号：WO2021145950A1

    公开(公告)日：2021-07-22

    申请号：PCT/US2020/061144

    申请日：2020-11-19

    Applicant: MICROSOFT TECHNOLOGY LICENSING, LLC

    Inventor： ALISSA, Husam A. ,  PETERSON, Eric Clarence

    IPC: G06F1/20 ,  F25D3/10 ,  G06F2200/201 ,  H05K7/20172 ,  H05K7/20309 ,  H05K7/20327 ,  H05K7/20372

    Abstract: A computing system includes a housing, processing circuitry, one or more additional components, and a cryogen evaporator plate. The housing includes a cryogen input port, a cryogen output port, and an interior chamber. The processing circuitry and the one or more additional components are in the interior chamber of the housing. The cryogen evaporator plate is thermally coupled to the processing circuitry and configured to receive a cryogen via the cryogen input port, cool the processing circuitry using the cryogen such that the cryogen is evaporated during the cooling of the processing circuitry to provide evaporated cryogen, and provide the evaporated cryogen into the interior chamber of the housing such that the evaporated cryogen is distributed over the one or more additional components to cool the one or more additional components.

    LIQUID PUMPING UNITS, AND RELATED SYSTEMS AND METHODS
    3.
    发明申请
    LIQUID PUMPING UNITS, AND RELATED SYSTEMS AND METHODS 审中-公开

    公开(公告)号：WO2021229365A1

    公开(公告)日：2021-11-18

    申请号：PCT/IB2021/053760

    申请日：2021-05-04

    Applicant: COOLIT SYSTEMS, INC.

    Inventor： VARELA BENITEZ, Sebastian ,  TRIEU, Dennis ,  GIERL, Brydon ,  MOSTAFAVI, Kamal ,  TURNER, Cameron

    IPC: F04D13/00 ,  F04D13/12 ,  F16L37/00 ,  F28F9/26 ,  G06F1/20 ,  H05K7/20 ,  G06F1/206 ,  G06F2200/201 ,  H05K7/20272 ,  H05K7/20772 ,  H05K7/20781

    Abstract: A pump tray has a liquid pump with an inlet and outlet. A blindly matable liquid coupler fluidicly couples with the pump inlet and a blindly matable liquid coupler fluidicly couples with the pump outlet. A chassis of the pump tray has an alignment member configured to removably engage with another device and to restrict, to a limited number of degrees-of-freedom, movement of the chassis relative to the other device (e.g., a liquid pumping unit). The blindly matable liquid couplers are so physically coupled with the chassis as to inhibit movement of them relative to the chassis. A liquid pumping unit also has a chassis defining a bay configured to receive a pump tray, a liquid inlet coupler and a liquid outlet coupler, and a reservoir fluidicly coupled with the liquid inlet coupler. A blindly-matable liquid coupler fluidicly couples with the reservoir outlet and a blindly-matable liquid coupler fluidicly couples with the liquid outlet coupler. An alignment member is configured to removably engage with the pump tray and to restrict, to a limited number of degrees-of-freedom, movement of the pump tray relative to the chassis of the liquid pumping unit.

    COOLING MODULE
    4.
    发明申请
    COOLING MODULE 审中-公开

    公开(公告)号：WO2021130504A1

    公开(公告)日：2021-07-01

    申请号：PCT/GB2020/053372

    申请日：2020-12-24

    Applicant: ICEOTOPE GROUP LIMITED

    Inventor： EDMUNDS, Neil ,  CHARLESWORTH, John

    IPC: H05K7/20 ,  G06F1/20 ,  G06F1/203 ,  G06F1/206 ,  G06F2200/201 ,  H05K7/20236 ,  H05K7/20772

    Abstract: A cooling module for a printed circuit board having one or more heat generating components. The cooling module comprises a casing defining a first internal volume adapted for mounting a printed circuit board therein, the casing comprising a first internal major surface and a second internal major surface. The cooling module further comprises a chamber defining a second internal volume in fluid communication with the first internal volume. The first and/or second internal major surface comprises a first cavity. The first and/or second internal major surface further comprises a first channel connecting the first cavity to the second internal volume.

    HYBRID MOTHERBOARD COOLING SYSTEM FOR AIR-COOLED SERVERS
    7.
    发明申请
    HYBRID MOTHERBOARD COOLING SYSTEM FOR AIR-COOLED SERVERS 审中-公开

    公开(公告)号：WO2023278040A1

    公开(公告)日：2023-01-05

    申请号：PCT/US2022/029940

    申请日：2022-05-19

    Applicant: MICROSOFT TECHNOLOGY LICENSING, LLC

    Inventor： NAGIMOV, Ruslan ,  PETERSON, Eric Clarence ,  SAUNDERS, Winston Allen

    IPC: H05K7/20 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/202 ,  H05K7/203 ,  H05K7/20318 ,  H05K7/20327 ,  H05K7/20727 ,  H05K7/20809

    Abstract: A motherboard assembly comprises a motherboard, a first computing component attached to the motherboard, and a coolant container attached to the motherboard. An air-cooled heat sink is attached to the coolant container. The coolant container, the heat sink, and the motherboard form a hermetically sealed enclosure that encompasses the first computing component and that is configured to retain dielectric working fluid covering the first computing component. The heat sink is positioned to condense vapors formed from boiling of the dielectric working fluid and to cause condensed dielectric working fluid to return to a pool of the dielectric working fluid that comprises the first computing component. The motherboard assembly additionally comprises a second computing component attached to the motherboard and positioned outside of the hermetically sealed enclosure.

    一种组合物、液冷剂及其应用以及浸没冷却系统
    8.
    发明申请
    一种组合物、液冷剂及其应用以及浸没冷却系统 审中-公开

    公开(公告)号：WO2022267932A1

    公开(公告)日：2022-12-29

    申请号：PCT/CN2022/098632

    申请日：2022-06-14

    Applicant: 浙江巨化技术中心有限公司

    Inventor： 周黎旸 ,  王树华 ,  张广欣 ,  汪星平 ,  李昊 ,  雷志刚 ,  姜文军

    IPC: C09K5/10 ,  G06F1/20 ,  H05K7/20 ,  G06F2200/201 ,  H05K7/20763

    Abstract: 本发明公开了一种组合物、液冷剂及其应用以及浸没冷却系统，涉及液态冷却介质技术领域。其中组合物为结构通式为A-(RCFO)n-(CF2O)m-(CF2)z-B的全氟聚醚化合物，或者其与结构通式为HO-CH2-(CF2)q-(RCFO)n-(CF2O)m-(CF2)z-CH2OH的全氟聚醚双醇的组合，(RCFO)和(CF2O)基团随机分布；A为–F，–CF3，CF3CF2–，CF3–O–或CF3CF2–O–基团；B为–CF3或–CF2CF3基团；R CF为–CF2CF2–，–CF2CF2CF2–或–CF(CF3)CF2–基团；z为0-2之间的整数；n和m均为大于0的整数，n+m＝2-30，n/m＝1-30；q为大于0的整数。本发明解决了现有液冷剂组分与电子设备材料的兼容性较差的问题，本发明的液冷剂具有良好的流动性及极佳的散热功能，提高了液冷剂组分与电子设备材料的兼容性，保护电子设备不被破坏。

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