公开(公告)号：WO2021251775A1

公开(公告)日：2021-12-16

申请号：PCT/KR2021/007293

申请日：2021-06-10

Applicant: 삼성전자 주식회사

Inventor： 이승준 ,  안성호 ,  김영성 ,  홍성민 ,  강주영 ,  김양욱 ,  박경태 ,  홍현주

IPC: G06F1/16 ,  G09F9/30 ,  G06F3/00 ,  G06F3/01 ,  G06F3/0354 ,  G06F3/0346 ,  G06F3/038 ,  G06F3/0484 ,  G06F1/1652 ,  G06F1/1681 ,  H04M1/0216 ,  H04M1/0237 ,  H04M1/0268 ,  H05K1/028 ,  H05K1/148 ,  H05K2201/10128 ,  H05K2201/10151 ,  H05K2201/10159

Abstract: 본 발명은 폴딩 하우징 및 슬라이딩 하우징이 슬라이딩 방향으로 이동함으로써 전자 장치의 디스플레이 영역이 확장 또는 축소되는 슬라이딩 동작, 및 상기 폴딩 하우징이 상기 슬라이딩 하우징에 대해 접히거나 펼쳐짐으로써, 디스플레이 영역의 일부가 접히거나 펼쳐지는 폴딩 동작이 가능하도록 구성된 전자 장치가 개시된다.

公开(公告)号：WO2021201902A1

公开(公告)日：2021-10-07

申请号：PCT/US2020/038840

申请日：2020-06-20

Applicant: WESTERN DIGITAL TECHNOLOGIES, INC.

Inventor： CHEW, David W.

IPC: G11B33/12 ,  H05K1/18 ,  G11B21/02 ,  G11B23/087 ,  G11B25/06 ,  G06F13/40 ,  G06F1/18 ,  G11B15/1808 ,  G11B15/1883 ,  G11B15/32 ,  G11B5/00813 ,  G11B5/00817 ,  G11B5/4893 ,  H01R12/716 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10545

Abstract: A storage system can include a first tape storage drive (TSD), a second TSD, and a printed circuit board assembly (PCBA) where the first and second TSD are coupled back-to-back, with the PCBA between the two. The first TSD can include a first enclosure, a first head assembly, a first actuator, and a first connector. The second TSD can include a second enclosure, a second head assembly, a second actuator, and a second connector. The PCBA can include a first side having a first mating connector configured to connect to the first connector for the first TSD, a second side opposite the first side, the second side having a second mating connector configured to connect to the second connector for the second TSD, and a controller configured to control activation of the first actuator of the first TSD and the second actuator of the second TSD.

公开(公告)号：WO2021025743A2

公开(公告)日：2021-02-11

申请号：PCT/US2020/031248

申请日：2020-05-04

Applicant: MICROSOFT TECHNOLOGY LICENSING, LLC

Inventor： MONROE, Mark A. ,  BELADY, Christian L.

IPC: G06F1/20 ,  F17C13/00 ,  G11C11/44 ,  H01L23/44 ,  H01L39/00 ,  H05K1/02 ,  H05K1/14 ,  G06F2200/201 ,  H01L23/445 ,  H01L27/18 ,  H05K1/0203 ,  H05K1/0272 ,  H05K1/141 ,  H05K1/181 ,  H05K2201/042 ,  H05K2201/064 ,  H05K2201/10159 ,  H05K7/20236

Abstract: Superconducting computing system housed in a liquid hydrogen environment and related aspects are described. An example superconducting computing system includes a housing, arranged inside a liquid hydrogen environment, where a lower pressure is maintained inside the housing than a pressure outside the housing. The superconducting computing system further includes a substrate, arranged inside the housing, having a surface, where a plurality of components attached to the surface is configured to provide at least one of a computing or a storage functionality, and the substrate further comprises a plurality of circuit traces for interconnecting at least a subset of the plurality of the components. The housing is configured such that each of the plurality of components is configured to operate at a first temperature, where the first temperature is below 4.2 Kelvin, despite the liquid hydrogen environment having a second temperature greater than 4.2 Kelvin.